JPH0330489U - - Google Patents
Info
- Publication number
- JPH0330489U JPH0330489U JP8674790U JP8674790U JPH0330489U JP H0330489 U JPH0330489 U JP H0330489U JP 8674790 U JP8674790 U JP 8674790U JP 8674790 U JP8674790 U JP 8674790U JP H0330489 U JPH0330489 U JP H0330489U
- Authority
- JP
- Japan
- Prior art keywords
- housing
- cooling
- housed
- adjusting
- temperature sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 238000004378 air conditioning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図および第２図は各々、本考案に係る電子
機器収容ユニツトの斜視図および空調系統図であ
る。
１……電子回路パツケージ、２……モジユラユ
ニツト、３，３ａ……給気用エアダクト、４……
還気用エアダクト、５……ケーブルダクト、９…
…冷却装置、１１……側面パネル、１２……天井
パネル。
1 and 2 are a perspective view and an air conditioning system diagram of an electronic equipment housing unit according to the present invention, respectively. 1...Electronic circuit package, 2...Modular unit, 3, 3a...Air supply duct, 4...
Return air duct, 5... Cable duct, 9...
...Cooling device, 11...Side panel, 12...Ceiling panel.
Claims (1)
該筺体内に、各ユニツトが電子機器を有する複数
個のモジユラユニツトを収納するとともに該筺体
内部で電子機器冷却用空気を循環させるためのエ
アダクトおよびケーブルダクトを収納し、且つ、
各モジユラユニツトに対応して温度センサと、各
モジユラユニツトの冷却用空気の循環を調整する
ダンパとを設け、該温度センサの検知信号に基づ
いて該ダンパの開度を調整する制御回路を具備し
、該筺体を冷却装置とともに一体化した電子機器
収容ユニツト。 The housing is made up of insulation and shielding panels,
A plurality of modular units each having an electronic device are housed in the housing, and an air duct and a cable duct for circulating air for cooling the electronic devices inside the housing are housed, and
A temperature sensor and a damper for adjusting the circulation of cooling air for each modular unit are provided corresponding to each modular unit, and a control circuit is provided for adjusting the opening degree of the damper based on the detection signal of the temperature sensor. An electronic device housing unit that integrates a housing with a cooling device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8674790U JPH0330489U (en) | 1990-08-21 | 1990-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8674790U JPH0330489U (en) | 1990-08-21 | 1990-08-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330489U true JPH0330489U (en) | 1991-03-26 |
Family
ID=31636373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8674790U Pending JPH0330489U (en) | 1990-08-21 | 1990-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330489U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012059919A (en) * | 2010-09-09 | 2012-03-22 | Nippon Steel Engineering Co Ltd | Cooling system |
-
1990
- 1990-08-21 JP JP8674790U patent/JPH0330489U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012059919A (en) * | 2010-09-09 | 2012-03-22 | Nippon Steel Engineering Co Ltd | Cooling system |
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