JPH0334818A - Pressure molding apparatus - Google Patents

Abstract

PURPOSE:To enable the change of a molding die to carrying out readily by raising the molding die by a raising means, and providing a gap between the molding die and mounting platen. CONSTITUTION:On a mounting platen 7, a set of upper and lower molding die comprising an upper die 35 and lower die 37 is placed, and the lower die 37 is secured to the mounting platen 7 by screws 38. When a rod 22 is pushed out, the mounting platen 7 slides on a guide rail 23 in the direction of B and transported above a raising mechanism. Herein, the screws 38 are disconnected and a rods 28 are raised in order that rolling balls 33 and supporting parts 31 are passed through holes 6, and thus the rolling balls 33 are brought into contact with the bottom surface of the lower die 37, and further the rod 28 is raised until the upper surface of a supporting platen 29 comes into contact with the bottom surface of the mounting platen 7. At this time, there appears a gap between the lower die 37 and mounting platen 7. For instance, a lift platen joined to a lift is inserted to this gap and raised and moved together with the lower die 37 and upper die 35, they can be changed readily for other molding die.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a pressure molding apparatus that brings an O-link or the like to JJII pressure or 1, for example.

(Prior art) As a pressure molding device, a mold is placed on a mounting plate,
The mold is airtightly surrounded by the upper frame and the mounting plate, and the space formed by the two frames and the mounting plate is compressed by a depressurizing means. Pressure jJ
It is known that a mold is pressurized and heated by an RL heating section.

In such a pressure molding apparatus, the upper mold of a pair of upper and lower molds placed at a predetermined position is raised, the material is placed on the lower mold, and then the upper mold is lowered and placed on the lower mold. The upper 11 sets of stacked molds are taken into the pressurizing section. Then, the mold that has been subjected to the pressure and heat treatment in this pressure and heat section is sent out to the predetermined position, the second mold is raised again, the element +g that has been subjected to the pressure and heat treatment is taken out, and a new cumulative month is formed. It was placed on the lower mold, and the same process was repeated thereafter.

By the way, when replacing the mold used in a pressure molding device like this with another mold, the pair of molds sent out from the pressure heating section to a predetermined position must be manually held.
It was burnt and had to be removed from the main body.

However, it is rare for this type of mold to weigh around 1,000 kg (it takes a lot of effort and weighs about 11S to manually remove it).

In addition, in the above-mentioned pressure molding apparatus, in order to airtightly seal the mold with the upper frame and the mounting plate, it is necessary that the end face of the upper frame and the mounting plate are in airtight contact. be. Therefore, in the past, by moving the two frames in the vertical direction using a partial cylinder, etc., changes in the position of the mounting plate were handled by
In response, I made sure that the two frames and the mounting plate were in airtight contact.

However, such a pressure molding apparatus requires a special device to move the upper frame, resulting in high manufacturing costs. In addition, strict dimensional accuracy was required to ensure airtight contact between the end face of the upper frame and the mounting plate.

Furthermore, in the processing and forming apparatus as described in ``2'', the pressure is rapidly reduced by the pressure reducing means. Therefore, the mold suddenly collides with the pressurizing and heating means installed in the upper frame, and this impact causes deterioration of the material.
In addition, the machine die had to be made stronger, which increased the production cost of the device.

(Problems to be Solved by the Invention) The present invention was made in view of the problems mentioned above, and its LI aspect is to make it possible to easily exchange the mold to be used, In addition, the dimensional accuracy required to make airtight contact between the end faces of the two frames and the mounting plate, which requires a special device to directly move the upper frame, can be reduced by 1'lJ. Furthermore, in order to provide a pressurized molding device that does not suddenly collide with the mold or the pressurizing and heating means provided in the upper frame when the air around the mold is under pressure. be.

(Means for solving the problem) The first invention includes a mounting plate for placing a mold and making a hole, and a pressurizing device for airtightly pressurizing and heating the mold placed on the mounting plate. The pressure heating means and the above-mentioned placing plate on which the above-mentioned formation j] type 2 is placed are heated with water! A conveying means that moves in the IZ direction to move it in and out of the pressurizing surface p. ~ When carried out from the means, there is a support part 6' that penetrates the hole f=i of the placing plate, and by raising this support part, the mold is lifted up! The invention is characterized in that it is equipped with a second raising means for "fi'."

