JPH0338344A - Preparation of paper base material epoxy resin laminated sheet - Google Patents
Preparation of paper base material epoxy resin laminated sheetInfo
- Publication number
- JPH0338344A JPH0338344A JP17343589A JP17343589A JPH0338344A JP H0338344 A JPH0338344 A JP H0338344A JP 17343589 A JP17343589 A JP 17343589A JP 17343589 A JP17343589 A JP 17343589A JP H0338344 A JPH0338344 A JP H0338344A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- base material
- paper base
- maleic anhydride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 27
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 27
- 239000000463 material Substances 0.000 title claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 28
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 20
- 235000015112 vegetable and seed oil Nutrition 0.000 claims abstract description 17
- 239000008158 vegetable oil Substances 0.000 claims abstract description 17
- 238000001035 drying Methods 0.000 claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 7
- 239000002383 tung oil Substances 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims 1
- 238000004080 punching Methods 0.000 abstract description 8
- 239000000126 substance Substances 0.000 abstract description 8
- 238000013329 compounding Methods 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 2
- 230000009257 reactivity Effects 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000000123 paper Substances 0.000 description 17
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 239000002655 kraft paper Substances 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 235000021388 linseed oil Nutrition 0.000 description 2
- 239000000944 linseed oil Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 240000004307 Citrus medica Species 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は紙基材エポキ 関する。[Detailed description of the invention] [Industrial application field] The present invention is based on paper-based epoxy related.
シ樹脂積層板の製造法に
〔従来の技術〕
紙基材エポキシ樹脂積層板の打抜加工性を改善するため
、従来より樹脂の可撓化が検討されている。Method for manufacturing resin laminates [Prior art] In order to improve the punching processability of paper-based epoxy resin laminates, efforts have been made to make the resin flexible.
樹脂を可撓化するために用いる可撓剤には樹脂と反応せ
ず、ただ分散しているだけの添加型可撓剤及び樹脂と反
応して結合する反応型可撓剤がある。Flexibilizers used to make resin flexible include additive-type flexibilizers that do not react with the resin and are merely dispersed therein, and reactive-type flexibilizers that react with and bond with the resin.
添加型可撓剤を用いる可撓化方法としては可撓剤として
ジブチルフタレート、ジオクチルフタレート等を用いる
方法がある。しかし、この方法は可撓剤が樹脂と反応し
ないため、樹脂硬化物の耐熱性、耐薬品性が低下する傾
向がある。従って、積層板の耐熱性、耐薬品性が不十分
であった。Examples of the flexibility method using an additive type flexibilizing agent include a method using dibutyl phthalate, dioctyl phthalate, etc. as the flexibilizing agent. However, in this method, since the flexibilizing agent does not react with the resin, the heat resistance and chemical resistance of the cured resin product tend to decrease. Therefore, the heat resistance and chemical resistance of the laminate were insufficient.
一方、反応型可撓剤を用いる可撓化方法としては可撓剤
としてダイマー酸及びダイマー酸誘導体等を用いる方法
がある。しかし、この方法は可撓剤が樹脂と反応するた
め、積層板の耐熱性、耐薬品性の低下はないものの、可
撓化が十分でなく、積層板の打抜加工性も不十分であっ
た。On the other hand, as a flexibility method using a reactive flexibilizer, there is a method in which dimer acid, dimer acid derivatives, etc. are used as the flexibilizer. However, in this method, the flexibilizing agent reacts with the resin, so although the heat resistance and chemical resistance of the laminate do not deteriorate, the flexibility is not sufficient and the punching processability of the laminate is also insufficient. Ta.
本発明は、耐熱性、耐薬品性、打抜加工性に優れた紙基
材エポキシ樹脂積層板の製造法を提供するものである。The present invention provides a method for manufacturing a paper-based epoxy resin laminate having excellent heat resistance, chemical resistance, and punching workability.
本発明は可撓性の大きい桐油などの乾性植物油に無水マ
レイン酸を反応させて、エポキシ樹脂と反応する官能基
を導入し、反応型の可撓剤とするものである。In the present invention, a highly flexible drying vegetable oil such as tung oil is reacted with maleic anhydride to introduce a functional group that reacts with an epoxy resin, thereby producing a reactive flexibility agent.
すなわち、本発明は乾性植物油と無水マレイン酸との反
応物にエポキシ樹脂を配合して得た樹脂を紙基材の塗工
用樹脂として用いることを特徴とする紙基材エポキシ樹
脂積層板の製造法を提供するものである。That is, the present invention relates to the production of a paper-based epoxy resin laminate, characterized in that a resin obtained by blending an epoxy resin with a reaction product of drying vegetable oil and maleic anhydride is used as a coating resin for a paper base material. It provides law.
