JPH0332415U - - Google Patents
Info
- Publication number
- JPH0332415U JPH0332415U JP9257889U JP9257889U JPH0332415U JP H0332415 U JPH0332415 U JP H0332415U JP 9257889 U JP9257889 U JP 9257889U JP 9257889 U JP9257889 U JP 9257889U JP H0332415 U JPH0332415 U JP H0332415U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- mount component
- terminal
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9257889U JPH0332415U (ro) | 1989-08-08 | 1989-08-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9257889U JPH0332415U (ro) | 1989-08-08 | 1989-08-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0332415U true JPH0332415U (ro) | 1991-03-29 |
Family
ID=31641998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9257889U Pending JPH0332415U (ro) | 1989-08-08 | 1989-08-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0332415U (ro) |
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1989
- 1989-08-08 JP JP9257889U patent/JPH0332415U/ja active Pending