JPH03296665A - Current sensor - Google Patents

Current sensor

Info

Publication number
JPH03296665A
JPH03296665A JP2099593A JP9959390A JPH03296665A JP H03296665 A JPH03296665 A JP H03296665A JP 2099593 A JP2099593 A JP 2099593A JP 9959390 A JP9959390 A JP 9959390A JP H03296665 A JPH03296665 A JP H03296665A
Authority
JP
Japan
Prior art keywords
substrate
current sensor
board
gap
core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2099593A
Other languages
Japanese (ja)
Inventor
Takeo Kashiwa
柏 健夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Communication Equipment Co Ltd
Original Assignee
Toyo Communication Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Communication Equipment Co Ltd filed Critical Toyo Communication Equipment Co Ltd
Priority to JP2099593A priority Critical patent/JPH03296665A/en
Publication of JPH03296665A publication Critical patent/JPH03296665A/en
Pending legal-status Critical Current

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  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
  • Hall/Mr Elements (AREA)

Abstract

PURPOSE:To miniaturize a sensor and to prevent the lowering of arrangement stability due to the displacement of the center of gravity by forming a substrate from a flexible material and curving at least one end edge thereof to reduce the protruding length of the substrate thereof in the plane direction thereof. CONSTITUTION:A flexible printed circuit board 40 is used as the substrate of a current sensor having a magnetoelectric converter element mounted thereon and one end part 40a thereof is curved upwardly to reduce the protruding length of the board in the plane direction thereof and the miniaturization of the plane shape of the board at the time of molding is achieved. Since a molding resin 45 is integrally and closely bonded to all of constitutional elements, there is possibility such that the insulating withstand voltage between the part on the primary side of the annular core 21 and coil 35 above a gap 23 and the part on the secondary side containing the element 37 thereof is lowered by the moisture in the resin and, therefore, the other end part 40b of the board 40 is folded back into gap 23 if necessary to increase a creepage distance to make it possible to secure withstand voltage without using a special insulating shield. Further, by arranging at least three or more lead terminals 43, 44, the arrangement stability of respective constitutional elements integrated by molding is enhanced.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明はホール素子等の磁電変換素子を用いた電流セン
サの改良に関し、特にコアを含む電流センサの全体形状
を小型化するとともにマザーボード上に立設する際の機
械的安定性を向上した電流センサに関する。
Detailed Description of the Invention (Industrial Application Field) The present invention relates to the improvement of a current sensor using a magnetoelectric conversion element such as a Hall element, and in particular to miniaturizing the overall shape of the current sensor including the core, and increasing the size of the current sensor on the motherboard. This invention relates to a current sensor with improved mechanical stability when installed upright.

(従来の技術) ファクシミリ、モデム、NCU (Network  
Control  Unit)等においては電話回線の
制御状態、即ち電話機のオンフッタ、オフフック或は変
換機動作に伴う回線ループ電流の有無及び極性反転等を
検出する素子、装置を必要とするが、従来このために電
話回線にリードリレー又はフォトカブラを挿入していた
(Prior technology) Facsimile, modem, NCU (Network
Control Units, etc. require elements and devices to detect the control status of the telephone line, that is, the presence or absence of line loop current and polarity reversal due to telephone on-footer, off-hook, or converter operation. A reed relay or photocoupler was inserted into the telephone line.

しかし、リードリレーやフォトカプラ等(こより検出で
きる最小電流値は比較的大きく、しかも挿入インピーダ
ンス(抵抗)が太き(なって損失が増大する等の欠点が
あった。
However, the minimum current value that can be detected by reed relays, photocouplers, etc. is relatively large, and the insertion impedance (resistance) is large (resulting in increased loss).

このため、近年磁電変換素子を用いた電流センサ(電流
検出器)が開発され、感度、挿入損失共に改善されたも
のが出現するようになった。
For this reason, current sensors (current detectors) using magnetoelectric conversion elements have been developed in recent years, and sensors with improved sensitivity and insertion loss have appeared.

このような電流センサは第3図(a)  (b)に示す
ようにホール素子5を磁電変換素子として用いるととも
にフェライト等の磁性材料を成形加工して成る環状の磁
性体コア1の一部を切欠いた狭い空膝部3に配置されて
該コア1の一部にこれを芯として巻いたコイル2に通電
することによって発生する前記コア空隙部の磁界を上記
ホール素子5に作用させて電流の強度及び向きを検出す
るものである。
As shown in FIGS. 3(a) and 3(b), such a current sensor uses a Hall element 5 as a magnetoelectric transducer and a part of an annular magnetic core 1 made of a magnetic material such as ferrite. The magnetic field of the core gap generated by energizing the coil 2 disposed in the narrow notched empty knee part 3 and wound around a part of the core 1 acts on the Hall element 5 to generate a current. It detects intensity and direction.

