JPH0334913Y2 - - Google Patents
Info
- Publication number
- JPH0334913Y2 JPH0334913Y2 JP1984187130U JP18713084U JPH0334913Y2 JP H0334913 Y2 JPH0334913 Y2 JP H0334913Y2 JP 1984187130 U JP1984187130 U JP 1984187130U JP 18713084 U JP18713084 U JP 18713084U JP H0334913 Y2 JPH0334913 Y2 JP H0334913Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- resin
- semiconductor chip
- sealing resin
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- 238000007789 sealing Methods 0.000 claims description 10
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000000465 moulding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984187130U JPH0334913Y2 (US07696358-20100413-C00002.png) | 1984-12-10 | 1984-12-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984187130U JPH0334913Y2 (US07696358-20100413-C00002.png) | 1984-12-10 | 1984-12-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61102048U JPS61102048U (US07696358-20100413-C00002.png) | 1986-06-28 |
| JPH0334913Y2 true JPH0334913Y2 (US07696358-20100413-C00002.png) | 1991-07-24 |
Family
ID=30744595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984187130U Expired JPH0334913Y2 (US07696358-20100413-C00002.png) | 1984-12-10 | 1984-12-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334913Y2 (US07696358-20100413-C00002.png) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225905Y2 (US07696358-20100413-C00002.png) * | 1981-04-30 | 1987-07-02 |
-
1984
- 1984-12-10 JP JP1984187130U patent/JPH0334913Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61102048U (US07696358-20100413-C00002.png) | 1986-06-28 |