A second invention provides a mounting plate for mounting a mold, an upper frame and a lower frame for airtightly sandwiching the mounting plate on which the mold is placed from above and below, and a mounting plate fixed to the mounting plate. And, ya! j A moving means for vertically moving the lower crusher, a support shaft for slidably supporting the upper frame in the direction of the moving axis of the door frame, and reducing the pressure in the space formed by the upper frame and the lower frame. and a pressurizing and heating means that pressurizes and heats the mold placed on the mounting plate that is airtightly sandwiched between the upper frame and the lower frame.

A third aspect of the present invention is a mounting plate on which a mold is placed, with a ventilation hole, and an upper frame and a lower frame that airtightly sandwich the mounting plate on which the mold is placed from above and below; a pressure reducing means for reducing the pressure in the space formed by the upper frame and the lower frame; It is characterized by comprising a pressure heating means for pressure heating.

(Function) In the first invention, the mold is placed on a mounting plate having holes, and is pressure-heated in an airtight manner by the pressure-heating means. Further, the placing plate is moved in the horizontal direction by a conveying means, and is taken in and out of the pressurizing and heating means. (5) When the mounting plate is carried out from the pressurizing and heating means by the conveying means, the support portion of the raising means is raised;
The support part passes through the hole in the mounting plate, and the mold is raised.

Therefore, the mold can be raised by the lifting means and a gap can be created between the mold and the mounting plate 1111, so if the lift is suppressed in this gap and the mold is lifted and moved, the mold can be moved. It is possible to exchange easily.

In the second invention, 1' and 4'l' are moved in three directions by the moving means and push up the setting plate on which the mold is placed. Eventually, the mounting plate is crimped onto the end face of the upper frame, and the upper frame is slid against the support shaft in the direction of the axis of movement of the frame. The placed mounting plate is airtightly sandwiched from above and below.

Subsequently, the atmosphere in the mold formed by the upper frame and the lower frame is reduced in pressure by the pressure reducing means. Furthermore, the moving means raises the lower mold by 4111 degrees, and the upper mold is also slid with respect to the support shaft in the direction of the moving axis of the lower frame, so that the mounting plate on which the mold is placed is , continues to be airtightly sandwiched from above and below by the upper frame and the lower frame. Then, the mold is pressurized and heated by the pressurized and heated means.

Therefore, since the upper frame slides with respect to the support shaft as the lower frame moves, the upper frame and the lower frame allow the mold to be moved easily even without a special device that directly moves the mold. The placed mounting plate is airtightly sandwiched from above and below.

In the third invention, the mounting plate on which the mold is placed is airtightly sandwiched from above and below by the upper frame and the lower frame, and the atmosphere of the mold formed by the upper frame and the door frame is reduced by the pressure reducing means. is depressurized.

At this time, the atmosphere in the mold is uniformly reduced in pressure through the ventilation holes. Then, the mold is pressurized by the lower heating stage.

Therefore, when the atmosphere in the mold formed by the upper frame and the door frame is reduced in pressure, the atmosphere in the mold is uniformly reduced in pressure, so that the position of the mold does not change drastically.

(Example) Hereinafter, one example of the present invention will be explained in detail with reference to the drawings. FIG. 1 is a front view showing the configuration of the pressure molding apparatus of this embodiment.

This pressure molding device consists of a pressurizing force of 11.4 ux machine +^1, a conveying mechanism, and a lifting mechanism.

The pressure heating mechanism is configured as follows. A cylinder 3 is vertically erected on a support base 1, and a heating plate 5 is horizontally fixed to the tip of a rod 4 directly connected to a piston (not shown) that slides inside the cylinder 3. A mounting board 7 having a plurality of holes 6 is placed on the upper surface of the heating board 5. Note that the holes 6 also function as ventilation holes. Then, a gasket 8 is installed on the upper end surface of the vacuum lower frame 9, and the vacuum lower frame 9 surrounds the heating plate 5. The vacuum lower frame 9 is fixed to the rod 4 in an airtight manner.

On the other hand, a predetermined distance l! above the heating plate 5! At 1714, the pressure receiving spring 10 is fixed to the pressure molding apparatus main body (not shown), the pressure receiving arm 11 is vertically disposed below the pressure receiving spring 10, and the heating plate 13 is horizontally mounted on the downward slope of the pressure receiving arm 1]. be fixed to. The pressure receiving arm 1] also functions as a support part 1, and a vacuum upper frame 17 is provided on the outer surface of the pressure receiving arm 1 so as to be slidable in the direction A in the figure. -3). A packing 15 is provided on the sliding surface of the vacuum upper frame 17. Further, a packing 19 is attached to the lower end surface of the vacuum upper frame 17. Further, on the upper surface of [vacuum upper frame] 7 is a vacuum pipe 2 connected to a vacuum pump (not shown).
Get 0.

