JPH0332463U - - Google Patents

Info

Publication number
JPH0332463U
JPH0332463U JP9354289U JP9354289U JPH0332463U JP H0332463 U JPH0332463 U JP H0332463U JP 9354289 U JP9354289 U JP 9354289U JP 9354289 U JP9354289 U JP 9354289U JP H0332463 U JPH0332463 U JP H0332463U
Authority
JP
Japan
Prior art keywords
solder
suction nozzle
cylindrical body
pool
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9354289U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9354289U priority Critical patent/JPH0332463U/ja
Publication of JPH0332463U publication Critical patent/JPH0332463U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Coating With Molten Metal (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案の一実施例を示す断面図、第
2図は従来のはんだレベラー装置の断面図である
。 1……吸引ノズル、2……プリント配線板、3
……はんだ槽、4……はんだ、5……ヒーター、
6……はんだ溜り、7……エアー、10……筒体
FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional solder leveler device. 1... Suction nozzle, 2... Printed wiring board, 3
...Solder bath, 4...Solder, 5...Heater,
6...Solder puddle, 7...Air, 10...Cylinder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 吸引装置に連結された吸引ノズルを形成した筒
体を設け、該筒体のエアーの通過路の一部は、そ
の内径が拡大され、はんだ溜りとなり、また該筒
体の吸引ノズルと上記はんだ溜りとの間には、吸
引したはんだを加熱するヒーターを設置したこと
を特徴とするはんだレベラー装置。
A cylindrical body formed with a suction nozzle connected to a suction device is provided, and a part of the air passage of the cylindrical body has its inner diameter expanded to become a solder pool, and the suction nozzle of the cylinder body and the solder pool are A solder leveler device characterized by a heater installed between the solder and the solder to heat the sucked solder.
JP9354289U 1989-08-09 1989-08-09 Pending JPH0332463U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9354289U JPH0332463U (en) 1989-08-09 1989-08-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9354289U JPH0332463U (en) 1989-08-09 1989-08-09

Publications (1)

Publication Number Publication Date
JPH0332463U true JPH0332463U (en) 1991-03-29

Family

ID=31642915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9354289U Pending JPH0332463U (en) 1989-08-09 1989-08-09

Country Status (1)

Country Link
JP (1) JPH0332463U (en)

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