JPH0329831B2 - - Google Patents
Info
- Publication number
- JPH0329831B2 JPH0329831B2 JP57029273A JP2927382A JPH0329831B2 JP H0329831 B2 JPH0329831 B2 JP H0329831B2 JP 57029273 A JP57029273 A JP 57029273A JP 2927382 A JP2927382 A JP 2927382A JP H0329831 B2 JPH0329831 B2 JP H0329831B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- powder
- rubber
- synthetic resin
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000843 powder Substances 0.000 claims description 23
- 238000004070 electrodeposition Methods 0.000 claims description 21
- 229920003002 synthetic resin Polymers 0.000 claims description 15
- 239000000057 synthetic resin Substances 0.000 claims description 15
- 125000002091 cationic group Chemical group 0.000 claims description 10
- 229920001971 elastomer Polymers 0.000 claims description 10
- 239000005060 rubber Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000008199 coating composition Substances 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 229920000459 Nitrile rubber Polymers 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 150000007513 acids Chemical class 0.000 claims description 5
- 239000004816 latex Substances 0.000 claims description 5
- 229920000126 latex Polymers 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 3
- 230000003472 neutralizing effect Effects 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 19
- 239000002184 metal Substances 0.000 description 19
- 238000000576 coating method Methods 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229960000583 acetic acid Drugs 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- -1 1562 (Nippon Zeon Substances 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical class C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical group C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical class OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000012362 glacial acetic acid Substances 0.000 description 1
- 229940093915 gynecological organic acid Drugs 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 235000011167 hydrochloric acid Nutrition 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000004027 organic amino compounds Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
Landscapes
- Paints Or Removers (AREA)
Description
【発明の詳細な説明】
本発明は、金属芯入りプリント配線板の製造に
於て金属芯表面上に絶縁層を形成させる場合等に
好適に使用される粉体含有電着塗料組成物に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a powder-containing electrodeposition coating composition suitable for forming an insulating layer on the surface of a metal core in the production of a printed wiring board with a metal core.
金属芯入りプリント配線板は、金属芯表面上を
絶縁化処理し、所定の回路を形成させたもので、
機械的強度、熱放散性に特長を有するものであ
る。 A printed wiring board with a metal core has the surface of the metal core insulated to form a predetermined circuit.
It is characterized by mechanical strength and heat dissipation.
金属芯表面上を絶縁化処理するには種々の方法
が提案されているが、その一つに電着絶縁塗装法
がある。 Various methods have been proposed for insulating the surface of a metal core, one of which is an electrodeposited insulating coating method.
電着絶縁塗装法は、従来から自動車ボデーの耐
食性下地塗装として普及しておりまた、この技術
を穴あけした板状金属基板の絶縁化に利用して新
規な金属芯プリント配線板の製造技術も提案され
ている(特公昭56−39076、特公昭55−24716、特
開昭54−13968、53−111471、53−111470、特公
昭50−8494)。しかし、これらの技術は、金属部
分の絶縁化に関する考慮がその生たる技術内容で
あるため、プリント配線板に要求される他の特
性、例えばハンダ耐熱性、導体と絶縁塗膜との密
着性に劣り、フクレ等の不良現象に対して適切な
解決策を提案していない。 Electrodeposition insulation coating has been widely used as a corrosion-resistant base coating for automobile bodies, and we have also proposed a new manufacturing technology for metal-core printed wiring boards by using this technology to insulate plate-shaped metal substrates with holes. (Special Publication No. 56-39076, Special Publication No. 55-24716, Japanese Patent Publication No. 54-13968, No. 53-111471, No. 53-111470, Special Publication No. 1984-8494). However, since these technologies are based on consideration of insulating metal parts, they are not compatible with other properties required for printed wiring boards, such as solder heat resistance and adhesion between conductors and insulating coatings. Appropriate solutions are not proposed for defective phenomena such as inferiority and blistering.