乾性植物油としてはアマニ油、エノ柚、桐油、脱水ヒマ
シ油などがあるが、価格、供給安定性、無水マレイン酸
との反応性などから桐油が好ましい。Examples of drying vegetable oils include linseed oil, citrus citron, tung oil, and dehydrated castor oil, but tung oil is preferred from the viewpoint of price, supply stability, reactivity with maleic anhydride, and the like.
乾性植物油と無水マレイン酸との反応比率、反応の温度
、時間条件は特にない。標準的な条件としては１００°
Ｃ１３０分〜１時間である。反応触媒も特に限定するも
のではない。上記反応条件であると無触媒でも反応は進
む。There are no particular reaction ratios between drying vegetable oil and maleic anhydride, reaction temperature, and time conditions. The standard condition is 100°
C130 minutes to 1 hour. The reaction catalyst is also not particularly limited. Under the above reaction conditions, the reaction proceeds even without a catalyst.
桐油の重合を防止するためにハイドロキノンなどの重合
禁止剤の添加が好ましい。In order to prevent polymerization of tung oil, it is preferable to add a polymerization inhibitor such as hydroquinone.
乾性植物油と無水マレイン酸の比率は乾性植物油１ｍｏ
ｌ に対して無水マレイン酸０．３３〜９． Ｑｍｏｌ
が好ましい。０．３３ｍｏ１未満であると無水マレイン
酸と反応していない乾性植物油が多くなり、添加型の可
撓剤となる成分が多量に存在することになる。従って、
積層板の耐熱性、耐薬品性が低下、する。一方、９．Ｑ
ｍｏｌ を超えると無水マレイン酸基と反応するエポキ
シ樹脂の量が多くなるため、可撓性を発現させるのに必
要な乾性植物油の使用量が少なくなる。従って、積層板
の打抜加工性の改善に効果が小さくなる。The ratio of dry vegetable oil and maleic anhydride is 1 mo of dry vegetable oil.
l of maleic anhydride from 0.33 to 9. Qmol
is preferred. If it is less than 0.33 mo1, there will be a large amount of dry vegetable oil that has not reacted with maleic anhydride, and a large amount of components that will become an additive type flexibilizer will be present. Therefore,
The heat resistance and chemical resistance of the laminate deteriorate. On the other hand, 9. Q
If it exceeds mol, the amount of epoxy resin that reacts with maleic anhydride groups increases, and therefore the amount of drying vegetable oil required to develop flexibility decreases. Therefore, the effect on improving the punching workability of the laminate becomes small.
本発明に用いるエポキシ樹脂としては、ビスフェノール
Ａ型エポキシ樹脂、テトラブロモビスフェノールＡ型エ
ポキシ樹脂等のビスフェノールＡ型エポキシ樹脂：フェ
ノールノボラック型エポキシ樹脂、クレゾールノボラッ
ク型エポキシ樹脂、ブロム化フェノールノボラック型エ
ポキシ樹脂等のフェノールノボラック型エポキシ樹脂；
エチレングリコール、プロピレングリコール、ポリエチ
レングリコール等とエピクロルヒドリン等のエピハロヒ
ドリンとの反応物のような多価アルコールのポリグリシ
ジルエーテル類；アジピン酸、フタル酸、ダイマー酸の
ようなポリカルボン酸のポリグリシジルエステル類等が
挙げられる。Epoxy resins used in the present invention include bisphenol A epoxy resins such as bisphenol A epoxy resins and tetrabromobisphenol A epoxy resins; phenol novolak epoxy resins, cresol novolak epoxy resins, brominated phenol novolak epoxy resins, etc. phenolic novolac type epoxy resin;
Polyglycidyl ethers of polyhydric alcohols such as reaction products of ethylene glycol, propylene glycol, polyethylene glycol, etc. and epihalohydrin such as epichlorohydrin; polyglycidyl esters of polycarboxylic acids such as adipic acid, phthalic acid, dimer acid, etc. can be mentioned.
エポキシ樹脂と無水マレイン酸との比率は無水マレイン
酸１ｍｏｌ に対して、エポキシ基０．８〜６゜Ｑｍｏ
ｌが好ましい。０．８ｍｏ１未満であると酸基が多量に
残存するため、積層板の電気特性が低下する。５．Ｑｍ
ｏｌを超えると、乾性植物油の使用量が少なくなり、積
層板の打抜加工性の改善に効果が小さくなる。The ratio of epoxy resin and maleic anhydride is 0.8 to 6゜Qmo of epoxy groups per 1 mol of maleic anhydride.
l is preferred. If it is less than 0.8 mo1, a large amount of acid groups will remain, and the electrical properties of the laminate will deteriorate. 5. Qm
If it exceeds ol, the amount of drying vegetable oil used will be small, and the effect on improving the punching workability of the laminate will be small.
