JPH0335486U - - Google Patents
Info
- Publication number
- JPH0335486U JPH0335486U JP9662189U JP9662189U JPH0335486U JP H0335486 U JPH0335486 U JP H0335486U JP 9662189 U JP9662189 U JP 9662189U JP 9662189 U JP9662189 U JP 9662189U JP H0335486 U JPH0335486 U JP H0335486U
- Authority
- JP
- Japan
- Prior art keywords
- probe
- lead wire
- holding hole
- base block
- guide plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
本考案の実施例の第１図ａ〜ｆは本考案の実施
例によるプローブ挿入工程を示す図、第２図はプ
ローブ装着機構の平面図、第３図は第２図の−
線断面図である。
１……ＩＣ、１ａ……リード線、２……プロー
ブ、３……プローブ保持穴、４，５……ガイドプ
レート、６……リード線ガイド溝、７……ベース
ブロツク、８……リフターピン、９……リフター
スプリング、１０……ガイドプレート保持板、１
１……ストツパピン、１２……圧縮スプリング、
１３……ストツパプレート、１４，１５……長溝
。
1A to 1F of the embodiment of the present invention are diagrams showing the probe insertion process according to the embodiment of the present invention, FIG. 2 is a plan view of the probe mounting mechanism, and FIG.
FIG. 1...IC, 1a...lead wire, 2...probe, 3...probe holding hole, 4, 5...guide plate, 6...lead wire guide groove, 7...base block, 8...lifter pin , 9... Lifter spring, 10... Guide plate holding plate, 1
1... Stopper pin, 12... Compression spring,
13... Stopper plate, 14, 15... Long groove.
Claims (1)
記ベースブロツク上にかつ前記プローブ保持穴を
はさんでその両側位置に開閉可能に保持された一
対のガイドプレートと、前記プローブ保持穴に対
応した位置で前記ガイドプレートの各対向縁部に
形成されたＩＣリード線ガイド溝と、前記ガイド
プレートの位置決め・ストツパ機構と、前記プロ
ーブ保持穴に挿入されたＩＣを抜き出すエジエク
タ部材とを有し、前記プローブ保持穴にプローブ
を挿入した状態でＩＣリード線を前記ＩＣリード
線ガイド溝に沿つて該プローブに挿入することを
特徴とするＩＣのプローブ装着機構。 a base block having a probe holding hole; a pair of guide plates held on both sides of the base block so as to be openable and closable across the probe holding hole; The guide plate has an IC lead wire guide groove formed on each opposing edge, a positioning/stopper mechanism for the guide plate, and an ejector member for extracting an IC inserted into the probe holding hole. An IC probe mounting mechanism characterized in that an IC lead wire is inserted into the probe along the IC lead wire guide groove with the probe inserted into the probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9662189U JPH0335486U (en) | 1989-08-18 | 1989-08-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9662189U JPH0335486U (en) | 1989-08-18 | 1989-08-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0335486U true JPH0335486U (en) | 1991-04-08 |
Family
ID=31645813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9662189U Pending JPH0335486U (en) | 1989-08-18 | 1989-08-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0335486U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008194583A (en) * | 2007-02-09 | 2008-08-28 | Tokyo Electric Power Co Inc:The | Defoaming block fence |
-
1989
- 1989-08-18 JP JP9662189U patent/JPH0335486U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008194583A (en) * | 2007-02-09 | 2008-08-28 | Tokyo Electric Power Co Inc:The | Defoaming block fence |
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