JPH0331075Y2 - - Google Patents

Description

[Detailed description of the invention] (Field of industrial application) The present invention is a device for resin molding an IC main body, and is particularly a multi-plunger type device in which a number of plungers are applied to one mold. The present invention relates to a resin molding device.

(Prior Art) Conventionally, in this type of multi-plunger type resin molding device, as shown in FIGS.
The lower mold mounting base 4 mounted and connected thereto is supported so as to be slidable up and down, and can be driven up and down by an actuator such as a hydraulic cylinder 5.
A mounting base 8 for the upper mold 7 is connected and fixed to the lower part of the fixed frame 6 which is connected across the upper end of the group via a stay 9 and a reinforcing bar 9', and a stay 10 is provided upright on the upper part of the fixed frame 6. The group supports the movable frame 11 so as to be able to slide up and down, and the second group is connected to the upper end of the stay 10 group.
An actuator 13 for driving and lowering the movable frame 11 is attached to the fixed frame 12,
A pair of plunger mounting blocks 15, 15 are connected to the lower surface of the movable frame 11 and can be slid up and down along a pair of rectangular guide holes 14, 14 formed in the fixed frame 6. A large number of plungers 16 were configured to extend freely through the upper mold mount 8 and the upper mold 7.

(Problems to be solved by the invention) In the resin molding device having the above configuration, the fourth
As shown in the figure, the actuator 5 is operated to drive the lower mold mounting base 4 upward, and the lower mold 3 loaded with the IC body and molding resin material is strongly pressed against the lower surface of the upper mold 7, and then moved. The frame 11 is driven downward and the plungers 16 are plunged into the plunger pots of the upper mold 7 and lower mold 3, and the resin material heated and softened in the plunger pots is press-fitted into each cavity. Since a large through hole 14 through which the plunger mounting block 15 is inserted is formed in the center of the fixed frame 6 where a press reaction force acts, the fixed frame 6
The strength of the upper die 7 and lower die 3 is insufficient, and the fixed frame 6 is bent during the press operation, causing the upper die 7 and the lower die 3 to
A large mold burr may occur due to misalignment.

Moreover, since the movable frame 11 for raising and lowering the plunger and the second fixed frame 12 are further provided above the fixed frame 6, the height of the entire apparatus is increased.

The present invention has been developed in view of the above circumstances, and an object of the present invention is to eliminate such problems by improving the plunger lifting/lowering drive unit.

(Means for solving the problem) In order to achieve this purpose, the present invention
A lower mold mount to which a lower mold is mounted and connected is supported on a group of stays erected on the base so that it can slide up and down, and an upper mold mount is attached to the lower part of a fixed frame connected to the upper end of the stay group. A movable frame is provided between the fixed fixed frame and the upper mold mount, and the movable frame includes a group of plungers that are connected to each other through the mount and can freely pass through the mount and the upper mold. The structure is connected to a lifting actuator attached to a fixed frame.

(Function) According to this structure, there is no particularly large through hole in the fixed frame on which a large press reaction force acts, and the strength of the fixed frame is high.

(Example) Hereinafter, the present invention will be described in detail based on an example shown in the drawings. 1 and 2 show a resin molding apparatus according to an embodiment of the present invention. In these figures, 1 is a rectangular base, and a lower mold mount 4 on which a lower mold 3 is mounted and connected is supported by two groups of stays erected from the four corners of the base 1 so as to be able to slide up and down. At the same time, it is driven up and down by an actuator 5 such as a hydraulic cylinder. Reference numeral 6 denotes a fixed frame connected across the upper ends of the two groups of stays, and a mounting base 8 for the lower mold 7 is connected to the lower surface of the fixed frame 6 via four stays 9 and reinforcing bars 9'. ing.

Reference numeral 11 denotes a pair of front and rear movable frames arranged between the fixed frame 6 and the upper mold mounting base 8,
This corresponds to each piston rod 1 of a pair of hydraulic cylinders 13 attached to the center of the upper surface of the fixed frame 6.
A pair of left and right guides 17 erected from each movable frame 11 are connected to the movable frames 11 and guided through the fixed frame 6, and the movable frame 6 is driven up and down. A group of plungers 16 are attached to the lower surface of the movable frame 11 in a horizontal row, passing through the upper mold mount 8 and the lower mold 7.

(Effects) As described above, the resin molding device according to the present invention has a movable frame with a plunger group attached between the fixed frame on which a large press reaction force acts and the upper mold mounting base. Because it is driven up and down by an actuator attached to the fixed frame, there is no need to form large through holes in the fixed frame, which is subject to large press reaction forces, and the strength of the fixed frame is improved. Misalignment between the upper mold and the lower mold due to the bending of the fixed frame is prevented, and the occurrence of mold burrs can now be suppressed.

Furthermore, the height of the movable frame for raising and lowering the plunger, which can be raised and lowered, has been lowered, making it possible to lower the height of the entire device than in the prior art.

[Brief explanation of the drawing]

FIG. 1 is a front view of a resin molding device according to an embodiment of the present invention in a mold release state, FIG. 2 is a partially cutaway side view of the mold in a joined state, and FIG. 3 is a conventional equipment. FIG. 4 is a front view of the mold in the released state, and a partially cutaway side view of the mold in the joined state. In the figure, 1 is a base, 2 is a stay, 3 is a lower mold, and 7 is an upper mold.

Claims (1)

[Claims for Utility Model Registration] A lower mold mount 4 on which a lower mold 3 is mounted and connected is supported by two groups of stays installed upright on a base 1 so as to be able to slide up and down, and connected to the upper end of the two groups of stays. An upper mold mount 8 is connected to the lower part of the fixed frame 6 via a stay 9, and a movable frame 11 is provided with a group of plungers 16 that can freely pass through the upper mold mount 8 and the upper mold 7. , a resin molding device for electronic components, which is disposed between the fixed frame 6 and the upper mold mounting base 8, and the movable frame 11 is connected to a lifting actuator 13 attached to the fixed frame 6.