乾性植物油と無水マレイン酸との反応物にエポキシ樹脂
を配合して得た樹脂には必要に応し硬化促進剤を使用す
ることが好ましい。硬化促進剤としては、トリエチルア
ミン、トリブチルアミン、ベンジルジメチルアミンなど
の３級アミン、イミダゾール、２−エチル−４−メチル
イミタプールなどのイミダゾール化合物などがあるが、
その他無水酸とエポキシ樹脂との反応促進剤であれば、
いずれも使用が可能である。It is preferable to use a curing accelerator, if necessary, in the resin obtained by blending an epoxy resin with a reaction product of drying vegetable oil and maleic anhydride. Examples of curing accelerators include tertiary amines such as triethylamine, tributylamine, and benzyldimethylamine, and imidazole compounds such as imidazole and 2-ethyl-4-methyl imitapool.
If it is a reaction accelerator between acid anhydride and epoxy resin,
Both can be used.
その他、難燃剤、充てん剤等も特性の低下をきたさない
範囲内での使用はなんら支障はない。In addition, there is no problem in using flame retardants, fillers, etc. as long as the properties do not deteriorate.
紙基材としてはクラフト紙、リンク紙及びそれらの混抄
紙、又は合成繊維及び充てん剤との混抄紙等が使用可能
である。As the paper base material, kraft paper, link paper, mixed paper thereof, paper mixed with synthetic fibers and fillers, etc. can be used.
紙基材にフェノール樹脂、メラミン樹脂及びそれらの混
合物又は共縮合樹脂を下処理して使用することもできる
。It is also possible to use a paper base material after pretreatment with a phenol resin, a melamine resin, a mixture thereof, or a cocondensation resin.
本発明の塗工用樹脂を紙基材に塗工する際には、無溶剤
で塗工することも、溶剤で希釈して塗工することも何れ
も可能であり、常法にまり紙基材に塗工が行われる。When applying the coating resin of the present invention to a paper base material, it is possible to apply it without a solvent or after diluting it with a solvent. Coating is applied to the material.
得られた塗工基材を加熱加圧成形することにより、目的
とするエポキシ樹脂積層板が得られる。The desired epoxy resin laminate is obtained by heat-pressing the obtained coated base material.
以下、本発明を実施例に基づいて詳細に説明するが、本
発明はこれに限定されるものではない。Hereinafter, the present invention will be explained in detail based on Examples, but the present invention is not limited thereto.
樹脂の合成及び配合
樹脂Ａ
冷却管、撹拌機、温度計を備えた反応容器に桐油９００
ｇ、 無水マレイン酸３００ ｇ、ハイドロキノン１
．８ｇを入れ、１００°Ｃで３０分反応させ冷却後エピ
コート８２８（油化シェル■製）１１６０ｇ、２−エチ
ル−４−メチルイミダゾール２４ｇを入れ室温で混合し
、溶解させ、樹脂Ａを得た。Synthesis and compounding of resin Resin A Add 900 ml of tung oil to a reaction vessel equipped with a cooling tube, stirrer, and thermometer.
g, maleic anhydride 300 g, hydroquinone 1
．． After cooling, 1160 g of Epicote 828 (manufactured by Yuka Shell ■) and 24 g of 2-ethyl-4-methylimidazole were added and mixed and dissolved at room temperature to obtain resin A.
樹脂Ｂ
冷却管、攪拌機、温度計を備えた反応容器にアマニ油９
００ ｇ、無水マレイン酸３００ｇ、ハイドロキノン１
．８ｇを入れ、１００°Ｃで３０分反応させ冷却後、ア
セトン１０００ｇ、ＥＳ８４００Ｔ（住友化学■製）２
４４０ｇ、ベンジルジメチルアミン３６ｇを入れ、室温
で混合し、熔解させ、樹脂Ｂを得た。Resin B Add linseed oil 9 to a reaction vessel equipped with a cooling tube, stirrer, and thermometer.
00 g, maleic anhydride 300 g, hydroquinone 1
．． Pour 8g of ES8400T (manufactured by Sumitomo Chemical) 2 after cooling and reacting at 100°C for 30 minutes.
440 g and 36 g of benzyldimethylamine were added, mixed at room temperature, and melted to obtain Resin B.
樹脂Ｃ
冷却管、攪拌機、温度計を備えた反応容器に、無水マレ
イン酸３００ｇ、エピコート８２８ １１６０ ｇ、ア
セトン１６００ｇ、２−エチル−４メチルイ貴ダゾ一ル
１５ｇを入れ室温で混合し、溶解させ樹脂Ｃを得た。Resin C: Put 300 g of maleic anhydride, 1160 g of Epicote 828, 1600 g of acetone, and 15 g of 2-ethyl-4-methyl noble dazol into a reaction vessel equipped with a cooling tube, stirrer, and thermometer, mix at room temperature, and dissolve the resin. I got a C.