金属芯の絶縁層と回路導体間の密着力付与のた
めに従来技術では電着塗装後、電着塗膜上には、
ニトリルゴム系の接着剤を塗布する必要があつ
た。したがつて、この方法では、接着塗布工程に
起因する製造コストや作業環境上のデメリツトだ
けでなく、穴つまりが起きないようにする塗装が
極めて困難であるので穴径を1.2mmφ程度と大き
くとらざるを得なかつた。 In order to provide adhesion between the insulating layer of the metal core and the circuit conductor, in conventional technology, after electrodeposition coating,
It was necessary to apply a nitrile rubber adhesive. Therefore, this method not only has the disadvantages of manufacturing costs and work environment due to the adhesive application process, but also has the disadvantage of making the hole diameter as large as about 1.2 mm, since it is extremely difficult to paint the hole to prevent it from clogging. I had no choice.
本発明はこのような点に鑑みてなされたもの
で、金属芯入りプリント配線板の金属芯表面上に
絶縁層を形成させる場合等に好適に使用される粉
体含有電着塗料組成物を提供するものである。 The present invention has been made in view of these points, and provides a powder-containing electrodeposition coating composition suitable for forming an insulating layer on the surface of a metal core of a printed wiring board with a metal core. It is something to do.
本発明の粉体含有電着塗料組成物は、
A 分子中に窒素を含む塩基性樹脂を部分的に酸
性化合物で中和することにより水希釈性能を付
与されたカチオン性合成樹脂、
B 常温では固体であり加熱により溶融硬化する
合成樹脂微粉体、
C ゴム
を含むことを特徴とするものである。 The powder-containing electrodeposition coating composition of the present invention consists of: A: a cationic synthetic resin that has been given water dilutability by partially neutralizing a basic resin containing nitrogen in its molecules with an acidic compound; B: at room temperature: It is characterized by containing C rubber, a synthetic resin fine powder that is solid and melts and hardens when heated.
分子中に窒素を含む塩基性樹脂としては、エポ
キシ樹脂またはエポキシ変性樹脂中のエポキシ基
に種の有機アミノ化合物を付加反応させたアミノ
基付加エポキシ樹脂、アミノ基を有するアクリル
酸エステルおよびメタクリル酸エステル、ビニル
ピリジン類およびビニルイミダゾール類等の窒素
を有するアクリル系またはビニル系化合物と、遊
離酸基を有しないビニル化合物との共重合体から
得られるアミノ基含有アクリル酸エステル、アミ
ノ基含有ビニル化合物共重合体、及びポリアミド
樹脂等が使用される。 Examples of basic resins containing nitrogen in the molecule include amino group-added epoxy resins obtained by addition-reacting organic amino compounds to epoxy groups in epoxy resins or epoxy-modified resins, acrylic esters and methacrylic esters having amino groups. , amino group-containing acrylic acid esters obtained from copolymers of nitrogen-containing acrylic or vinyl compounds such as vinylpyridines and vinylimidazole, and vinyl compounds having no free acid groups; Polymers, polyamide resins, etc. are used.
塩基性樹脂を中和する酸性化合物としては塩
酸、リン酸、ギ酸、酢酸、プロピオン酸、クエン
酸、リンゴ酸、酒石酸、アクリル酸等が有用であ
るが、その他の無機酸、有機酸も使用し得る。 As acidic compounds that neutralize basic resins, hydrochloric acid, phosphoric acid, formic acid, acetic acid, propionic acid, citric acid, malic acid, tartaric acid, acrylic acid, etc. are useful, but other inorganic acids and organic acids can also be used. obtain.
塩基性樹脂のアミノ基に対して、酸性化合物を
0.2当量乃至3当量、好ましくは0.5当量乃至1.5当
量添加し十分混合することにより水希釈性能を付
与されたカチオン性合成樹脂が得られる。 Adding acidic compounds to the amino groups of basic resins
By adding 0.2 equivalents to 3 equivalents, preferably 0.5 equivalents to 1.5 equivalents and mixing thoroughly, a cationic synthetic resin imparted with water diluting performance can be obtained.
カチオン性合成樹脂としては、例えば、エポキ
シ当量200〜2400のエポキシ樹脂と1級または2
級アミンの付加物を酸性化合物で水溶性化したも
のが使用される。 As the cationic synthetic resin, for example, an epoxy resin with an epoxy equivalent of 200 to 2400 and a primary or secondary
An adduct of a grade amine made water-soluble with an acidic compound is used.
常温では固体であり、加熱により溶融硬化する
合成樹脂としては、エポキシ樹脂、ポリエステル
樹脂、アクリル樹脂がある。粉体粒径は1〜
20μmが好ましい。常温では固体であり、加熱に
より溶融硬化する合成樹脂微粉体としてエポキシ
当量400〜2400のエポキシ樹脂および硬化剤から
なる展色剤50〜80重量部および顔料50〜20重量部
からなる粒径3〜15μmのものが使用される。 Synthetic resins that are solid at room temperature and melt and harden when heated include epoxy resins, polyester resins, and acrylic resins. Powder particle size is 1~
20 μm is preferred. A synthetic resin fine powder that is solid at room temperature and melts and hardens when heated, with a particle size of 3 to 50 parts by weight, consisting of an epoxy resin with an epoxy equivalent of 400 to 2,400, a color vehicle consisting of 50 to 80 parts by weight of a hardening agent, and 50 to 20 parts by weight of a pigment. 15 μm is used.
微粉体対カチオン性樹脂の重量比は0.5〜20:
1が好ましい。 The weight ratio of fine powder to cationic resin is 0.5 to 20:
1 is preferred.
ゴムとしては、スチレン−ブタジエンゴム
(SBR)、アクリロニトリル−ブタジエンゴム
(NBR)が使用される。 As the rubber, styrene-butadiene rubber (SBR) and acrylonitrile-butadiene rubber (NBR) are used.
スチレン−ブタジエンゴムとしては、スチレン
成分を20〜40重量%含むものが、又、アクリロニ
トリル−ブタジエンゴムとしては、アクリロニト
リル基を18〜14重量%含むものが好ましい。 The styrene-butadiene rubber preferably contains 20 to 40% by weight of a styrene component, and the acrylonitrile-butadiene rubber preferably contains 18 to 14% by weight of acrylonitrile groups.
ゴムは、カチオン性合成樹脂と合成樹脂微粉体
の合計重量を100としたとき、0.5〜50重量部添加
するのが好ましい。望ましくは1〜10重量部であ
る。ゴム添加量が、0.5重量部未満では、電着塗
膜を化学粗化した場合十分な粗化面が得られず、
又、ゴム添加量が50重量部を越えると、得られる
電着塗膜厚は10μm以下と極端に薄くなるため1
〜10重量部の添加が100μm前後の塗膜厚をうる方
法としては最適である。 The rubber is preferably added in an amount of 0.5 to 50 parts by weight when the total weight of the cationic synthetic resin and the synthetic resin fine powder is 100. The amount is preferably 1 to 10 parts by weight. If the amount of rubber added is less than 0.5 parts by weight, a sufficiently roughened surface will not be obtained when the electrodeposited coating is chemically roughened.
Furthermore, if the amount of rubber added exceeds 50 parts by weight, the thickness of the electrodeposited coating film obtained will be extremely thin, less than 10 μm.
Addition of ~10 parts by weight is optimal as a method for obtaining a coating thickness of around 100 μm.
ゴムは、カチオン性合成樹脂、合成樹脂微粉体
或は、それらの水分散液中にラテツクス状の形で
添加すのが好ましい。又、合成樹脂微粉体に練り
込こむとも出来る。 The rubber is preferably added in the form of a latex to the cationic synthetic resin, synthetic resin fine powder, or aqueous dispersion thereof. It can also be kneaded into synthetic resin fine powder.
粉体含有電着塗料は水中に固形分5〜20重量%
となるように分散して使用される。 Powder-containing electrodeposition paint has a solid content of 5 to 20% by weight in water.
It is used in a distributed manner.