ホール素子5は、アルミナ等の基板6上に搭載されると
ともに、空隙3内にホール素子5が適正な状態で配置さ
れるように位置決めされ、更にホール素子5上には一次
側と二次側間の絶縁耐圧を確保するための絶縁フィルム
7がこれを被覆するように介挿される。
The Hall element 5 is mounted on a substrate 6 made of alumina or the like, and is positioned so that the Hall element 5 is placed in the gap 3 in an appropriate state. An insulating film 7 is inserted to cover this to ensure dielectric strength between the two.

アルミナ基板6上の他の部位にはオペアンプ8、図示し
ない抵抗網等が搭載、形成され、更に基板の一辺には多
数のリード端子9が止着されて基板上の配線パターンや
、コイル2から延びるリード線2aと接続される。リー
ド端子上部を含む電流センサの構成部品は第4図に示す
ように全て樹脂モールドlOにより一体化される。モー
ルド一体止された電流センサから延びる各リード端子9
の下端部は、マザーボード11に形成したスルーホール
12内に挿入立設されてハンダ13によって固定される
On other parts of the alumina substrate 6, an operational amplifier 8, a resistor network (not shown), etc. are mounted and formed, and a large number of lead terminals 9 are fixed to one side of the substrate, and are connected to the wiring pattern on the substrate and the coil 2. It is connected to the extending lead wire 2a. The components of the current sensor including the upper part of the lead terminal are all integrated by a resin mold 1O, as shown in FIG. Each lead terminal 9 extends from the current sensor integrally fixed with the mold.
The lower end of the motherboard 11 is inserted and erected into a through hole 12 formed in the motherboard 11 and fixed with solder 13 .

第5図は前記第3図!a)  [b)の電流検出器のブ
ロック概要図であり、ホール素子5によって検出された
磁界の値は電圧に変換されてホール素子の端子に発生し
、アンプ8によって増幅された上で比較器15によって
所定の設定値と比較されて電流の有無及び極性が判定さ
れる。
Figure 5 is the same as Figure 3 above! a) This is a block schematic diagram of the current detector in [b], in which the value of the magnetic field detected by the Hall element 5 is converted to voltage and generated at the terminal of the Hall element, amplified by the amplifier 8, and then sent to the comparator. 15, the current is compared with a predetermined set value to determine the presence or absence of current and its polarity.

しかしながら、アルミナ基板6は、剛性を有した平板で
あると同時に必要本数の端子9を所定のピッチで接続す
るための長さを要するため、大型化せざるを得す、斯か
る大面積の基板上にコア等を搭載した上でこれらをモー
ルド一体止した電流センサは更に大きなものとなる。
However, since the alumina substrate 6 is a flat plate with rigidity and at the same time requires a length to connect the necessary number of terminals 9 at a predetermined pitch, the alumina substrate 6 has to be enlarged and such a large-area substrate is required. A current sensor in which a core and the like are mounted on top and these are integrally molded becomes even larger.

又、第4図に示したように重量の大きなコア及びコイル
に相当する部分は基板から大きく突出した形状となり且
つ重心が高位置となり、振動や衝撃によってリード端子
9とスルーホールとの接続部が破損したり、電流センサ
自体が矢印方向へ傾倒する虞れがある。この結果、電流
センサの破損、マザーボード上の他の搭載部品等の故障
等を招来する虞れがある。
In addition, as shown in Fig. 4, the parts corresponding to the heavy core and coil have a shape that greatly protrudes from the board, and the center of gravity is located at a high position, so that the connection between the lead terminal 9 and the through hole may be damaged due to vibration or impact. There is a risk of damage or the current sensor itself tilting in the direction of the arrow. As a result, there is a risk that the current sensor may be damaged or other components mounted on the motherboard may malfunction.

