JPH0334517A - Metallized organic film capacitor and manufacture thereof - Google Patents
Metallized organic film capacitor and manufacture thereofInfo
- Publication number
- JPH0334517A JPH0334517A JP1170194A JP17019489A JPH0334517A JP H0334517 A JPH0334517 A JP H0334517A JP 1170194 A JP1170194 A JP 1170194A JP 17019489 A JP17019489 A JP 17019489A JP H0334517 A JPH0334517 A JP H0334517A
- Authority
- JP
- Japan
- Prior art keywords
- film
- margin
- laser
- organic film
- paraffin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims description 38
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000012188 paraffin wax Substances 0.000 claims abstract description 36
- 238000004804 winding Methods 0.000 claims abstract description 10
- 230000008018 melting Effects 0.000 claims abstract description 8
- 238000002844 melting Methods 0.000 claims abstract description 8
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 5
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 5
- 238000010030 laminating Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 31
- 238000003825 pressing Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000001465 metallisation Methods 0.000 claims 1
- 239000010408 film Substances 0.000 abstract description 103
- 230000008016 vaporization Effects 0.000 abstract description 6
- 238000009834 vaporization Methods 0.000 abstract description 6
- 239000004215 Carbon black (E152) Substances 0.000 abstract description 3
- 230000004927 fusion Effects 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 230000003685 thermal hair damage Effects 0.000 abstract description 3
- 230000002093 peripheral effect Effects 0.000 abstract 2
- 230000015556 catabolic process Effects 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 9
- 239000011104 metalized film Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000005019 vapor deposition process Methods 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laser Beam Processing (AREA)
- Physical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子機器、電気機器に用いられる金属化有機
フィルムコンデンサ及びその製造方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a metallized organic film capacitor used in electronic equipment and electrical equipment, and a method for manufacturing the same.
従来の技術
近年、電子、電気部品は、小型化、軽量化、高性能化、
低コスト化が強く要望されており、フィルムコンデンサ
においても、そのために盛んに開発が行なわれている。Conventional technology In recent years, electronic and electrical components have become smaller, lighter, and more efficient.
There is a strong demand for cost reduction, and film capacitors are being actively developed for this purpose.
従来、フィルムコンデンサは、有機フィルム上に蒸着膜
を形成する際、絶縁溝部を形成するために、有機フィル
ム上にマスキング材を設けた後、真空蒸着等で絶縁溝部
を有する蒸着膜を、片面あるいは両面に形成した金属化
有機フィルムを形成し、このフィルムを基に積層または
巻回を行うことでフィルムコンデンサを形成していた。Conventionally, when forming a deposited film on an organic film, a masking material is provided on the organic film to form an insulating groove, and then the deposited film having the insulating groove is deposited on one side or the other by vacuum deposition. A film capacitor was formed by forming a metalized organic film on both sides and laminating or winding the film.
しかしながら、近年要求されている、益々の、素子小型
軽量化、低コスト化に対して、従来の構造、工法のフィ
ルムコンデンサでは充分に対応できなくなりつつある。However, film capacitors with conventional structures and construction methods are no longer able to adequately meet the recent demands for smaller, lighter, and lower cost devices.
これは、有機フィルム上に蒸着を行う際、絶縁溝部を形
成するために有機フィルム上にマスキング材を設けなけ
ればならず、素子小型化のために、前記絶縁溝部の溝幅
を狭くするのに限界があり、またその絶縁溝部の寸法的
な精度にも限界がある。そして、この絶縁溝部を形成し
た金属化有機フィルムを、この後のフィルムコンデンサ
製造工程に用いることは、工程上、常に絶縁溝部を精度
よく管理しなければならず、特に、この金属化有機フィ
ルムの積層９巻回工程では、素子小型化の折には困難を
極めていた。This is because when performing vapor deposition on an organic film, a masking material must be provided on the organic film to form an insulating groove, and in order to miniaturize the device, it is necessary to narrow the width of the insulating groove. There are limits, and there are also limits to the dimensional accuracy of the insulating grooves. In order to use the metallized organic film with the insulating grooves formed therein in the subsequent film capacitor manufacturing process, the insulating grooves must always be precisely controlled during the process. The 9-winding process has been extremely difficult when miniaturizing the device.