積層板の製造
実施例１
フェノール樹脂で処理した厚み０．２５ ｎｕｎのクラ
フト紙に樹脂Ａを付着樹脂分が６５％になるように塗布
して塗工紙を得た。この塗工紙を８枚重ね合わせた後、
１７０°Ｃ１３０分、金型を用い、加熱加圧成形し積層
板を得た。Manufacturing Example 1 of Laminate Board Resin A was applied to 0.25 nm thick kraft paper treated with phenol resin so that the adhesion resin content was 65% to obtain a coated paper. After stacking 8 sheets of this coated paper,
A laminate was obtained by heat-pressing molding at 170° C. for 130 minutes using a mold.
実施例２
フェノール樹脂で処理した厚み０．２５ ｍｍのクラフ
ト紙に樹脂Ｂを塗布した後、乾燥して溶剤のアセトンを
除去し塗工紙を得た。付着樹脂分は６０％であった。Example 2 Resin B was applied to a 0.25 mm thick kraft paper treated with a phenol resin, and then dried to remove the solvent acetone to obtain a coated paper. The adhering resin content was 60%.
この塗工紙を実施例１と同様にして成形し、積層板を得
た。This coated paper was molded in the same manner as in Example 1 to obtain a laminate.
比較例
実施例２と同じ処理クラフト紙に樹脂Ｃを塗布した後、
乾燥して溶剤のアセトンを除去して、付着樹脂分６３％
の塗工紙を得た。この塗工紙を実施例１と同様に成形し
、積層板を得た。Comparative Example After applying resin C to the same treated kraft paper as in Example 2,
After drying and removing the solvent acetone, the adhesion resin content was 63%.
A coated paper was obtained. This coated paper was molded in the same manner as in Example 1 to obtain a laminate.
表１に積層板の特性を示す。Table 1 shows the properties of the laminate.
打抜加工性の試験方法、評価法はＡＳＴＭＯ６１７−７
５に準拠した。The test method and evaluation method for punching workability is ASTMO617-7.
Compliant with 5.
表１に示した結果からも明らかなように、本発明によれ
ば、耐熱性、耐薬品性の低下がなく打抜加工性に優れた
積層板の提供が可能となった。As is clear from the results shown in Table 1, according to the present invention, it has become possible to provide a laminate with excellent punching workability without deterioration in heat resistance and chemical resistance.
Claims (1)
樹脂を配合して得た樹脂を紙基材の塗工用樹脂として用
いることを特徴とする紙基材エポキシ樹脂積層板の製造
法。 ２、乾性植物油が桐油である請求項１記載の紙基材エポ
キシ樹脂積層板の製造法。[Claims] 1. Paper base epoxy resin lamination, characterized in that a resin obtained by blending an epoxy resin with a reaction product of drying vegetable oil and maleic anhydride is used as a coating resin for the paper base material. Method of manufacturing boards. 2. The method for producing a paper-based epoxy resin laminate according to claim 1, wherein the drying vegetable oil is tung oil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17343589A JPH0338344A (en) | 1989-07-05 | 1989-07-05 | Preparation of paper base material epoxy resin laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17343589A JPH0338344A (en) | 1989-07-05 | 1989-07-05 | Preparation of paper base material epoxy resin laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0338344A true JPH0338344A (en) | 1991-02-19 |
Family
ID=15960413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17343589A Pending JPH0338344A (en) | 1989-07-05 | 1989-07-05 | Preparation of paper base material epoxy resin laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338344A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU693224B2 (en) * | 1994-06-28 | 1998-06-25 | Pratt Research & Development Pty Ltd | Coating for paperboard |
| WO2014010660A1 (en) | 2012-07-13 | 2014-01-16 | Ｊｆｅスチール株式会社 | Blast furnace operating method and tube bundle-type lance |
| KR20150108407A (en) | 2013-04-03 | 2015-09-25 | 제이에프이 스틸 가부시키가이샤 | Blast furnace operation method |
-
1989
- 1989-07-05 JP JP17343589A patent/JPH0338344A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU693224B2 (en) * | 1994-06-28 | 1998-06-25 | Pratt Research & Development Pty Ltd | Coating for paperboard |
| WO2014010660A1 (en) | 2012-07-13 | 2014-01-16 | Ｊｆｅスチール株式会社 | Blast furnace operating method and tube bundle-type lance |
| KR20150108407A (en) | 2013-04-03 | 2015-09-25 | 제이에프이 스틸 가부시키가이샤 | Blast furnace operation method |
| US9938593B2 (en) | 2013-04-03 | 2018-04-10 | Jfe Steel Corporation | Blast furnace operation method |
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