JPH0336139U - - Google Patents
Info
- Publication number
- JPH0336139U JPH0336139U JP9679689U JP9679689U JPH0336139U JP H0336139 U JPH0336139 U JP H0336139U JP 9679689 U JP9679689 U JP 9679689U JP 9679689 U JP9679689 U JP 9679689U JP H0336139 U JPH0336139 U JP H0336139U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- coining
- heat dissipation
- dissipation fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9679689U JPH0336139U (hu) | 1989-08-18 | 1989-08-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9679689U JPH0336139U (hu) | 1989-08-18 | 1989-08-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0336139U true JPH0336139U (hu) | 1991-04-09 |
Family
ID=31645977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9679689U Pending JPH0336139U (hu) | 1989-08-18 | 1989-08-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0336139U (hu) |
-
1989
- 1989-08-18 JP JP9679689U patent/JPH0336139U/ja active Pending