(発明の目的) 本発明は上記に鑑みてなされたものであり、環状コアの
切欠き内に、ホール素子を実装した基板を位置決めした
電流センサにおいて、搭載部品に対して悪影響を与えた
り、電流センサの特性を低下させることなく基板の平面
積を減縮して電流センサの小型化を図るとともに、重心
の偏位による設置安定性の低下を防止した電流センサを
提供することを目的としている。
(Purpose of the Invention) The present invention has been made in view of the above, and in a current sensor in which a board on which a Hall element is mounted is positioned in a notch of an annular core, the current It is an object of the present invention to provide a current sensor that is capable of downsizing the current sensor by reducing the planar area of the substrate without deteriorating the characteristics of the sensor, and that prevents a decrease in installation stability due to deviation of the center of gravity.

(発明の概要) 上記目的を達成するため1本発明は一部を切欠いてギャ
ップとした環状の磁性体コアと、該コアの一辺に嵌挿し
た絶縁性ボビンに巻回したコイルと、磁電変換素子を実
装した基板とから成り、該コアの切欠き内に該磁電変換
素子が位置するように該基板を配置した電流センサにお
いて、前記基板はフレキシブル材から成り、該フレキシ
ブル基板の少なくとも一端縁を湾曲させて平面方向突出
長を減縮したことを特徴としている。
(Summary of the Invention) In order to achieve the above object, the present invention comprises: a ring-shaped magnetic core with a gap formed by cutting out a part; a coil wound around an insulating bobbin fitted on one side of the core; A current sensor comprising a substrate on which an element is mounted, and the substrate is arranged so that the magnetoelectric transducer is located in a notch of the core, the substrate is made of a flexible material, and at least one edge of the flexible substrate is It is characterized by being curved to reduce the protrusion length in the planar direction.

(発明の実施例) 以下、添付図面に示した好適な実施例に基づいて本発明
の詳細な説明する。
(Embodiments of the Invention) Hereinafter, the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

第1図(al及び(blは本発明の一芙施例の電流セン
サの構成を示す斜視図及び正面図である。
FIG. 1 (al and (bl) are a perspective view and a front view showing the configuration of a current sensor according to one embodiment of the present invention.

この電流センサは、例えば断面が矩形の磁性体から成る
環状コア21と、コア21の上辺部外周に嵌装した絶縁
材料から成る図示しないボビンと、該ボビンに巻き回し
たコイル35と、ギャップ23内を含むコア内部からコ
ア21の外側へ延在するとともに外側端部40aが上方
へ湾曲したフレキシブルプリント基板40と、ギャップ
23内に位置するフレキシブルプリント基板4oの表面
に搭載した磁電変換素子37と、フレキシブルプリント
基板40の湾曲した端部40aの表面上に搭載したオペ
アンプ42と、フレキシブルプリント基板下面或は側端
縁の適所から下方に延びた複数本のリード端子43と、
コア21の近傍においてコイル35からのリード線と接
続されるり一上端子44と、上記各構成部品を内部に含
んでモールド一体止するフェノール樹脂等のモールド樹
脂45とから構成される。
This current sensor includes, for example, an annular core 21 made of a magnetic material with a rectangular cross section, a bobbin (not shown) made of an insulating material fitted around the upper side of the core 21, a coil 35 wound around the bobbin, and a gap 23. A flexible printed circuit board 40 that extends from the inside of the core including the inside of the core to the outside of the core 21 and has an upwardly curved outer end 40a, and a magnetoelectric conversion element 37 mounted on the surface of the flexible printed circuit board 4o located within the gap 23. , an operational amplifier 42 mounted on the surface of the curved end 40a of the flexible printed circuit board 40, and a plurality of lead terminals 43 extending downward from appropriate positions on the lower surface or side edge of the flexible printed circuit board,
It is comprised of an upper terminal 44 that is connected to a lead wire from the coil 35 near the core 21, and a mold resin 45 such as phenol resin that contains the above-mentioned components and molds them together.

リード端子43の下端部は干−ルド樹脂45から下方へ
突出して図示しないマザーボードのスルー示−ル内に挿
入立設されるとともに、上端部はフレキシブルプリント
基板4oの配線パターンと接続される。また、リード端
子43.44等を少なくとも3本以上配置することによ
ってモールド一体止された各構成要素の設定安定性を高
めるのが好ましい。
The lower ends of the lead terminals 43 protrude downward from the dry resin 45 and are inserted and erected into through-hole indicators of a motherboard (not shown), and the upper ends are connected to the wiring pattern of the flexible printed circuit board 4o. Further, it is preferable to arrange at least three or more lead terminals 43, 44, etc. to improve the stability of setting of each component integrally fixed with the mold.