そこで最近、第９図に示す様に、有機フィルム上の全面
に蒸着膜を施した金属有機フィルム８を、レーザ光線９
により、絶縁溝部（以下レーザマージン３と称す）を形
成し、それを積層または巻回し、第４図、第５図に示す
構造を有するコンデンサ素子を得る工法が提案されてい
る。Therefore, recently, as shown in FIG.
Accordingly, a method has been proposed in which an insulating groove portion (hereinafter referred to as laser margin 3) is formed and the grooves are laminated or wound to obtain a capacitor element having the structure shown in FIGS. 4 and 5.
この工法は、蒸着工程において、絶縁溝部を形成する必
要がなく、蒸着工程の後工程として絶縁溝部を形成する
ことを特徴とし、積層または巻回工程の直前に絶縁溝部
すなわち、レーザマージンをレーザ光線で形成すること
から、精度よい、しかも溝幅の狭い絶縁溝部を形成する
ことができ、素子の小型化においても、また、その量産
性においても、非常に優れた工法である。This method is characterized by the fact that there is no need to form an insulating groove in the vapor deposition process, and the insulating groove is formed as a post process of the vapor deposition process, and immediately before the lamination or winding process, the insulating groove, that is, the laser margin, is exposed to the laser beam. Since it is formed using a method, it is possible to form an insulating groove portion with high precision and a narrow groove width, and it is an extremely excellent method in terms of miniaturization of devices and mass productivity.
発明が解決しようとする課題
しかしながら、前記工法を用いて金属化フィルムコンデ
ンサを製造する場合、金属化有機フィルムに絶縁溝部を
形成するためにレーザ光線を照射し蒸着膜を飛散させる
際、主に蒸着金属が溶融。Problems to be Solved by the Invention However, when manufacturing a metallized film capacitor using the above method, when irradiating a laser beam to scatter the deposited film in order to form an insulating groove in the metallized organic film, the deposited film is mainly Metal melts.
気化する段階での、融解熱、気化熱により、下地である
有機フィルムが熱的ダメージを受け、特に薄膜有機フィ
ルムを用いた場合では、第７図に示す様な貫通穴６が生
じ、ここで短絡７を生じることもまれではない。一方、
レーザマージンの溝幅は、狭いことを特長とするのであ
るが、この狭い溝部である由に、積層または巻回工程で
の金属化有機フィルム層間の密着力が不十分である場合
には、このコンデンサ素子に高電圧を印加した場合、第
１０図に示す様な、レーザマージン３近傍に生じている
気体層１０を通して、沿面放電１１を起こし、コンデン
サとして、正常な特性を有しなくなる。このため、積層
または巻回工程での金属化有機フィルム層間の密着力を
高め完全に気体層１０をなくそうとすると、第６図に示
す蒸着膜２と端面電極５ａ、５ｂとの、コンタクト不足
が生じ、誘電正接特性が不良になったり、容量減少にな
ることは、一般に知られている。The underlying organic film is thermally damaged by the heat of fusion and vaporization during the vaporization stage, and especially when a thin organic film is used, a through hole 6 as shown in FIG. 7 is formed. It is not uncommon for short circuits 7 to occur. on the other hand,
The groove width of the laser margin is characterized by being narrow, but because of this narrow groove, if the adhesion between metallized organic film layers during the lamination or winding process is insufficient, this When a high voltage is applied to the capacitor element, creeping discharge 11 occurs through the gas layer 10 generated near the laser margin 3 as shown in FIG. 10, and the capacitor no longer has normal characteristics. Therefore, if an attempt is made to increase the adhesion between the metallized organic film layers in the lamination or winding process and completely eliminate the gas layer 10, there will be insufficient contact between the vapor deposited film 2 and the end electrodes 5a and 5b as shown in FIG. It is generally known that this occurs, leading to poor dielectric loss tangent characteristics and a decrease in capacitance.
