JPH0336784U - - Google Patents
Info
- Publication number
- JPH0336784U JPH0336784U JP9490189U JP9490189U JPH0336784U JP H0336784 U JPH0336784 U JP H0336784U JP 9490189 U JP9490189 U JP 9490189U JP 9490189 U JP9490189 U JP 9490189U JP H0336784 U JPH0336784 U JP H0336784U
- Authority
- JP
- Japan
- Prior art keywords
- injection
- pressurized gas
- gas passage
- article
- passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Sheets, Magazines, And Separation Thereof (AREA)
Description
第1図は本考案の一実施例を示すブロツク図、
第2図は噴射筒の断面図、第3図は第2図の−
矢視図、第4図及び第5図は本考案の非接触保
持原理を説明するための作用状態図、第6図は非
接触保持部の詳細側面図、第7図は第6図の−
矢視図、第8図は本考案の適用例を示す斜視図
、第9図及び第10図は夫々噴射筒に形成する拡
大噴射口の他の形状例を示す断面図である。
1は非接触保持部、2は加圧気体管、3は加圧
気体源、4は制御弁、7は加圧気体通路、8は噴
射筒、9は噴射面、10は拡大噴射口、11は物
品、11′は表面、12は加圧気体、16は減圧
部、21はロボツト、24はガイド機構を示す。
FIG. 1 is a block diagram showing an embodiment of the present invention.
Figure 2 is a cross-sectional view of the injection tube, and Figure 3 is the − of Figure 2.
The arrow view, FIG. 4, and FIG. 5 are working state diagrams for explaining the non-contact holding principle of the present invention, FIG. 6 is a detailed side view of the non-contact holding part, and FIG. 7 is the - of FIG.
8 is a perspective view showing an example of application of the present invention, and FIGS. 9 and 10 are sectional views showing other examples of shapes of enlarged injection ports formed in the injection cylinder, respectively. 1 is a non-contact holding part, 2 is a pressurized gas pipe, 3 is a pressurized gas source, 4 is a control valve, 7 is a pressurized gas passage, 8 is an injection cylinder, 9 is an injection surface, 10 is an enlarged injection port, 11 11' is an article, 11' is a surface, 12 is a pressurized gas, 16 is a pressure reducing section, 21 is a robot, and 24 is a guide mechanism.
Claims (1)
射筒を備え、該噴射筒の端部に前記加圧気体通路
に直交する噴射面が形成され、且つ前記加圧気体
通路から前記噴射面に向けて通路が拡大する拡大
噴射口が形成されていて、噴射筒を保持すべき物
品の表面に近づけると噴射する気体により吸引力
が発生するようになつていることを特徴とする物
品の非接触保持装置。 An injection cylinder having a pressurized gas passage communicating with a pressurized gas source is provided, an injection surface perpendicular to the pressurized gas passage is formed at an end of the injection cylinder, and a jet surface is formed from the pressurized gas passage to the injection surface. An article characterized in that an enlarged injection port is formed with a passage expanding toward the object, and when the injection tube is brought close to the surface of the article to be held, a suction force is generated by the ejected gas. Contact holding device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9490189U JPH0336784U (en) | 1989-08-11 | 1989-08-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9490189U JPH0336784U (en) | 1989-08-11 | 1989-08-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0336784U true JPH0336784U (en) | 1991-04-10 |
Family
ID=31644183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9490189U Pending JPH0336784U (en) | 1989-08-11 | 1989-08-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0336784U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015126174A (en) * | 2013-12-27 | 2015-07-06 | 芝浦メカトロニクス株式会社 | Substrate holding device and substrate holding method |
-
1989
- 1989-08-11 JP JP9490189U patent/JPH0336784U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015126174A (en) * | 2013-12-27 | 2015-07-06 | 芝浦メカトロニクス株式会社 | Substrate holding device and substrate holding method |