本発明においては、フレキシブルプリント基板40を用
いるとともに、基板4oの一端部40aを上方へ湾曲す
ることによって基板4oの平面方向突出長を減縮し、モ
ールドした際の平面形状の小型化を図っている点が特徴
的である。
In the present invention, the flexible printed circuit board 40 is used, and one end 40a of the board 4o is curved upward to reduce the protrusion length of the board 4o in the planar direction, thereby reducing the planar shape when molded. The points are distinctive.

またモールド樹脂は、上記各構成要素の全てに密着して
一体化されるため、ギャップ23より上方に位置するボ
ア部分、コイル35等の一次側と、磁電変換素子37を
含む二次側との間の絶縁耐圧が樹脂中に含まれる水分等
によって低下する虞れもある。このため、必要に応じて
基板40の他端部40bを図示のように磁電変換素子3
7の上部のギャップ23内に向けて折返すことによって
、格別の絶縁シートを用いることなく沿面距離の増大に
よる耐圧の確保を図るのが好ましい。
In addition, since the mold resin is closely integrated with all of the above-mentioned components, the primary side such as the bore portion located above the gap 23, the coil 35, etc., and the secondary side including the magnetoelectric conversion element 37 are connected to each other. There is also a possibility that the dielectric strength between the two may be reduced due to moisture contained in the resin. Therefore, if necessary, the other end 40b of the substrate 40 can be connected to the magnetoelectric transducer 3 as shown in the figure.
It is preferable that by folding it back toward the gap 23 at the top of 7, the withstand voltage can be ensured by increasing the creepage distance without using a special insulating sheet.

第2図は本発明の第2の実施例であり、樹脂等からなる
ベース50上面にコア21を固定するとともにギャップ
23内から外部にかけて前記と同様なフレキシブル基板
40を配置し、更にベース50の貫通孔50aに挿通し
たリード端子43の上端を基板40のパターン等と接続
した上で、モールド樹脂によって一体化してもよいし、
或はベース50上に樹脂或は金属等から成るケース(蓋
)を被せて内部を封止してもよい。
FIG. 2 shows a second embodiment of the present invention, in which a core 21 is fixed to the upper surface of a base 50 made of resin or the like, and a flexible substrate 40 similar to that described above is arranged from inside the gap 23 to the outside. The upper end of the lead terminal 43 inserted into the through hole 50a may be connected to the pattern of the substrate 40, and then integrated with a molded resin.
Alternatively, the inside may be sealed by covering the base 50 with a case (lid) made of resin, metal, or the like.

以上のように本発明においては、コアのギャップ内に配
置される磁電変換素子を支持する基板としてフレキシブ
ルプリント基板を用い、該ギャップから外方へ延びるフ
レキシブルプリント基板の一端を上方へ湾曲させて平面
方向突出長を減縮した上で各構成要素をモールド一体止
、或はケースにより封止したため、電流センサの小型化
を図れる。更に、基板下面から突出する3本以上のリー
ド端子によって電流センサをマザーボードのスルーホー
ル内に植立させるようにしたため、重心を低くして振動
や衝撃による損傷等の不具合をなくすることができる。
As described above, in the present invention, a flexible printed circuit board is used as a substrate for supporting the magnetoelectric transducer arranged in the gap of the core, and one end of the flexible printed circuit board extending outward from the gap is curved upward to form a flat surface. Since the directional protrusion length is reduced and each component is integrally molded or sealed with a case, the current sensor can be made smaller. Furthermore, since the current sensor is installed in the through-hole of the motherboard using three or more lead terminals protruding from the bottom surface of the board, the center of gravity can be lowered and problems such as damage caused by vibration or impact can be eliminated.

更に、必要に応じて、フレキシブルプリント基板の内側
他端部を折返して磁電変換素子を被覆するよう構成すれ
ば、ギャップ23内に格別絶縁シートを介挿する必要が
なくなり、製造工程を簡略化することができる。
Furthermore, if the other inner end of the flexible printed circuit board is folded back to cover the magnetoelectric transducer as necessary, there is no need to insert a special insulating sheet into the gap 23, which simplifies the manufacturing process. be able to.

