JPH0339851U - - Google Patents
Info
- Publication number
- JPH0339851U JPH0339851U JP9988589U JP9988589U JPH0339851U JP H0339851 U JPH0339851 U JP H0339851U JP 9988589 U JP9988589 U JP 9988589U JP 9988589 U JP9988589 U JP 9988589U JP H0339851 U JPH0339851 U JP H0339851U
- Authority
- JP
- Japan
- Prior art keywords
- plate member
- resin
- island
- seals
- mounting area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9988589U JPH0339851U (pl) | 1989-08-29 | 1989-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9988589U JPH0339851U (pl) | 1989-08-29 | 1989-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0339851U true JPH0339851U (pl) | 1991-04-17 |
Family
ID=31648917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9988589U Pending JPH0339851U (pl) | 1989-08-29 | 1989-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0339851U (pl) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63114151A (ja) * | 1986-10-31 | 1988-05-19 | Toshiba Corp | 樹脂封止型半導体装置 |
-
1989
- 1989-08-29 JP JP9988589U patent/JPH0339851U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63114151A (ja) * | 1986-10-31 | 1988-05-19 | Toshiba Corp | 樹脂封止型半導体装置 |