JPH0334239U - - Google Patents
Info
- Publication number
- JPH0334239U JPH0334239U JP1989095299U JP9529989U JPH0334239U JP H0334239 U JPH0334239 U JP H0334239U JP 1989095299 U JP1989095299 U JP 1989095299U JP 9529989 U JP9529989 U JP 9529989U JP H0334239 U JPH0334239 U JP H0334239U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- tip
- bonding tool
- tool
- inner lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989095299U JPH0731542Y2 (ja) | 1989-08-15 | 1989-08-15 | ボンディングツール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989095299U JPH0731542Y2 (ja) | 1989-08-15 | 1989-08-15 | ボンディングツール |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0334239U true JPH0334239U (nl) | 1991-04-04 |
JPH0731542Y2 JPH0731542Y2 (ja) | 1995-07-19 |
Family
ID=31644569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989095299U Expired - Lifetime JPH0731542Y2 (ja) | 1989-08-15 | 1989-08-15 | ボンディングツール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0731542Y2 (nl) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS645026A (en) * | 1987-06-26 | 1989-01-10 | Matsushita Electric Ind Co Ltd | Bonding tool |
-
1989
- 1989-08-15 JP JP1989095299U patent/JPH0731542Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS645026A (en) * | 1987-06-26 | 1989-01-10 | Matsushita Electric Ind Co Ltd | Bonding tool |
Also Published As
Publication number | Publication date |
---|---|
JPH0731542Y2 (ja) | 1995-07-19 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |