JPH0339843U - - Google Patents
Info
- Publication number
- JPH0339843U JPH0339843U JP23790U JP23790U JPH0339843U JP H0339843 U JPH0339843 U JP H0339843U JP 23790 U JP23790 U JP 23790U JP 23790 U JP23790 U JP 23790U JP H0339843 U JPH0339843 U JP H0339843U
- Authority
- JP
- Japan
- Prior art keywords
- periphery
- plan
- view
- semiconductor
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23790U JPH0339843U (en18) | 1989-01-10 | 1990-01-06 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP89589 | 1989-01-10 | ||
| JP23790U JPH0339843U (en18) | 1989-01-10 | 1990-01-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0339843U true JPH0339843U (en18) | 1991-04-17 |
Family
ID=31716960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23790U Pending JPH0339843U (en18) | 1989-01-10 | 1990-01-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0339843U (en18) |
-
1990
- 1990-01-06 JP JP23790U patent/JPH0339843U/ja active Pending