JPH0339550U - - Google Patents
Info
- Publication number
- JPH0339550U JPH0339550U JP10072489U JP10072489U JPH0339550U JP H0339550 U JPH0339550 U JP H0339550U JP 10072489 U JP10072489 U JP 10072489U JP 10072489 U JP10072489 U JP 10072489U JP H0339550 U JPH0339550 U JP H0339550U
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- porous ceramic
- ceramic layer
- thermal head
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は一実施例を用いたサーマルヘツドを示
す断面図、第２図は従来のサーマルヘツドを示す
断面図、第３図は一実施例と従来例を比較する印
字特性の図である。
２……セラミツク基板、６……発熱抵抗体、８
ａ，８ｂ……電極、１０……保護膜、１２……多
孔質セラミツク層、１４……グレーズ層。
FIG. 1 is a sectional view showing a thermal head using an embodiment, FIG. 2 is a sectional view showing a conventional thermal head, and FIG. 3 is a diagram of printing characteristics comparing the embodiment and the conventional example. 2...Ceramic substrate, 6...Heating resistor, 8
a, 8b... Electrode, 10... Protective film, 12... Porous ceramic layer, 14... Glaze layer.
Claims (1)
その多孔質セラミツク層上にガラス質のグレーズ
層が形成されているサーマルヘツド用基板。 (2) 多孔質セラミツク層の厚さが５μｍから３
０μｍの範囲、グレーズ層の厚さが３０μｍ以下
である請求項１記載のサーマルヘツド用基板。[Claims for Utility Model Registration] (1) A porous ceramic layer is formed on a substrate,
A thermal head substrate with a glassy glaze layer formed on the porous ceramic layer. (2) The thickness of the porous ceramic layer is 5 μm to 3 μm.
2. The thermal head substrate according to claim 1, wherein the glaze layer has a thickness in the range of 0 μm and a thickness of 30 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10072489U JPH0339550U (en) | 1989-08-28 | 1989-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10072489U JPH0339550U (en) | 1989-08-28 | 1989-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0339550U true JPH0339550U (en) | 1991-04-16 |
Family
ID=31649712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10072489U Pending JPH0339550U (en) | 1989-08-28 | 1989-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0339550U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009054622A (en) * | 2007-08-23 | 2009-03-12 | Japan Aviation Electronics Industry Ltd | Clip |
-
1989
- 1989-08-28 JP JP10072489U patent/JPH0339550U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009054622A (en) * | 2007-08-23 | 2009-03-12 | Japan Aviation Electronics Industry Ltd | Clip |