これらのことより、前記工法により金属化有機フィルム
コンデンサを製造する場合、レーザ光線により有機フィ
ルム自体が熱的ダメージを受け、レーザマージンの有機
フィルムの耐電圧特性が低下したり、場合によっては貫
通穴が生じたり、また、レーザ光線によらて形成される
狭いレーザマージンで沿面放電が生じるなど、コンデン
サ素子として機能しなかったり、特性不良となる場合が
あることがあった。For these reasons, when manufacturing a metallized organic film capacitor using the above-mentioned method, the organic film itself may be thermally damaged by the laser beam, and the withstand voltage characteristics of the organic film in the laser margin may deteriorate, and in some cases, the through holes may be damaged. In some cases, the capacitor element may not function as a capacitor element or have poor characteristics, such as creeping discharge occurring due to the narrow laser margin formed by the laser beam.
本発明は、前記従来の課題を解決するもので、金属化有
機フィルムにレーザマージンを形成する際、形成される
レーザマージン部の有機フィルムの耐電圧特性を低下さ
せることなく、また、レーザマージンで沿面放電が生じ
ない金属化有機フィルムコンデンサ及びその製造方法を
提供することを目的とする。The present invention solves the above-mentioned conventional problems, and when forming a laser margin on a metallized organic film, it is possible to form a laser margin without reducing the withstand voltage characteristics of the organic film in the laser margin portion to be formed. An object of the present invention is to provide a metallized organic film capacitor that does not cause creeping discharge and a method for manufacturing the same.
課題を解決するための手段
前記目的を達成するために本発明の金属化有機フィルム
コンデンサは、有機フィルム上の蒸着膜に形成されたレ
ーザマージンの周辺に、好ましくは、３０〜１１０℃ま
での範囲内に融点または軟化点を有する炭化水素または
その誘電体を主成分とするパラフィン膜を形成された構
造を有していることを特徴とする。Means for Solving the Problems In order to achieve the above objects, the metallized organic film capacitor of the present invention preferably has a temperature range of 30 to 110° C. around the laser margin formed in the vapor deposited film on the organic film. It is characterized by having a structure in which a paraffin film is formed mainly of a hydrocarbon having a melting point or softening point or a dielectric material thereof.
また、前記目的を達成するために、本発明の金属化有機
フィルムコンデンサの製造方法は、金属化有機フィルム
に、レーザマージンを形成する工程の前工程または、後
得低として、レーザマージンが形成されるべき部分周辺
または、形成されたレーザマージン周辺に、好ましくは
、３０〜１１０℃までの範囲内に融点または軟化点を有
する炭化水素またはその誘電体を主成分とするパラフィ
ン膜を塗布する工程と、前記パラフィン膜形成工程と、
前記レーザマージン形成工程とを施した金属化有機フィ
ルムを積層または巻回したのち、好ましくは、８０℃以
上、５ ｋｇ ｆ ／ｃｄ以上の温度及び圧力で前記積
層体及び巻回体をヒートプレスする工程とを有すること
を特徴とする。In addition, in order to achieve the above object, the method for manufacturing a metallized organic film capacitor of the present invention includes forming a laser margin on a metallized organic film as a pre-process or as a subsequent step of forming a laser margin. a step of applying a paraffin film mainly composed of a hydrocarbon or a dielectric material thereof having a melting point or softening point preferably within the range of 30 to 110 ° C. , the paraffin film forming step;
After laminating or winding the metallized organic film subjected to the laser margin forming step, the laminated body and the wound body are preferably heat-pressed at a temperature and pressure of 80° C. or higher and 5 kg f / cd or higher. It is characterized by having a process.