金属芯としては、必要に応じて多数の貫通孔を
有す鉄、アルミニウム等の平板、これらの金属平
板の両面がプリプレグを積層するなどの方法によ
り予じめ絶縁化されており、平板端部(貫通孔を
有する場合は、孔内壁)のみに金属が露出してい
るもの、又、上記の予じめ形成された表面絶縁層
のさらに外側に銅箔が積層されたものなどが使用
される。金属基板に予じめ形成された絶縁層に
は、CrO3/H2SO4等の強酸化性処理液によつて
化学粗化される成分を含有させておくことが好ま
しい。 The metal core is a flat plate made of iron, aluminum, etc. that has a large number of through holes as necessary, and both sides of these metal plates are insulated in advance by a method such as laminating prepreg, and the ends of the flat plate are Metal is exposed only on the inner wall of the hole (if it has a through hole), or copper foil is laminated on the outside of the pre-formed surface insulation layer. . Preferably, the insulating layer previously formed on the metal substrate contains a component that can be chemically roughened by a strongly oxidizing treatment liquid such as CrO 3 /H 2 SO 4 .
電着条件は、槽電圧が1〜25Vとなるようにす
ることが好ましい。 The electrodeposition conditions are preferably such that the cell voltage is 1 to 25V.
金属芯に本発明の粉体含有電着塗料組成物によ
り電着塗膜の絶縁層を形成させた後120〜180℃で
30〜90分硬化させ、CrO3/H2SO4混液、
Na2Cr2O3/NaF/H2SO4混液等で化学粗化後、
無電解めつき、又は無電解めつき、電気めつきの
併用により回路加工が行なわれる。この場合、回
路加工が容易であり、無電解めつきによる導体と
電着塗膜絶縁層の密着性が優れるものであつた。 After forming an insulating layer of an electrocoating film on a metal core using the powder-containing electrocoating composition of the present invention,
After curing for 30 to 90 minutes, CrO 3 /H 2 SO 4 mixture,
After chemical roughening with a mixture of Na 2 Cr 2 O 3 /NaF/H 2 SO 4 , etc.
Circuit processing is performed by electroless plating or a combination of electroless plating and electroplating. In this case, circuit processing was easy, and the adhesion between the conductor and the electrodeposited insulating layer by electroless plating was excellent.
又、本発明による粉体含有電着塗料組成物によ
る電着塗膜は、柔軟性、可撓性に優れ、クラツク
が入りにくいもので、振動の激しい金属面例え
ば、自動車、農機具等の塗装、熱収縮の大きい金
属面、例えば、ガードレール、空調器等の塗装、
更には、下塗り、中塗りに使用し、それらの上下
層の塗膜の熱収縮差による歪を緩和する場合等に
も広く用いられる。 Further, the electrodeposition coating film made from the powder-containing electrodeposition coating composition according to the present invention has excellent flexibility and flexibility, and is resistant to cracking, and is suitable for coating metal surfaces subject to strong vibrations, such as automobiles, agricultural machinery, etc. Painting of metal surfaces with large heat shrinkage, such as guardrails, air conditioners, etc.
Furthermore, it is widely used in undercoating and intermediate coating to alleviate distortion caused by the difference in thermal shrinkage between the upper and lower coatings.
実施例
金属基板上に、絶縁被膜を施す塗料として以下
のものを試験に供した。(部は重量部)
(1) 粉体粒子
エポキシ樹脂 エピコート1007
(シエル化学) 400部
イソシアネート硬化剤EH−118
−2(旭電化) 360部
顔料−1 チタンR−80
(石原産業) 210部
顔料−2 カーボンMA−100
(三菱化成) 0.5部
を通常の粉体製造方法により、エクストルーダー
で溶融混練りし、衝撃式粉砕機で平均粒子径
12.5μの粉体塗料粒子を得た。Example The following paints for forming an insulating film on a metal substrate were tested. (Parts are parts by weight) (1) Powder particles Epoxy resin Epicoat 1007 (Ciel Chemical) 400 parts Isocyanate curing agent EH-118-2 (Asahi Denka) 360 parts Pigment-1 Titanium R-80 (Ishihara Sangyo) 210 parts Pigment -2 0.5 part of Carbon MA-100 (Mitsubishi Kasei) was melted and kneaded using an extruder using a normal powder manufacturing method, and the average particle size was reduced using an impact crusher.
12.5μ powder coating particles were obtained.
(2) 水稀釈性カチオン性樹脂
エピコート1001 488部
ジエタノールアミン 105部
イソプロピルアルコール 250部
を80℃で3時間還流下に反応させて液状の樹脂を
得た。(2) Water-dilutable cationic resin Epicote 1001 488 parts diethanolamine 105 parts isopropyl alcohol 250 parts were reacted under reflux at 80°C for 3 hours to obtain a liquid resin.
(3) NBRラテツクス、1562(日本ゼオン、中ニト
リル)、をエマルゲン920(花王石ケン、非イオ
ン性界面活性剤)を1重量%含む水中に撹拌し
ながら添加してラテツクスの10重量%水溶液を
作つた。(3) NBR latex, 1562 (Nippon Zeon, medium nitrile), was added to water containing 1% by weight of Emulgen 920 (Kao Sekiken, nonionic surfactant) with stirring to make a 10% by weight aqueous solution of latex. I made it.
上記カチオン性樹脂857部に氷酢酸38部および
脱イオン水5105部を加えて、デイゾルバーで十分
撹拌し、次いで上記粉体塗料粒子5400部を加え、
高速回転ホモジナイザーで30分間混合分散させた
後、これを固形分20%になるまで脱イオン水で稀
釈調整し、30000部の粉体電着塗料用溶液を作成
した。 Add 38 parts of glacial acetic acid and 5105 parts of deionized water to 857 parts of the above cationic resin, stir thoroughly with a dissolver, then add 5400 parts of the above powder coating particles,
After mixing and dispersing for 30 minutes using a high-speed rotating homogenizer, the mixture was diluted with deionized water to a solid content of 20% to prepare 30,000 parts of a powder electrodeposition coating solution.
さらに上記塗料用溶液に対し、上記(3)のラテツ
クス溶液を6000部加え、電着塗料を作成した。 Further, 6000 parts of the latex solution (3) above was added to the above coating solution to prepare an electrodeposition coating.
電着槽に上記塗料をうつし、被着物として、リ
ン酸処理した多数の直径1mmの穴をもつ鉄基板
(250×280×0.8mm)を浸漬し、Pt−Tiネツトを陰
極、金属基板を陽極として約30秒間電着した。 The above paint was transferred to an electrodeposition tank, and a phosphoric acid-treated iron substrate (250 x 280 x 0.8 mm) with many holes of 1 mm in diameter was immersed as a deposit, with the Pt-Ti net serving as the cathode and the metal substrate serving as the anode. Electrodeposition was performed for about 30 seconds.
電着条件
浴液温度 22℃
極 比 −○/+○=1/1
極 間 15cm
電 圧 20V
時 間 30秒
電着後、清水で水洗し、その後焼付を行なつ
た。焼付条件は80℃×10分、次いで80℃から200
℃まで15分間で昇温し、更に200℃×15分焼付を
行なつた。得られた塗膜は均一で美しい外観を示
し、膜厚は120μであつた。 Electrodeposition conditions: Bath temperature: 22°C; electrode ratio: -○/+○=1/1; electrode spacing: 15cm; voltage: 20V; time: 30 seconds. After electrodeposition, the electrodeposition was washed with clean water, and then baked. Baking conditions are 80℃ x 10 minutes, then 200℃ from 80℃
The temperature was raised to ℃ over 15 minutes, and baking was further performed at 200℃ for 15 minutes. The resulting coating film had a uniform and beautiful appearance and a film thickness of 120 μm.
耐圧は2.5kV以上あり、また、CrO3(100g)、
H2SO4(300g)よりなる50℃の化学粗化液で15分
間粗化したところ、良好粗化表面が得られた。ま
た常法に従つて無電解銅めつきを1μ、電気銅め
つき35μmした所、導体ビール強度は平面部で2.0
Kg/cm以上あり、260℃、60秒処理でフクレ等は
発生しなかつた。 The withstand voltage is over 2.5kV, and CrO 3 (100g),
When roughened for 15 minutes with a chemical roughening solution of H 2 SO 4 (300 g) at 50°C, a well-roughened surface was obtained. In addition, when electroless copper plating was applied to 1 μm and electrolytic copper plating was applied to 35 μm according to the conventional method, the conductor beer strength was 2.0 on the flat surface.
