JPH0329755Y2 - - Google Patents
Info
- Publication number
- JPH0329755Y2 JPH0329755Y2 JP7792084U JP7792084U JPH0329755Y2 JP H0329755 Y2 JPH0329755 Y2 JP H0329755Y2 JP 7792084 U JP7792084 U JP 7792084U JP 7792084 U JP7792084 U JP 7792084U JP H0329755 Y2 JPH0329755 Y2 JP H0329755Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- signal processing
- processing circuit
- microphone
- molding agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003795 chemical substances by application Substances 0.000 claims description 19
- 238000000465 moulding Methods 0.000 claims description 19
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
Description
【考案の詳細な説明】
（産業上の利用分野）
この考案は、超音波送波マイク、受波マイクと
信号処理回路をケース内に一体に収容した超音波
送受波器に関する。[Detailed Description of the Invention] (Field of Industrial Application) This invention relates to an ultrasonic transducer in which an ultrasonic transmitting microphone, a receiving microphone, and a signal processing circuit are integrally housed in a case.
（考案の背景）
従来、超音波送波マイクと受波マイクをケース
内に一体に収容した超音波送受波器が提案されて
おり、本願出願人も、先に特願昭58−188371号
（特開昭60−80782号公報）において同技術を提示
している。(Background of the invention) Conventionally, an ultrasonic transducer in which an ultrasonic transmitting microphone and an ultrasonic receiving microphone are housed integrally in a case has been proposed, and the applicant of the present application also previously proposed Japanese Patent Application No. 188371/1983 ( The same technology was presented in Japanese Patent Application Laid-Open No. 60-80782).
ところで、本願考案者らが、さらに研究を重ね
ていくうちに、上記の超音波送受波器に、信号処
理回路をも一体に組込むことを発案し、先ず第１
図に示す構成を考えた。 By the way, as the inventors of this application continued their research, they came up with the idea of incorporating a signal processing circuit into the above-mentioned ultrasonic transducer.
We considered the configuration shown in the figure.
ケース１内に、インシユレータ５を介して送波
マイク４Ｔと受波マイク４Ｒが固定されており、
これらの間に信号処理回路６が配設されている。 A transmitting microphone 4T and a receiving microphone 4R are fixed in the case 1 via an insulator 5,
A signal processing circuit 6 is arranged between these.
この信号処理回路６は、送波マイク４Ｔと受波
マイク４Ｒの押さえ板を兼る基板２に組付けられ
ている。 This signal processing circuit 6 is assembled on a substrate 2 which also serves as a holding plate for the transmitting microphone 4T and the receiving microphone 4R.
さらに、基板２の裏側（図中では上方）からモ
ールド剤３が流し込まれて、ケース１の裏面が封
止されている。また、このモールド剤３は、基板
２に形成された貫通口H0を介して信号処理回路
６の周囲にも充填される。 Furthermore, a molding agent 3 is poured from the back side of the substrate 2 (from above in the figure), and the back side of the case 1 is sealed. The molding agent 3 is also filled around the signal processing circuit 6 through the through hole H 0 formed in the substrate 2 .
しかしながら、上記の構成とした場合、上記貫
通口H0を形成するスペースが必要であるため、
ケース１の幅Ｂが長くなることと、ケース１にポ
リプロピレン等に撥水性を有する材料を用いる
と、ケース１とモールド剤３との接着力が低くな
るために、充分な封止を行なうには、モールド剤
３の厚さＡを大きくする必要があること等の理由
により、小型化に限界が生じることが判明した。 However, in the case of the above configuration, a space is required to form the through hole H0 , so
If the width B of the case 1 becomes longer and if a water-repellent material such as polypropylene is used for the case 1, the adhesive force between the case 1 and the molding agent 3 will decrease, so it is difficult to achieve sufficient sealing. It has been found that there is a limit to miniaturization due to reasons such as the need to increase the thickness A of the molding agent 3.
（考案の目的）
この考案の目的は、ケースの封止を確実に行な
うとともに、小型化を可能とした超音波送受波器
を提供することにある。(Purpose of the invention) The purpose of the invention is to provide an ultrasonic transducer whose case can be reliably sealed and whose size can be reduced.
（考案の構成）
上記目的を達成するために、本考案は、超音波
送波マイク、受波マイク、信号処理回路が基板に
取付けられて一体的に収容されるケースの裏面
に、裏蓋を密着させてケース裏面を封止するとと
もに、ケースの裏面を除く面にモールド剤注入口
を設けて、該注入口からケース内の信号処理回路
収容室にモールド剤を充填させ、信号処理回路を
モールドしたことを特徴とする。(Structure of the invention) In order to achieve the above object, the invention provides a back cover on the back side of a case in which an ultrasonic transmitting microphone, a receiving microphone, and a signal processing circuit are attached to a board and housed integrally. At the same time, a molding agent injection port is provided on the surface other than the back surface of the case, and the signal processing circuit housing chamber in the case is filled with molding agent from the injection port, and the signal processing circuit is molded. It is characterized by what it did.