作用
前記構成または工程により、金属化有機フィルムにレー
ザマージンを形成する場合、レーザマージンを形成する
前に、レーザマージンが形成されるべき部分周辺にパラ
フィン膜を塗布したのち、レーザマージンを形成するこ
とで、レーザ光線が、蒸着膜を飛散させる時の、主に蒸
着金属の融解熱と気化熱を、パラフィン自体の熱容量と
融解熱と気化熱とで吸収し、有機フィルムへの熱ダメー
ジを最小限におさえることが出来る。このため、例えば
、薄膜有機フィルムを用いた場合でも、レーザマージン
に貫通穴を生じることがない。その後、上記のレーザマ
ージンを有する金属化有機フィルムを積層または巻回し
、所定の温度、圧力でヒートプレスを行い、第１図、第
２図に示す様な構造の金属化有機フィルムコンデンサを
得る。第１図、第２図に示す様に、レーザマージン３周
辺にパラフィン膜４が形成されており、このために、レ
ーザマージン３近傍には気体層１０は存在しなくなり、
レーザマージン３で沿面放電を生じない。また第８図に
示す様に、レーザマージンを形成した後に、パラフィン
膜を形成した場合や、何らかの理由で、レーザマージン
部の有機フィルムに、貫通穴または欠陥穴が生じている
場合には、パラフィンが、貫通穴または欠陥穴７を穴埋
めし、沿面放電を生じない。また、このパラフィン膜４
が存在することで、金属化有機フィルム層間の密着力が
向上するので、通常のヒートプレス工程の温度、圧力の
条件以下で行うことが出来、蒸着膜と端面電極とのコン
タクト性を向上させることが出来る。Effect When forming a laser margin on a metallized organic film using the above structure or process, before forming the laser margin, apply a paraffin film around the part where the laser margin is to be formed, and then form the laser margin. When the laser beam scatters the deposited film, the heat of melting and vaporization of the deposited metal is absorbed by the paraffin's own heat capacity, melting heat, and vaporization heat, minimizing thermal damage to the organic film. It can be controlled. Therefore, even if a thin organic film is used, for example, no through holes will be formed in the laser margin. Thereafter, the metallized organic film having the laser margin described above is laminated or wound and heat pressed at a predetermined temperature and pressure to obtain a metallized organic film capacitor having a structure as shown in FIGS. 1 and 2. As shown in FIGS. 1 and 2, a paraffin film 4 is formed around the laser margin 3, so that the gas layer 10 no longer exists near the laser margin 3.
Creeping discharge does not occur with a laser margin of 3. In addition, as shown in Figure 8, if a paraffin film is formed after forming a laser margin, or if for some reason there are through holes or defective holes in the organic film at the laser margin, paraffin However, the through holes or defective holes 7 are filled, and creeping discharge does not occur. In addition, this paraffin film 4
The presence of the metallized organic film improves the adhesion between the metallized organic film layers, allowing the process to be carried out at temperatures and pressures lower than those of normal heat press processes, improving the contact between the deposited film and the end electrodes. I can do it.
前記パラフィン膜の形成には、パラフィンは常温では固
体なので、加熱して融解するか、トリクロルエチレン、
トリクロルエタン、テトラクロルエチレンなどの溶媒で
融解して用いる。塗布に際しては、スピンナ塗布、はけ
塗り法、筆塗り法。To form the paraffin film, paraffin is solid at room temperature, so it can be heated to melt it, or trichlorethylene,
It is used by melting it in a solvent such as trichloroethane or tetrachloroethylene. For application, spinner application, brush application method, and brush application method.
スプレー塗布法、ロール転写法、フェルト塗り法などの
方法を用いて塗布し、用いた溶媒は揮発させることで形
成可能である。It can be formed by coating using a method such as a spray coating method, a roll transfer method, or a felt coating method, and by volatilizing the solvent used.
実施例 以下、本発明の実施例について説明する。Example Examples of the present invention will be described below.
実施例１
第１図の様な金属化有機フィルムコンデンサを得るため
、有機フィルムとして、厚さ５μｍのポリエチレンテレ
フタレート（ＰＥＴ）フィルム上に、蒸着電極を設け、
片面金属化有機フィルムを用いた。前記片面金属化有機
フィルムに、レーザ光線によって溝幅１００μｍのレー
ザマージン３を設け、その後、レーザマージン３周辺に
パラフィン膜４を設けた金属化有機フィルムを得た。Example 1 In order to obtain a metallized organic film capacitor as shown in FIG.
A single-sided metallized organic film was used. A laser margin 3 with a groove width of 100 μm was provided on the single-sided metalized organic film using a laser beam, and then a paraffin film 4 was provided around the laser margin 3 to obtain a metalized organic film.