Kg/cm or more, and no blistering occurred after processing at 260°C for 60 seconds.
Claims (1)
に酸性化合物で中和することにより水希釈性能
を付与されたカチオン性合成樹脂、 B 常温では固体であり加熱により溶融硬化する
合成樹脂微粉体、 C ゴム を含み、ゴムがカチオン性合成樹脂と合成樹脂微
粉体の合計重量100部に対して0.5〜50重量部であ
る粉体含有電着塗料組成物。 2 ゴムがラテツクス状である特許請求の範囲第
1項記載の粉体含有電着塗料組成物。 3 ゴムが、スチレン−ブタジエンゴム、アクリ
ロニトリル−ブタジエンゴムである特許請求の範
囲第1項または第2項のうちいずれかに記載の粉
体含有電着塗料組成物。[Scope of Claims] 1 A: A cationic synthetic resin that has water-dilutable properties by partially neutralizing a basic resin containing nitrogen in its molecules with an acidic compound; B: A solid at room temperature and melts when heated. A powder-containing electrodeposition coating composition containing a hardening synthetic resin fine powder and C rubber, wherein the rubber is 0.5 to 50 parts by weight based on 100 parts of the total weight of the cationic synthetic resin and the synthetic resin fine powder. 2. The powder-containing electrodeposition coating composition according to claim 1, wherein the rubber is in the form of latex. 3. The powder-containing electrodeposition coating composition according to claim 1 or 2, wherein the rubber is styrene-butadiene rubber or acrylonitrile-butadiene rubber.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2927382A JPS58145770A (en) | 1982-02-24 | 1982-02-24 | Powder-containing electrodeposition coating composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2927382A JPS58145770A (en) | 1982-02-24 | 1982-02-24 | Powder-containing electrodeposition coating composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58145770A JPS58145770A (en) | 1983-08-30 |
JPH0329831B2 true JPH0329831B2 (en) | 1991-04-25 |
Family
ID=12271667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2927382A Granted JPS58145770A (en) | 1982-02-24 | 1982-02-24 | Powder-containing electrodeposition coating composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58145770A (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5115861A (en) * | 1974-07-30 | 1976-02-07 | Nasu Kazuhito | |
JPS5388832A (en) * | 1977-01-17 | 1978-08-04 | Shinto Paint Co Ltd | Improved powder coating composition for electrodeposition |
JPS5394346A (en) * | 1977-01-27 | 1978-08-18 | Shinto Paint Co Ltd | Novel powder coating composition for electrodeposition |
JPS5397034A (en) * | 1977-02-04 | 1978-08-24 | Nippon Oil Co Ltd | Cathod depositin-type electrodeposition coating composition |
JPS56110772A (en) * | 1980-02-07 | 1981-09-02 | Nippon Zeon Co Ltd | Composition for electrodepositing paint |
JPS57108168A (en) * | 1980-12-25 | 1982-07-06 | Nippon Soda Co Ltd | Dual layer forming-type electrostatic paint composition and electrostatic coating |
-
1982
- 1982-02-24 JP JP2927382A patent/JPS58145770A/en active Granted
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5115861A (en) * | 1974-07-30 | 1976-02-07 | Nasu Kazuhito | |
JPS5388832A (en) * | 1977-01-17 | 1978-08-04 | Shinto Paint Co Ltd | Improved powder coating composition for electrodeposition |
JPS5394346A (en) * | 1977-01-27 | 1978-08-18 | Shinto Paint Co Ltd | Novel powder coating composition for electrodeposition |
JPS5397034A (en) * | 1977-02-04 | 1978-08-24 | Nippon Oil Co Ltd | Cathod depositin-type electrodeposition coating composition |
JPS56110772A (en) * | 1980-02-07 | 1981-09-02 | Nippon Zeon Co Ltd | Composition for electrodepositing paint |
JPS57108168A (en) * | 1980-12-25 | 1982-07-06 | Nippon Soda Co Ltd | Dual layer forming-type electrostatic paint composition and electrostatic coating |
Also Published As
Publication number | Publication date |
---|---|
JPS58145770A (en) | 1983-08-30 |
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