（実施例の説明）
本考案の一実施例を第２図および第３図に示
す。なお、両図において、前記第１図に示したも
のと同一構成部分には同一符号を付してある。(Description of an Embodiment) An embodiment of the present invention is shown in FIGS. 2 and 3. In both figures, the same components as those shown in FIG. 1 are designated by the same reference numerals.
ケース１１は、プラスチツクの成形体で構成さ
れ、中央部に信号処理回路６を収容する室１３、
その両側には、超音波送波マイク４Ｔあるいは受
波マイク４Ｒを収容する室１０Ｔ，１０Ｒが形成
されている。 The case 11 is made of a molded plastic body, and has a chamber 13 in the center that accommodates the signal processing circuit 6;
On both sides thereof, chambers 10T and 10R are formed to accommodate an ultrasonic transmitting microphone 4T or a receiving microphone 4R.
ケース１１の裏面は、上記各室１３，１０Ｔ，
１０Ｒに通ずる開口部１４が形成され、ケース１
１の前面側には、ケース前面から、室１０Ｔ，１
０Ｒに達して貫通するホーン部４TH，４RHが
形成されている。 The back side of the case 11 has the above-mentioned chambers 13, 10T,
10R is formed, and the case 1
On the front side of 1, from the front of the case, there are chambers 10T, 1
Horn portions 4TH and 4RH are formed which reach 0R and penetrate through.
さらに、上記室１３は、ケース１１の前面にお
いても開口しており、この開口８は、モールド剤
３を注入する際の注入口となる（以下、この開口
８を注入口８とする）。 Further, the chamber 13 is also open at the front surface of the case 11, and this opening 8 serves as an injection port for injecting the molding agent 3 (hereinafter, this opening 8 will be referred to as an injection port 8).
上記各室１３，１０Ｔ，１０Ｒ内には、予め、
基板１２上に組付けられた送波マイク４Ｔ、受波
マイク４Ｒ、信号処理回路６が基板１２をケース
１１裏面開口部１４に挿入されることによつて、
それぞれの室内に収容されている。 In each of the above chambers 13, 10T, 10R, in advance,
When the transmitting microphone 4T, the receiving microphone 4R, and the signal processing circuit 6 assembled on the board 12 are inserted into the back opening 14 of the case 11,
They are housed in each room.
そして、上記基板１２が装着された状態で、ケ
ース１１と同材質の裏蓋７が、開口部１４に嵌合
され、その周囲が超音波溶着によつてケース１１
に接合されることにより、ケース裏面が封止され
ている。 Then, with the substrate 12 attached, the back cover 7 made of the same material as the case 11 is fitted into the opening 14, and the periphery of the back cover 7 is attached to the case 11 by ultrasonic welding.
The back of the case is sealed.
なお、室１０Ｔ，１０Ｒ内には、室壁と送波マ
イク４Ｔ、受波マイク４Ｒとの間にインシユレー
タ５が介在されている。 In addition, in the chambers 10T and 10R, an insulator 5 is interposed between the chamber wall and the wave transmitting microphone 4T and the wave receiving microphone 4R.
そして、送波マイク４Ｔ及び受波マイク４Ｒを
基板２へ取付ける場合も、インシユレータを介し
てこれを間接的に行うことができる。 Also, when attaching the transmitting microphone 4T and the receiving microphone 4R to the substrate 2, this can be done indirectly via an insulator.
さらに、室１３内には、上記注入口８からモー
ルド剤３が注入されて、信号処理回路６の封止が
なされている。 Furthermore, the molding agent 3 is injected into the chamber 13 from the injection port 8, and the signal processing circuit 6 is sealed.
また、本実施例を組立てる手順としては、先
ず、送波マイク４Ｔ、受波マイク４Ｒ、信号処理
回路６を取付けた基板１２をケース１１に収容し
た後、裏蓋７の接合を行い、最後に、モールド剤
３を注入口８から流し込んで信号処理回路６の封
止を行なう。 The procedure for assembling this embodiment is as follows: first, the board 12 to which the transmitting microphone 4T, the receiving microphone 4R, and the signal processing circuit 6 are attached is housed in the case 11, and then the back cover 7 is joined; , the signal processing circuit 6 is sealed by pouring the molding agent 3 through the injection port 8.
上記裏蓋７は、ケース１１裏面の封止の他に、
上記モールド剤３による封止を行なう際の真空脱
泡作業において、ケース１１背面から空気が抜け
ることを防止する作用がある。 In addition to sealing the back of the case 11, the back cover 7 also seals the back of the case 11.
This has the effect of preventing air from escaping from the back surface of the case 11 during the vacuum degassing operation when sealing with the molding agent 3 is performed.
このように構成された本実施例の超音波送受波
器は、第１図に示したものに比較して、ケース裏
面封止のためのモールド剤を用いず、薄い裏蓋７
を用いることにより、ケース裏面開口部１４の深
さａを小さくすることができる。 The ultrasonic transducer of this embodiment configured in this way does not use a molding agent for sealing the back of the case and has a thin back cover 7, unlike the one shown in FIG.
