JPH0331034Y2 - - Google Patents

Description

[Detailed Description of the Invention] <Technical Field> The present invention relates to a high-frequency heating device such as a microwave oven, and particularly relates to the arrangement of a sub-cavity that improves heating uniformity in high-frequency heating by changing oven impedance.

<Prior art> Figure 3 is a perspective view of a conventional high frequency heating device.
The figure is a sectional view of the main part of FIG. 3.

Conventionally, methods for improving heating uniformity in high-frequency heating include changing the position and/or size of the power feed port 2 provided on the top surface of the oven 1, or changing the position and/or size of the power feed port 2 provided on the top surface of the oven 1, or changing the size of the waveguide 3 as shown in FIG. Power supply port 2
There was one in which the sides were partitioned with a metal partition plate 4, divided into a waveguide part A and a subcavity part B, and the size of the subcavity was changed to change the oven impedance. In addition, 5 in the figure is a magnetron, and 6 is a high voltage transformer.

However, recently as a space-saving type microwave oven, a magnetron 5, a high-voltage transformer 6, and a high-voltage condenser 7 are installed on the top of the oven 1 as shown in Figure 5.
Products equipped with electrical components for high frequency generation such as the above and a cooling device 8 for these components have been developed and are being sold.

Due to space limitations, the waveguide 3 of the microwave oven is erected on the oven ceiling wall 9 with its length being vertical, as shown in FIG. In that configuration, changing the position of the feed port 2 to improve heating uniformity means changing the positions of the waveguide 3 and magnetron 5, and changing the size of the feed port 2 means changing the position of the waveguide 3 and the magnetron 5 to improve heating uniformity. The size of the tube 3 has to be changed, and considering the arrangement of electrical components in the space above the compact oven 1, it is not easy to change the position and/or size, and it is difficult to improve the heating uniformity sufficiently. Ta.

Moreover, if the waveguide 3 is arranged at a position where heating uniformity is good, the position of the magnetron 5 attached to the waveguide 3 is also determined, which poses a big restriction on the arrangement of the cooling device 8 and the cooling air passage. Therefore, efficient cooling could not be achieved.

<Purpose> The present invention was developed in view of the above points, and aims to improve the heating uniformity of the oven while maintaining the compactness of the high-frequency heating device.

<Example> An example of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view of the main parts of the present invention, and the same or equivalent parts as in the conventional example are given the same reference numerals. 10 is the sub-cavity of the present invention, which is arranged between the ceiling wall 9 of the oven 1 and the magnetron 5 to save space, and the waveguide 3 is used as one side wall of the sub-cavity 10 to reduce costs. It's on.

FIG. 2 shows that by changing the a dimension of the sub-cavity 10 in FIG. 1, the horizontal plane heating uniformity at the center of the oven 1, shown by the solid line, and the vertical plane heating uniformity, at the center of the oven 1, shown by the broken line, change. FIG. Note that the curve differs depending on the shape and volume of the oven.

Further, in the above embodiment, the waveguide 3 and the sub-cavity 10 are provided in a row, but they may be provided separately. Of course, the present invention is not limited to this, and the same structure may be applied to the peripheral side wall or the bottom wall of the oven 1.

<Effects> According to the present invention, the opening size a is formed between the magnetron 5 adjacent to the power supply port 2 and the oven 1 to a size that changes the oven impedance and shows maximum heating uniformity of the oven. Since the sub-cavity 10 is provided, this sub-cavity is provided between the magnetron 5 and the oven 1 as a dead space. Therefore, the power supply port 2 is installed on the ceiling wall of the oven 1.
In order to make the oven more compact and improve heating uniformity by forming a waveguide 3 upright in this power supply port 2 and providing a magnetron 5 on the side surface of the tip of this waveguide 3. By providing the above-mentioned subcavity 10 in the above-mentioned dead space, it is possible to improve the heating uniformity of the oven while maintaining the compactness of the entire apparatus.

[Brief explanation of the drawing]

Fig. 1 is a sectional view of the main part of the present invention, Fig. 2 is a relationship diagram showing changes in heating uniformity with changes in the subcavity, Fig. 3 is a perspective view of the main part of a conventional high-frequency heating device, and Fig. 4 is FIG. 5 is a perspective view of a main part of another conventional high-frequency heating device, and FIG. 6 is a sectional view of a main part of FIG. 5. Code, 1: Oven, 3: Waveguide, 5: Magnetron, 10: Subcavity.

Claims (1)

[Claim for Utility Model Registration] A power supply port 2 is formed on the ceiling wall of the oven 1, a waveguide 3 is provided upright in the power supply port 2, and a magnetron 5 is provided on the side surface of the tip of the waveguide 3. , a sub-cavity 1 formed between the magnetron 5 adjacent to the power supply port 2 and the oven 1, the opening dimension a of which changes the oven impedance and exhibits maximum heating uniformity of the oven;
A high frequency heating device characterized by providing a zero.