JPH0330460U - - Google Patents
Info
- Publication number
- JPH0330460U JPH0330460U JP9077789U JP9077789U JPH0330460U JP H0330460 U JPH0330460 U JP H0330460U JP 9077789 U JP9077789 U JP 9077789U JP 9077789 U JP9077789 U JP 9077789U JP H0330460 U JPH0330460 U JP H0330460U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- conductor
- insulating substrate
- substrate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図は、本考案の実施例を示す基板の断面図
、第2図は、本考案の他の実施例を示す断面図で
ある。 1,12……チツプ部品、2,6……絶縁基板
、3,13……貫通孔、4,10,11……導電
体。
、第2図は、本考案の他の実施例を示す断面図で
ある。 1,12……チツプ部品、2,6……絶縁基板
、3,13……貫通孔、4,10,11……導電
体。
Claims (1)
- 絶縁基板の表面に導電体を形成し、該基板の貫
通穴に垂直にチツプ部品を挿入し、該チツプ部品
の両端を該絶縁基板表面の導電体と固着したこと
を特徴とするチツプ部品の搭載構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9077789U JPH0330460U (ja) | 1989-07-31 | 1989-07-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9077789U JPH0330460U (ja) | 1989-07-31 | 1989-07-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0330460U true JPH0330460U (ja) | 1991-03-26 |
Family
ID=31640289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9077789U Pending JPH0330460U (ja) | 1989-07-31 | 1989-07-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0330460U (ja) |
-
1989
- 1989-07-31 JP JP9077789U patent/JPH0330460U/ja active Pending