この様にして得た片面金属化有機フィルムを、レーザマ
ージンの位置をずらした２枚を重ねて巻回し、その後、
温度１０５□、圧力５ｋｇｆ／ｃｎｒの条件でヒートプ
レスした巻回体を得た。この巻回体の蒸着電極２を端面
電極５ａ、５ｂと接続し、第２図の様な構造の金属化有
機フィルムコンデンサを得た。比較例１として、第５図
に示す様な、パラフィン膜を形成していない構造の金属
化有機フィルムコンデンサも得た。Two single-sided metallized organic films obtained in this way were wound together with the laser margin shifted, and then
A rolled body was obtained by heat pressing under the conditions of a temperature of 105□ and a pressure of 5 kgf/cnr. The vapor-deposited electrode 2 of this wound body was connected to the end face electrodes 5a and 5b to obtain a metallized organic film capacitor having a structure as shown in FIG. As Comparative Example 1, a metallized organic film capacitor having a structure in which no paraffin film was formed as shown in FIG. 5 was also obtained.
本発明の実施例１のコンデンサと比較例１のコンデンサ
の端面電極５ａ、５ｂ間に、電圧を印加したところ、本
発明の実施例１のコンデンサでは、１５００Ｖ以上の耐
電圧特性を示した。しかし、比較例１のコンデンサは、
約４００Ｖで沿面放電が生じ、耐電圧特性は、本発明の
実施例１のコンデンサに比べ、著しく劣ったものであっ
た。When a voltage was applied between the end face electrodes 5a and 5b of the capacitor of Example 1 of the present invention and the capacitor of Comparative Example 1, the capacitor of Example 1 of the present invention exhibited a withstand voltage characteristic of 1500V or more. However, the capacitor of Comparative Example 1 is
Creeping discharge occurred at about 400 V, and the withstand voltage characteristics were significantly inferior to that of the capacitor of Example 1 of the present invention.
実施例２
第１図の様な金属化有機フィルムコンデンサを得るため
、有機フィルムとして、厚さ１．０μｍのポリエチレン
テレフタレート（ＰＥＴ）フィルム上に、蒸着電極を設
け、その後、レーザマージンが形成されるべき部分周辺
にパラフィン膜を設けたのち、溝幅１００μｍのレーザ
マージン３を形成した金属化有機フィルムを得た。この
様にして得た片面金属化有機フィルムを、レーザマージ
ンの位置をずらした２枚を重ねて積層し、その後、温度
１４０℃、圧力１０ｋｇｆ／ａＩｒの条件でヒートプレ
スした積層体を得た。この積層体の蒸着電極２を端面電
極５ａ、５ｂと接続し、第１図の様な構造の金属化有機
フィルムコンデンサを得た。比較例２として、第４図に
示す様な、パラフィン膜を設けずに、レーザマージン３
を形成した構造の金属化有機フィルムコンデンサも得た
。Example 2 In order to obtain a metallized organic film capacitor as shown in Fig. 1, a vapor-deposited electrode was provided on a 1.0 μm thick polyethylene terephthalate (PET) film as an organic film, and then a laser margin was formed. After providing a paraffin film around the desired portion, a metallized organic film was obtained in which a laser margin 3 with a groove width of 100 μm was formed. Two single-sided metallized organic films thus obtained were laminated with their laser margins shifted, and then heat pressed at a temperature of 140° C. and a pressure of 10 kgf/aIr to obtain a laminate. The vapor-deposited electrode 2 of this laminate was connected to end face electrodes 5a and 5b to obtain a metallized organic film capacitor having a structure as shown in FIG. As a comparative example 2, as shown in Fig. 4, a laser margin of 3 was used without providing a paraffin film.
A metallized organic film capacitor with a structure was also obtained.
この比較例２のコンデンサのレーザマージン３には、レ
ーザ光線により蒸着膜を飛散させた際に生じた貫通穴７
が無数においていた。The laser margin 3 of the capacitor of Comparative Example 2 has a through hole 7 formed when the vapor deposited film is scattered by the laser beam.
There were countless.
本発明の実施例２のコンデンサは、良好なコンデンサ特
性を有していたが、比較例２のコンデンサは、端面電極
５ａ、５ｂ間が短絡状態となり、コンデンサとしての特
性を得ることが出来なかった。The capacitor of Example 2 of the present invention had good capacitor characteristics, but the capacitor of Comparative Example 2 had a short circuit between the end electrodes 5a and 5b, and could not obtain the characteristics as a capacitor. .
