JPH0334241U - - Google Patents
Info
- Publication number
- JPH0334241U JPH0334241U JP9453789U JP9453789U JPH0334241U JP H0334241 U JPH0334241 U JP H0334241U JP 9453789 U JP9453789 U JP 9453789U JP 9453789 U JP9453789 U JP 9453789U JP H0334241 U JPH0334241 U JP H0334241U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- cap
- sealing structure
- ceramic substrate
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Casings For Electric Apparatus (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図及び第２図は本考案にかかり、第１図は
電子部品の封止構造を示す概略構成図であり、第
２図はその要部を拡大して示す一部破断斜視図で
ある。また、第３図及び第４図は従来例にかかり
、第３図は電子部品の封止構造を示す概略構成図
であり、第４図はその要部を拡大して示す斜視図
である。
図における符号１……電子部品、２……セラミ
ツク基板、３……キヤツプ、４……接着剤、１０
……溝部である。なお、図中の同一符号は、互い
に同一もしくは相当する部品、部分を示している
。
1 and 2 are related to the present invention, FIG. 1 is a schematic configuration diagram showing the sealing structure of an electronic component, and FIG. 2 is a partially cutaway perspective view showing an enlarged main part thereof. . Further, FIGS. 3 and 4 relate to a conventional example, with FIG. 3 being a schematic configuration diagram showing the sealing structure of an electronic component, and FIG. 4 being an enlarged perspective view showing the main part thereof. Reference numerals in the figure 1...electronic component, 2...ceramic substrate, 3...cap, 4...adhesive, 10
...It's a groove. Note that the same reference numerals in the drawings indicate parts and portions that are the same or correspond to each other.
Claims (1)
と、これらの電子部品を封止するキヤツプの端縁
部とを接着剤で接合してなる電子部品の封止構造
において、 前記セラミツク基板の周縁部に、前記キヤツプ
の端縁部が嵌入されうる幅の溝部を全周にわたつ
て形成したことを特徴とする電子部品の封止構造
。[Scope of Claim for Utility Model Registration] In a sealing structure for electronic components in which the periphery of a ceramic substrate on which electronic components are mounted and the edge of a cap for sealing these electronic components are bonded with an adhesive. . A sealing structure for an electronic component, characterized in that a groove portion having a width into which an edge portion of the cap can be inserted is formed around the entire circumference of the ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9453789U JPH0334241U (en) | 1989-08-11 | 1989-08-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9453789U JPH0334241U (en) | 1989-08-11 | 1989-08-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0334241U true JPH0334241U (en) | 1991-04-04 |
Family
ID=31643862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9453789U Pending JPH0334241U (en) | 1989-08-11 | 1989-08-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334241U (en) |
-
1989
- 1989-08-11 JP JP9453789U patent/JPH0334241U/ja active Pending
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