By using this, the depth a of the case back opening 14 can be reduced.
また、信号処理回路６の封止用のモールド剤の
注入口を、ケース１１前面に設けたことにより、
モールド剤が通るためのスペースを基板１２から
除くことができ、第１図の従来構造に較べ室１３
の容積を必要最小限とすることが可能となり、ケ
ース１１の幅ｂをも小さくすることができる。ま
た、これによつて、モールド剤の節約もできる。 In addition, by providing an inlet for molding agent for sealing the signal processing circuit 6 on the front surface of the case 11,
The space for the molding agent to pass through can be removed from the substrate 12, and compared to the conventional structure shown in FIG.
It becomes possible to reduce the volume of the case 11 to the necessary minimum, and the width b of the case 11 can also be reduced. This also allows saving on molding agents.
なお、上記実施例では、モールド剤の注入口８
をケース１１の前面に形成した例を示してある
が、本考案は、これに限らず、ケース１１の側面
に注入口を形成してもよい。この場合の注入口も
信号処理回路６が収容される室１３に通ずるよう
に形成することは言うまでもない。 In addition, in the above embodiment, the molding agent injection port 8
Although an example is shown in which the injection port is formed on the front surface of the case 11, the present invention is not limited to this, and the injection port may be formed on the side surface of the case 11. Needless to say, the injection port in this case is also formed so as to communicate with the chamber 13 in which the signal processing circuit 6 is accommodated.
また、裏蓋７は、ケース１１と異る材質であつ
てもよいし、ケース１１との接合は、超音波溶着
のみならず、他の接合方法（例えば、低周波溶着
等のような振動溶着、あるいは接着剤による方
法）を用いてもよい。 Further, the back cover 7 may be made of a different material from the case 11, and the back cover 7 may be joined to the case 11 by not only ultrasonic welding but also other joining methods (for example, vibration welding such as low frequency welding). , or a method using an adhesive) may be used.
（考案の効果）
以上詳細に説明したように、本考案は、超音波
送波マイク、受波マイク、信号処理回路をケース
内に一体に収容した超音波送受波器の小型化をよ
り一層促進し、かつ、ケース裏面の封止を確実に
行なうことが可能となる。(Effects of the invention) As explained in detail above, the invention further promotes the miniaturization of an ultrasonic transducer in which an ultrasonic transmitting microphone, a receiving microphone, and a signal processing circuit are housed in a case. At the same time, it becomes possible to reliably seal the back surface of the case.
第１図は超音波送受波器の一例を示す断面図、
第２図は本考案の一実施例の構成を示す断面図、
第３図は同実施例の前面図である。
４Ｔ……超音波送波マイク、４Ｒ……超音波受
波マイク、６……信号処理回路、３……モールド
剤、７……裏蓋、８……注入口、１１……ケー
ス、１２……基板。
Figure 1 is a sectional view showing an example of an ultrasonic transducer;
FIG. 2 is a sectional view showing the configuration of an embodiment of the present invention;
FIG. 3 is a front view of the same embodiment. 4T...Ultrasonic transmitting microphone, 4R...Ultrasonic receiving microphone, 6...Signal processing circuit, 3...Molding agent, 7...Back cover, 8...Inlet, 11...Case, 12... …substrate.
Claims (1)
処理回路を基板に取付けて一体的に収容するとと
もに、裏面を除く面にモールド剤注入口が形成さ
れたケースと、 前記ケース裏面に密着されてケース裏面を封止
する裏蓋と、 前記注入口からケース内における前記信号処理
回路の収容室に充填されて該信号処理回路をモー
ルドしたモールド剤とから構成される超音波送受
波器。[Claims for Utility Model Registration] An ultrasonic transmitting microphone, an ultrasonic receiving microphone, a signal processing circuit, and the ultrasonic transmitting microphone, the receiving microphone, and the signal processing circuit are attached to a substrate and housed integrally. In addition, a case having a molding agent injection port formed on a surface other than the back surface, a back cover that is tightly attached to the back surface of the case to seal the back surface of the case, and a housing chamber for the signal processing circuit inside the case from the injection port. and a molding agent filled with a molding agent to mold the signal processing circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7792084U JPS60189875U (en) | 1984-05-29 | 1984-05-29 | Ultrasonic transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7792084U JPS60189875U (en) | 1984-05-29 | 1984-05-29 | Ultrasonic transducer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60189875U JPS60189875U (en) | 1985-12-16 |
| JPH0329755Y2 true JPH0329755Y2 (en) | 1991-06-25 |
Family
ID=30621425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7792084U Granted JPS60189875U (en) | 1984-05-29 | 1984-05-29 | Ultrasonic transducer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60189875U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6296417B2 (en) * | 2014-06-04 | 2018-03-20 | 株式会社デンソー | Ultrasonic sensor device |
-
1984
- 1984-05-29 JP JP7792084U patent/JPS60189875U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60189875U (en) | 1985-12-16 |
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