The transport mechanism is constructed as follows. A hook 12 is provided at one end of the arrangement board 7. On the other hand, the cylinder 21 is fixed horizontally to the pressure forming apparatus main body, and the tip of a rod 22 that is directly connected to a piston (not shown) that slides inside the cylinder 21 in the direction B in the figure is capable of engaging with the hook 12. A hook 24 is formed. Also, the bottom surface of the mounting plate 7 is B in the figure.
Two guide rails 2 so that it can move in the direction of tt1
3 parallel to 7L and water) V.

The upper and lower sides are configured as follows. Nonoidrel 23
At a position below the cylinder 3 and adjacent to the cylinder 3, a cylinder 27 is installed vertically on the support base 25, and the cylinder 27
A support plate 29 is horizontally fixed at the tip of the rod 28, which is directly connected to a screw (not shown) that slides downward.

The two sides of the support plate 29 have a plurality of holes 6 capable of penetrating them.
The same number of support parts 31 as holes 6 are provided upright. A rolling hole 33 is embedded in the tip of each support part 31 so as to move 1n.

Next is the pressure molding device for the actual length! The operation of 9 will be explained.

It is assumed that a pair of upper and lower molding molds consisting of an upper mold 35 and a lower mold 37 are placed on the placement board 7. Note that the lower mold 37 is screwed onto the mounting plate 7 with screws 38.

1 0+: If you put out 22, the mounting board 7 will be the guide tool 23
Slide the top in the direction B in the figure, and the lot 28 is transported upwards (Figure 2). Remove the screw 38 (Figure 3 (a)). is raised, the rolling ball 33 and the support part 31 are passed through the hole 6, the rolling hole 33 is brought into contact with the lower ridge of the lower die 37, and the upper surface of the support plate 29 is further brought into contact with the lower surface of the mounting plate 7. The rod 28 is moved 2jfl'. At this point, there is a gap between the lower mold 37 and the cutting board 7 (FIG. 3(b)).

If, for example, a lift board connected to a lift is inserted into this gap (not shown) and the mold 37 is lifted and moved together with the upper mold 35, it can be easily replaced with another mold. In addition, the lower surface of the lower die 37 has rolling balls 3
3, and by rolling the rolling ball 33, the F mold 37 and the upper mold 35 can be easily moved horizontally. Note that FIG. 3(C) is a view of the mounting plate 7 viewed from above when the upper mold 35 and the lower mold 37 are removed from the main body in the state shown in FIG. 3(b).

2 Next, after filling the mounting plate 7 in this position with the cumulative amount,
I will explain the operation of pressurized heat treatment.

When the rod 22 is pulled in, it slides on the cutting board 7 (macaidor 23) and is placed on the heating board 5 (FIGS. 1 and 4 (a)). The upper end surface is in contact with the downward direction of the placement board 7, or the gastightness is ensured by the packing 9.

When the rod 4 is raised, the upper surface of the placement board 7 comes into contact with the end surface of the vacuum upper frame 17 via the gasket 19 (No. 41J (b)). At this time, the vacuum upper frame [-7] is slid by an appropriate amount with respect to the receiving arm [1], so that the upper surface of the mounting plate 7 is completely attached to the entire end surface of the vacuum upper frame 17. An airtight space is formed between the vacuum upper frame 17 and the vacuum lower frame 8 with the mounting plate 7 sandwiched therebetween, and the pressure of this airtight space is reduced through the pressure reduction pipe 20.

Then, while the pressure is reduced, the rod 4 is further raised by 2".
The upper part of the upper die 35 is brought into pressure contact with one surface of the heating plate 3, and the upper mold 35 is sufficiently pressurized and heated (FIG. 4(C)). Note that during the transition from the state shown in FIG. 4(b) to the state shown in FIG. Airtightness is ensured.

After sowing, the pressure reducing pipe 20 is released to the outside, and then the rod 4 is lowered and returned to its original position (FIG. 4(a)). Then, when the rod 22 is depressed, the processing board 7 slides on the guide rail 213, and the L! It is located above the side of the r+' machine (Fig. 2), and is used to fill the mold with a new charge or replace the mold.

Thus, according to the Kinohan example, it is possible to raise the mold by the upper H1 machine (1°1?) and provide a gap between the mold and the mounting plate 7, so in this gap, for example, The mold can be easily replaced by pushing in the lift and lifting the mold and moving it.Incidentally, the mounting plate 7 can be placed between the vacuum upper frame 7 and the vacuum lower frame 8. Since the mold is held airtightly (7), the atmosphere in the mold placed on the mounting plate 7 can be easily depressurized even though the mounting plate 7 is provided with the hole 6. , rolling ball 33 to rod 3
Since it is movable at the tip of 1, the rolling ball 3]
4 3 comes into contact with the lower surface of the lower die 37 at J1, thereby facilitating the movement of water in the forming die.

