JPH033756U

JPH033756U -

Info

Publication number: JPH033756U
Application number: JP6421289U
Authority: JP
Priority date: 1989-05-31
Filing date: 1989-05-31
Publication date: 1991-01-16
Anticipated expiration: 2004-05-31
Also published as: JPH0710501Y2

Description

[Brief explanation of drawings]

第１図は本考案第一実施例の光半導体装置の正
面図、第２図は第１図のＤ−Ｄ断面図、第３図は
同じくそのＥ−Ｅ断面図、第４図は同じくその背
面図、第５図ａは透光樹脂体の正面図、第５図ｂ
は同じくその側面図、第５図ｃは同じくその平面
図、第５図ｄは同じくその背面図、第６図ａは外
装ケースの正面図、第６図ｂは同じくその側面図
、第６図ｃは同じくその平面図、第６図ｄは同じ
くその背面図、第６図ｅは同じくその底面図であ
る。第７図ａは本考案第二実施例の光半導体装置
の透光樹脂体の正面図、第７図ｂは同じくその側
面図、第７図ｃは同じくその平面図、第７図ｄは
同じくその背面図、第８図ａは外装ケースの正面
図、第８図ｂは同じくその側面図、第８図ｃは同
じくその平面図、第８図ｄは同じくその背面図、
第８図ｅは同じくその底面図、第９図は光半導体
装置を多連式にした状態を示す図である。第１０
図は本考案第三実施例の光半導体装置の正面図、
第１１図は第１０図の−断面図、第１２図は
同じくそのＪ−Ｊ断面図、第１３図は同じくその
側面図、第１４図は同じくその背面図、第１５図
ａは透光樹脂体の正面図、第１５図ｂは同じくそ
の側面図、第１５図ｃは同じくその平面図、第１
５図ｄは同じくその背面図、第１６図ａは外装ケ
ースの正面図、第１６図ｂは同じくその側面図、
第１６図ｃは同じくその背面図、第１６図ｄは同
じくその底面図である。第１７図は従来の光半導
体装置の正面図、第１８図は第１７図のＡ−Ａ断
面図、第１９図は同じくそのＢ−Ｂ断面図、第２
０図は同じくその背面図、第２１図ａは透光樹脂
体の正面図、第２１図ｂは同じくその側面図、第
２１図ｃは同じくその平面図、第２１図ｄは同じ
くその背面図、第２２図ａは外装ケースの正面図
、第２２図ｂは同じくその側面図、第２２図ｃは
同じくその平面図、第２２図ｄは同じくその背面
図、第２２図ｅは同じくその底面図である。１……透光樹脂体、２……光半導体素子、３…
…熱硬化性樹脂、４……外装ケース、５……熱可
塑性樹脂、８……レンズ、２０……固定手段、２
１……凹部、２２……凸部。 FIG. 1 is a front view of the optical semiconductor device according to the first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line DD in FIG. 1, FIG. 3 is a cross-sectional view taken along line E-E, and FIG. The back view, Figure 5a is the front view of the transparent resin body, Figure 5b
is also a side view thereof, FIG. 5c is a top view thereof, FIG. 5d is a rear view thereof, FIG. 6c is a plan view thereof, FIG. 6d is a rear view thereof, and FIG. 6e is a bottom view thereof. 7a is a front view of the transparent resin body of the optical semiconductor device according to the second embodiment of the present invention, FIG. 7b is a side view thereof, FIG. 7c is a plan view thereof, and FIG. 7d is the same. 8a is a front view of the outer case, FIG. 8b is a side view thereof, FIG. 8c is a plan view thereof, and FIG. 8d is a rear view thereof,
FIG. 8e is a bottom view of the same, and FIG. 9 is a diagram showing a state in which the optical semiconductor device is arranged in multiple units. 10th
The figure is a front view of an optical semiconductor device according to a third embodiment of the present invention.
Fig. 11 is a sectional view along the line J-J of Fig. 10, Fig. 12 is a J-J sectional view, Fig. 13 is a side view, Fig. 14 is a rear view, and Fig. 15a is a translucent resin. The front view of the body, FIG. 15b is also a side view, and FIG. 15c is also a top view,
Figure 5 d is a rear view of the same, Figure 16 a is a front view of the outer case, Figure 16 b is a side view of the same,
FIG. 16c is a rear view thereof, and FIG. 16d is a bottom view thereof. FIG. 17 is a front view of a conventional optical semiconductor device, FIG. 18 is a sectional view taken along line AA in FIG. 17, FIG. 19 is a sectional view taken along line BB, and FIG.
Figure 0 is a rear view of the same, Figure 21a is a front view of the translucent resin body, Figure 21b is a side view of the same, Figure 21c is a plan view of the same, and Figure 21d is a rear view of the same. , Fig. 22a is a front view of the outer case, Fig. 22b is a side view thereof, Fig. 22c is a plan view thereof, Fig. 22d is a rear view thereof, and Fig. 22e is a bottom view thereof. It is a diagram. 1... Transparent resin body, 2... Optical semiconductor element, 3...
... Thermosetting resin, 4 ... Exterior case, 5 ... Thermoplastic resin, 8 ... Lens, 20 ... Fixing means, 2
1... Concave portion, 22... Convex portion.

Claims

[Scope of utility model registration request]

An optical semiconductor element, a transparent resin body formed by sealing the optical semiconductor element with a transparent thermosetting resin, and a light-shielding thermoplastic resin that holds and fixes the optical semiconductor element and is elastically deformable. and a fixing means for fixing the translucent resin body to the exterior case, the fixing means includes a recess formed in either the translucent resin body or the exterior case. and a convex portion formed on the other of the transparent resin body and the exterior case so as to fit into the concave portion.