なお、実施例１および実施例２では、有機フィルムの片
面にのみ蒸着を行った片面金属化有機フィルムを用いた
が、両面金属化有機フィルムを用いて、例えば第３図に
示す様に、両面金属化有機フィルムにレーザマージン３
を形成する前工程または後工程として、パラフィン膜４
を両面に形成したのち、この両面金属化有機フィルム層
間に蒸着していない有機フィルム１２を配した構造の金
属化有機フィルムコンデンサを構成しても、本発明は全
く同じ効果を示すことが出来る。In Examples 1 and 2, a single-sided metallized organic film was used, in which vapor deposition was performed only on one side of the organic film, but a double-sided metalized organic film was used, for example, as shown in FIG. Laser margin 3 on metallized organic film
As a pre-process or post-process to form a paraffin film 4
The present invention can exhibit exactly the same effect even if a metallized organic film capacitor having a structure is formed in which an undeposited organic film 12 is arranged between the metalized organic film layers on both sides after forming the metallized organic film on both sides.
発明の効果
以上の様に本発明の金属化有機フィルムコンデンサは、
金属化有機フィルムにレーザマージンを形成する工程の
前工程または後工程として、レーザマージンが形成され
るべき部分周辺または、形成されたレーザマージン周辺
にパラフィン膜を形成した金属化有機フィルムを、積層
または巻回したのち、所定の条件でヒートプレスを行い
、その後、蒸着電極と端面電極とを接続することにより
レーザマージンを形成する際、形成されるレーザマージ
ン部の有機フィルムの耐電圧特性の低下や貫通穴を生じ
ることなく、また、レーザマージンで沿面放電が生じな
い、小型で量産性の高い金属化有機フィルムコンデンサ
を提供することが出来る。As described above, the metallized organic film capacitor of the present invention has the following effects:
As a pre- or post-process of forming a laser margin on a metallized organic film, a metallized organic film with a paraffin film formed around the part where the laser margin is to be formed or around the formed laser margin is laminated or After winding, heat pressing is performed under predetermined conditions, and then when a laser margin is formed by connecting the vapor-deposited electrode and the end electrode, there is a possibility that the withstand voltage characteristics of the organic film in the laser margin portion will deteriorate or It is possible to provide a metalized organic film capacitor that is small and highly mass-producible, without forming through holes and without creeping discharge occurring in the laser margin.
第１図は片面金属化フィルムを用いた積層型の本発明の
一実施例を示す断面図、第２図は片面金属化フィルムを
用いた巻回型の本発明の一実施例を示す断面図、第３図
は両面金属化フィルムを用いた積層型の本発明の一実施
例を示す断面図、第４図はパラフィン膜を形成していな
い比較例２の構造を示す断面図、第５図はパラフィン膜
を形成していない比較例１の構造を示す断面図、第６図
は金属化フィルム層間の密着力を高めた場合の構造を示
す断面図、第７図はレーザマージン部の有機フィルムが
熱的ダメージを受は貫通穴があいた状態を示す断面図、
第８図はレーザマージンに貫通穴や欠陥部が生じている
場合にパラフィン膜を形成した状態を示す断面図、第９
図は金属化有機フィルムにレーザマージンを形成する工
程を示す斜視図、第１０図はレーザマージン部で沿面放
電が生じる状態を示す断面図である。
１・・・・・・有機フィルム、２・・・・・・蒸着膜、
３・・・・・・レーザマージン、４・・・・・・パラフ
ィン膜、５・・・・・・端面電極、１０・・・・・・気
体層、１１・・・・・・沿面放電。Fig. 1 is a sectional view showing an embodiment of the present invention of a laminated type using a metalized film on one side, and Fig. 2 is a sectional view showing an embodiment of the invention of a rolled type using a metalized film on one side. , FIG. 3 is a sectional view showing an example of the laminated type of the present invention using double-sided metallized films, FIG. 4 is a sectional view showing the structure of Comparative Example 2 in which no paraffin film is formed, and FIG. 5 is a cross-sectional view showing the structure of Comparative Example 1 in which no paraffin film is formed, FIG. 6 is a cross-sectional view showing the structure when the adhesion between metallized film layers is increased, and FIG. 7 is a cross-sectional view showing the structure of Comparative Example 1 in which no paraffin film is formed. A cross-sectional view showing a state where a hole has been formed due to thermal damage.
