JPH0338327U - - Google Patents
Info
- Publication number
- JPH0338327U JPH0338327U JP9862689U JP9862689U JPH0338327U JP H0338327 U JPH0338327 U JP H0338327U JP 9862689 U JP9862689 U JP 9862689U JP 9862689 U JP9862689 U JP 9862689U JP H0338327 U JPH0338327 U JP H0338327U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- plan
- showing
- cross
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 description 2
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Confectionery (AREA)
Description
第１図は、この考案の概念を示し、その要部の
側面よりの断面を示す平面図。第２図は、この考
案の第１実施例の側面よりの断面を示す平面図。
第３図は、この考案の第２実施例を要部の側面よ
りの断面を示す平面図。第４図は、この考案の第
３実施例の要部の側面よりの断面を示す平面図。
１……下金型、２……基端部、４，１８……鍔
、５……下金型支持体、６，１０……凹部、９…
…主軸、１１，１９……孔、１３……上金型、１
７……上金型支持体、２０……基端部、２２……
成形室、２３……カバー、２４……溝、２５……
フランジ部（段部）、２６……段部。
FIG. 1 is a plan view illustrating the concept of this invention and showing a cross section of the main part from the side. FIG. 2 is a plan view showing a cross section from the side of the first embodiment of the invention.
FIG. 3 is a plan view showing a cross section of a main part of a second embodiment of the invention taken from the side. FIG. 4 is a plan view showing a cross section from the side of the main part of the third embodiment of the invention. DESCRIPTION OF SYMBOLS 1... Lower mold, 2... Base end, 4, 18... Flange, 5... Lower mold support, 6, 10... Recess, 9...
... Main shaft, 11, 19 ... Hole, 13 ... Upper mold, 1
7... Upper mold support, 20... Base end, 22...
Molding chamber, 23...cover, 24...groove, 25...
Flange portion (stepped portion), 26...stepped portion.
補正 平２．１０．１８
考案の名称を次のように補正する。
考案の名称 金型の保持装置
実用新案登録請求の範囲、図面の簡単な説明を
次のように補正する。Amendment 2.10.18 The name of the invention is amended as follows. Title of the invention: Mold holding device The claims for utility model registration and the brief description of the drawings are amended as follows.
【実用新案登録請求の範囲】
金型と金型支持体とを嵌合により固定する金型
保持装置において、金型または、金型支持体のう
ち内側に嵌合挿入する部材の熱膨張係数が外側の
部材の熱膨張係数より小なることを特徴とする金
型の保持装置。[Claims for Utility Model Registration] In a mold holding device that fixes a mold and a mold support by fitting, the coefficient of thermal expansion of a member of the mold or the mold support that is fitted and inserted inside A mold holding device characterized in that the coefficient of thermal expansion is smaller than that of an outer member.
【図面の簡単な説明】
第１図は、この考案の概念を示し、その要部の
側面よりの断面を示す平面図。第２図は、この考
案の第１実施例の側面よりの断面を示す平面図。
第３図は、この考案の第２実施例を要部の側面よ
りの断面を示す平面図。第４図は、この考案の第
３実施例の要部の側面よりの断面を示す平面図。
１……下金型、２，１４……先端部、４，１８
……鍔、５……下金型支持体、６，１０……凹部
、８，２０……基端部、９……主軸、１１，１９
……孔、１３……上金型、１７……上金型支持体
、２０……基端部、２２……成形室、２３……カ
バー、２４……溝、２５……フランジ部（段部）
、２６……段部。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view illustrating the concept of this invention and showing a cross section of the main parts from the side. FIG. 2 is a plan view showing a cross section from the side of the first embodiment of the invention.
FIG. 3 is a plan view showing a cross section of a main part of a second embodiment of the invention taken from the side. FIG. 4 is a plan view showing a cross section from the side of the main part of the third embodiment of the invention. 1... Lower mold, 2, 14... Tip part, 4, 18
...Brim, 5...Lower mold support, 6, 10...Concavity, 8,20...Base end, 9...Main shaft, 11,19
... Hole, 13 ... Upper mold, 17 ... Upper mold support, 20 ... Base end, 22 ... Molding chamber, 23 ... Cover, 24 ... Groove, 25 ... Flange part (step Department)
, 26...Danbe.
Claims (1)
保持装置において、金型または、金型支持体のう
ち内側に嵌合挿入する部材の熱膨張係数が外側の
部材の熱膨張係数より小なることを特徴とする金
型の保持装置。 In a mold holding device that fixes a mold and a mold support by fitting, the coefficient of thermal expansion of a member of the mold or the mold support that is fitted and inserted inside is higher than that of the outer member. A mold holding device characterized by being small.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9862689U JPH0532505Y2 (en) | 1989-08-24 | 1989-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9862689U JPH0532505Y2 (en) | 1989-08-24 | 1989-08-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0338327U true JPH0338327U (en) | 1991-04-12 |
| JPH0532505Y2 JPH0532505Y2 (en) | 1993-08-19 |
Family
ID=31647710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9862689U Expired - Lifetime JPH0532505Y2 (en) | 1989-08-24 | 1989-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0532505Y2 (en) |
-
1989
- 1989-08-24 JP JP9862689U patent/JPH0532505Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0532505Y2 (en) | 1993-08-19 |