(発明の効果) 以上のように本発明によれば、環状コアの切欠き内に磁
電変換素子を実装した基板を位置決めした電流センサに
おいて、搭載部品に対して悪影響を与えたり、電流セン
サの特性を低下させることなく基板の平面積を減縮して
電流センサの小型化、を図るとともに、重心の偏位によ
る設置安定性の低下を防止することができる。
(Effects of the Invention) As described above, according to the present invention, in a current sensor in which a substrate on which a magnetoelectric conversion element is mounted within a notch of an annular core is positioned, there is no possibility that the mounted components will be adversely affected or the characteristics of the current sensor will be affected. It is possible to downsize the current sensor by reducing the planar area of the substrate without reducing the surface area of the substrate, and to prevent a decrease in installation stability due to deviation of the center of gravity.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a)及び(b)は本発明の一実施例としての電
流センサの構成を示す斜視図及び正面図、第2図は本考
案の他の実施例の構成説明図、第3図(a)及び(b)
は従来の電流センサの側面図及び底面図、第4図はモー
ルド一体止した従来の電流センサをマザーボードに搭載
した状態の説明図、第5図は第3図(a)  (blの
電流検出器のブロック概要図である。 21・・・環状コア 23・・・ギャップ35・・・コ
イル 37・・・磁電変換素子40・・・フレキシブル
プリント基板 40a・・・基板の一端部 40b・・・他端部43.
44・・・リード端子 45・・・モールド樹脂  5
0・・・ベース
1(a) and (b) are perspective views and front views showing the configuration of a current sensor as an embodiment of the present invention, FIG. 2 is an explanatory diagram of the configuration of another embodiment of the present invention, and FIG. 3 (a) and (b)
Figure 4 is a side view and bottom view of a conventional current sensor, Figure 4 is an explanatory diagram of a conventional current sensor integrated with a mold and mounted on a motherboard, and Figure 5 is a current detector in Figure 3(a) (bl). 21... Annular core 23... Gap 35... Coil 37... Magnetoelectric conversion element 40... Flexible printed circuit board 40a... One end of the board 40b... Others End 43.
44...Lead terminal 45...Mold resin 5
0...Base

Claims (1)

【特許請求の範囲】[Claims] (1)一部を切欠いてギャップとした環状の磁性体コア
と、該コアの一辺に嵌挿した絶縁性ボビンに巻回したコ
イルと、磁電変換素子を実装した基板とから成り、該コ
アの切欠き内に該磁電変換素子が位置するように該基板
を配置した電流センサにおいて、 前記基板はフレキシブル材から成り、該フレキシブル基
板の少なくとも一端縁を湾曲させて平面方向突出長を減
縮したことを特徴とする電流センサ。
(1) Consists of an annular magnetic core with a gap cut out, a coil wound around an insulating bobbin fitted on one side of the core, and a substrate on which a magnetoelectric transducer is mounted. In the current sensor in which the substrate is arranged such that the magnetoelectric transducer is located in the notch, the substrate is made of a flexible material, and at least one edge of the flexible substrate is curved to reduce the protrusion length in the planar direction. Characteristic current sensor.
JP2099593A 1990-04-16 1990-04-16 Current sensor Pending JPH03296665A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2099593A JPH03296665A (en) 1990-04-16 1990-04-16 Current sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2099593A JPH03296665A (en) 1990-04-16 1990-04-16 Current sensor

Publications (1)

Publication Number Publication Date
JPH03296665A true JPH03296665A (en) 1991-12-27

Family

ID=14251397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2099593A Pending JPH03296665A (en) 1990-04-16 1990-04-16 Current sensor

Country Status (1)

Country Link
JP (1) JPH03296665A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5484611A (en) * 1992-07-15 1996-01-16 The Scottish Agricultural College Method of producing a fatty acid
JP2007240399A (en) * 2006-03-10 2007-09-20 Nec Tokin Corp Electric current sensor
JP2009276359A (en) * 2009-08-27 2009-11-26 Toyota Motor Corp Current detecting device
JP2010048809A (en) * 2008-08-25 2010-03-04 Robert Seuffer Gmbh & Co Kg Current detection device
JP2011106889A (en) * 2009-11-14 2011-06-02 Mitsubishi Materials Corp Current sensor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5484611A (en) * 1992-07-15 1996-01-16 The Scottish Agricultural College Method of producing a fatty acid
JP2007240399A (en) * 2006-03-10 2007-09-20 Nec Tokin Corp Electric current sensor
JP2010048809A (en) * 2008-08-25 2010-03-04 Robert Seuffer Gmbh & Co Kg Current detection device
JP2009276359A (en) * 2009-08-27 2009-11-26 Toyota Motor Corp Current detecting device
JP2011106889A (en) * 2009-11-14 2011-06-02 Mitsubishi Materials Corp Current sensor

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