Figure 8 is a cross-sectional view showing the state in which a paraffin film is formed when there are through holes or defects in the laser margin;
The figure is a perspective view showing the process of forming a laser margin on a metallized organic film, and FIG. 10 is a cross-sectional view showing a state in which creeping discharge occurs in the laser margin part. 1... Organic film, 2... Vapor deposited film,
3... Laser margin, 4... Paraffin film, 5... Edge electrode, 10... Gas layer, 11... Creeping discharge.
Claims (2)
ザマージンと、パラフィン膜とを有し、前記レーザマー
ジンは、レーザ光線の熱エネルギーによって蒸着膜の一
部を飛散させた絶縁溝部であり、前記パラフィン膜は、
３０〜１１０℃までの範囲内に融点または軟化点を有す
る炭化水素またはその誘導体を主成分とするパラフィン
を前記レーザマージン周辺に形成されたものであり、前
記レーザマージンとパラフィン膜とを有する金属化有機
フィルムを積層又は巻回してなる、金属化有機フィルム
コンデンサ。(1) It has a laser margin formed on a part of the vapor deposited film on the organic film and a paraffin film, and the laser margin is an insulating groove part in which a part of the vapor deposited film is scattered by the thermal energy of the laser beam. Yes, the paraffin film is
Paraffin mainly composed of hydrocarbons or derivatives thereof having a melting point or softening point within the range of 30 to 110°C is formed around the laser margin, and the metallization has the laser margin and a paraffin film. A metallized organic film capacitor made by laminating or winding organic films.
を形成する工程と、パラフィン膜を形成する工程と、ヒ
ートプレスする工程とを有し、前記レーザマージン形成
工程は、レーザ光線の熱エネルギーによって蒸着膜の一
部を飛散させて絶縁溝部を形成し、前記パラフィン膜形
成工程は、３０〜１１０℃までの範囲内に融点、または
軟化点を有する炭化水素またはその誘導体を主成分とす
るパラフィンを、前記レーザマージン形成工程の前工程
または後工程として、前記レーザマージンが形成される
べき部分周辺または前記レーザマージン周辺に形成し、
前記ヒートトプレス工程は、前記レーザマージン形成工
程と前記パラフィン膜形成工程とを施した金属化有機フ
ィルムを積層または巻回した後、８０℃以上、５ｋｇｆ
／ｃｍ＾２以上の温度及び圧力でヒートプレスを行うこ
とを特徴とする金属化有機フィルムコンデンサの製造方
法。(2) It includes a step of forming a laser margin on a part of the vapor deposited film on the organic film, a step of forming a paraffin film, and a step of heat pressing. In the paraffin film forming step, a part of the deposited film is scattered to form an insulating groove, and the paraffin film forming step is performed using paraffin mainly composed of hydrocarbons or derivatives thereof having a melting point or softening point within the range of 30 to 110°C. is formed around a portion where the laser margin is to be formed or around the laser margin as a pre-process or post-process of the laser margin forming step,
The heat-pressing step is performed by laminating or winding the metallized organic film that has been subjected to the laser margin forming step and the paraffin film forming step, and then heating the film at 80° C. or higher with a weight of 5 kgf.
1. A method for producing a metallized organic film capacitor, the method comprising heat pressing at a temperature and pressure of /cm^2 or higher.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1170194A JPH0334517A (en) | 1989-06-30 | 1989-06-30 | Metallized organic film capacitor and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1170194A JPH0334517A (en) | 1989-06-30 | 1989-06-30 | Metallized organic film capacitor and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0334517A true JPH0334517A (en) | 1991-02-14 |
Family
ID=15900419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1170194A Pending JPH0334517A (en) | 1989-06-30 | 1989-06-30 | Metallized organic film capacitor and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334517A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007105867A1 (en) * | 2006-03-14 | 2007-09-20 | Dong Nam Petroleum Ind. Co., Ltd. | Method for producing insulator for condenser and insulator for condenser produced thereby |
-
1989
- 1989-06-30 JP JP1170194A patent/JPH0334517A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007105867A1 (en) * | 2006-03-14 | 2007-09-20 | Dong Nam Petroleum Ind. Co., Ltd. | Method for producing insulator for condenser and insulator for condenser produced thereby |
| KR100764829B1 (en) * | 2006-03-14 | 2007-10-09 | 동남석유공업(주) | A manufacturing method of insulator for condenser |
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