In addition, since the vacuum frame 17 is slid against the pressure receiving arm 11, which is a support shaft, as the vacuum lower frame 9 moves, there is no need for a special device to directly move the vacuum frame 2. , the vacuum upper frame 17 and the lower upper frame 9 airtightly sandwich the !1A mounting plate 7 on which the mold is placed from the upper side.

In this case, the special device 9 for directly moving the vacuum upper frame 17 is not required, and the end bend of the vacuum frame 17 is in airtight contact with the mounting plate 7 or the like. The dimensional viscosity required to achieve this can be reduced.

Furthermore, the processing board 7 having the ventilation hole 6 is connected to the vacuum upper frame 17.
Since they are held airtight by the vacuum lower frame 8, when the space around the mold consisting of the upper mold 35 and the lower mold 37 is depressurized, the atmosphere in the mold is uniformly depressurized. The mold will not suddenly lose its position, and therefore the mold will not suddenly collide with the heating plate 13 provided in the vacuum upper frame 8.

5. In this embodiment, a set of two molds, the upper mold 35 and the lower mold 37, was used, but it goes without saying that a larger number of molds can be used at the same time.

In addition, although an airtight space was formed by sandwiching the processing board 7 between the vacuum upper frame 7 and the vacuum top frame 9, this mechanism is not essential.

(Effects of Light) As explained in detail above, according to the pressure molding apparatus of the present invention, the mold is raised by the lifting machine (^1), and a gap of 1 is provided between the mold and the cutting board. This makes it possible, for example, to insert a lift into this gap to lift and move the mold, making it easy to replace the mold.

In addition, there is no need for a special device to directly move the upper frame, and the size of the rice can be reduced by ensuring airtight contact between the end face of the upper frame and the mounting plate. It is possible to provide a pressure molding apparatus for 1.

Furthermore, when the pressure in the space around the mold is reduced, it is possible to prevent the mold from suddenly colliding with the positive heating f stage 6 provided in the upper frame.

[BRIEF DESCRIPTION OF THE DRAWINGS] FIGS. 1 and 2 are normal curved views of a pressure molding device according to an embodiment of the present invention, and FIG. 3 is an operation of the lifting mechanism of the pressure molding device of this embodiment. The fourth country is a diagram showing the operation of machine A 1111; 3...Cylinder, 4...Rod, 5...FiJ1
Board, 6...hole, 7...mounting plate, 9...vacuum bottom frame,]
0.Pressure receiving spring, ]1...Pressure receiving arm, ]3...
- Heating plate, 17 - Vacuum upper frame, 20... Decompression pipe, 21
...Cylinder, 22...Rot, 23 Guide rail, 27...Cylinder, 28...Rod, two...
Support plate, 3]... Support part, 33. Rolling ball, 35.
・Upper mold, 37.・Lower mold

Claims (3)

[Claims] (1) A mounting plate on which a mold is placed and has a hole, a pressure heating means for airtightly pressurizing and heating the mold placed on the mounting plate, and the mold is placed on it. a conveying means for horizontally moving said placing plate into and out of said pressurizing and heating means; and when said placing plate is carried out from said pressurizing and heating means by said conveying means, said placing plate has A pressure molding apparatus comprising: a support part that penetrates the hole; and a lifting means that raises the mold by raising the support part. (2) a mounting plate on which the mold is placed; an upper frame and a lower frame that airtightly sandwich the placing plate on which the mold is placed from above and below; the lower frame is fixed and the lower frame is fixed; a moving means for vertically moving the frame; a support shaft for slidably supporting the upper frame in the movement axis direction of the lower frame; and a pressure reducing means for reducing the pressure in the space formed by the upper frame and the lower frame. A pressure molding apparatus comprising: a pressurizing and heating means for pressurizing and heating the mold placed on the placing plate which is airtightly held between the upper frame and the lower frame. (3) A mounting plate having a ventilation hole and on which a mold is placed; an upper frame and a lower frame that airtightly sandwich the mounting plate on which the mold is placed from above and below; and the upper frame. and a pressure reducing means for reducing the pressure in the space formed by the lower frame; and a pressure heating means for pressurizing and heating the mold placed on the placing plate that is airtightly sandwiched between the upper frame and the lower frame. A pressure molding device characterized by comprising: