JPH0332442U - - Google Patents
Info
- Publication number
- JPH0332442U JPH0332442U JP7527089U JP7527089U JPH0332442U JP H0332442 U JPH0332442 U JP H0332442U JP 7527089 U JP7527089 U JP 7527089U JP 7527089 U JP7527089 U JP 7527089U JP H0332442 U JPH0332442 U JP H0332442U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- heat sink
- bonding
- onto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7527089U JPH0332442U (ar) | 1989-06-27 | 1989-06-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7527089U JPH0332442U (ar) | 1989-06-27 | 1989-06-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0332442U true JPH0332442U (ar) | 1991-03-29 |
Family
ID=31615703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7527089U Pending JPH0332442U (ar) | 1989-06-27 | 1989-06-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0332442U (ar) |
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1989
- 1989-06-27 JP JP7527089U patent/JPH0332442U/ja active Pending