JPH03294494A - Formation of film on surface of heat radiating plate - Google Patents
Formation of film on surface of heat radiating plateInfo
- Publication number
- JPH03294494A JPH03294494A JP9494790A JP9494790A JPH03294494A JP H03294494 A JPH03294494 A JP H03294494A JP 9494790 A JP9494790 A JP 9494790A JP 9494790 A JP9494790 A JP 9494790A JP H03294494 A JPH03294494 A JP H03294494A
- Authority
- JP
- Japan
- Prior art keywords
- heat radiating
- radiating plate
- plating
- heat sink
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- 238000007747 plating Methods 0.000 claims abstract description 24
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229940081974 saccharin Drugs 0.000 claims abstract description 6
- 235000019204 saccharin Nutrition 0.000 claims abstract description 6
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 claims abstract description 6
- DLDJFQGPPSQZKI-UHFFFAOYSA-N but-2-yne-1,4-diol Chemical compound OCC#CCO DLDJFQGPPSQZKI-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052742 iron Inorganic materials 0.000 claims abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 5
- 230000004907 flux Effects 0.000 abstract description 6
- 238000011109 contamination Methods 0.000 abstract description 4
- 238000004381 surface treatment Methods 0.000 abstract description 4
- 238000005406 washing Methods 0.000 abstract 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 150000000190 1,4-diols Chemical class 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、電子部品を搭載する放熱板、例えばパワー
トランジスタモジュールに使用する放熱板の表面処理に
関するものである。さらに詳しくは、本発明は放熱板の
表面汚れ改善のため、従来の無光沢ニッケルめっき液に
添加剤を添加することにより、半光沢めっきを施す表面
処理方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to surface treatment of a heat sink on which electronic components are mounted, such as a heat sink used in a power transistor module. More specifically, the present invention relates to a surface treatment method for applying semi-bright plating by adding additives to a conventional matte nickel plating solution in order to improve surface stains on heat sinks.
従来、パワートランジスタモジュール部品、例えば、ト
ランジスタチップ、電極、端子等は、銅や鉄等の放熱板
にフラックス入り共晶はんだを用いてはんだ付けされて
いる。そして、この放熱板の表面には、はんだ付は性、
耐食性をもたせる目的で、ワット型無光沢ニッケルめっ
きが施されているのが現状である。Conventionally, power transistor module components, such as transistor chips, electrodes, terminals, etc., have been soldered to heat sinks made of copper, iron, or the like using flux-cored eutectic solder. And, on the surface of this heat sink, there is no soldering,
Currently, Watt-type matte nickel plating is applied to provide corrosion resistance.
このように従来の放熱板は無光沢ニッケルであるため、
めっき表面の粒子が粗いので、はんだフラックスの洗浄
性が悪く、また、ハンドリングによる指紋の付着が発生
し、放熱板表面が汚染されやすい、そのため、製品完成
後トリクロールエチレン、トリクロールエタンなどの有
機溶剤を用いて拭き取り作業を実施することが必要であ
るが、これらの溶剤の及ぼす作業環境の汚染の問題や、
拭き取り作業に伴う人件費増のため、製品単価が高くな
るなどの問題点があった。In this way, conventional heat sinks are made of matte nickel, so
Because the particles on the plating surface are coarse, it is difficult to clean the solder flux, and the surface of the heat sink is easily contaminated due to the adhesion of fingerprints during handling. It is necessary to carry out wiping work using solvents, but there are problems such as contamination of the working environment caused by these solvents,
There were problems such as higher product prices due to increased labor costs associated with wiping.
この発明は、上記のような問題点を解消するためになさ
れたもので、はんだフラックスの洗浄性に優れ、ハンド
リングによる指紋の付着が防止でき、放熱板表面の汚染
を少なくできる表面処理を施すことにより、トリクロー
ルエチレン、トリクロールエタンなどの有害な物質の使
用を不要にでき、拭き取り作業を改善できる放熱板の表
面皮膜を得ることを目的とする。This invention was made in order to solve the above-mentioned problems, and provides a surface treatment that has excellent solder flux cleanability, can prevent fingerprints from being attached during handling, and can reduce contamination on the surface of the heat sink. The purpose of this invention is to obtain a surface coating for a heat sink that can eliminate the use of harmful substances such as trichlorethylene and trichloroethane and improve wiping work.
すなわち本発明は、ワット型無光沢ニッケルめっき液に
、1次光沢剤としてサッカリン2.0〜3.0ti/1
.2次光沢剤として2ブチン−1,4ジオール0.07
〜0.02971を添加し、通常の条件で電気めっきす
ることにより、銅または鉄系放熱板の表面に半光沢ニッ
ケルめっきを3〜9μmの厚さに施すことを特徴とする
ものである。That is, the present invention adds saccharin 2.0 to 3.0ti/1 as a primary brightener to a Watt type matte nickel plating solution.
.. 2-butyne-1,4 diol 0.07 as secondary brightener
It is characterized by applying semi-bright nickel plating to a thickness of 3 to 9 μm on the surface of a copper or iron-based heat sink by adding ~0.02971 and electroplating under normal conditions.
この発明における放熱板表面の半光沢ニッケル皮膜は、
2次光沢剤として2ブチン−1,4ジオールを0.00
7〜0.02g/l添加することにより、析出した表面
粒子が微細化されたため、はんだフラックスの洗浄性が
向上し、指紋の付着も少なくなる。The semi-bright nickel film on the surface of the heat sink in this invention is
0.00 2-butyne-1,4 diol as a secondary brightener
By adding 7 to 0.02 g/l, the precipitated surface particles are made finer, which improves the cleanability of the solder flux and reduces the amount of fingerprints attached.
放熱板の表面に次のようにしてワット型半光沢ニッケル
めっきは下記にて実施した。Watt type semi-bright nickel plating was carried out on the surface of the heat sink as follows.
めっき液の調製は、硫酸ニッケル2509/1、塩化ニ
ッケル50g/l、ホウ酸30g/lを基本液とし、ニ
ッケルめっきに通常行われる調整を行った後、サッカリ
ン2.3tt/1を基本液とし、通常の調整を行った後
、サッカリン2.3tt/1を加え、次いで2ブチン−
1,4ジオール0.01g/i’を添加しめっき液とし
た。めっきは、無酸素銅板を脱脂後キリンス処理、活性
化を行った後、めっき温度50℃、電流密度1.8A/
d蒙2、pH4,1、無撹拌で約4μ簡の半光沢ニッケ
ルめっきを施した。The plating solution was prepared using 2509/1 nickel sulfate, 50 g/l of nickel chloride, and 30 g/l of boric acid as a base solution, and after making the usual adjustments for nickel plating, 2.3 tt/1 of saccharin was used as the base solution. , after making the usual adjustments, add 2.3tt/1 saccharin, then 2butyne-
0.01 g/i' of 1,4 diol was added to prepare a plating solution. For plating, the oxygen-free copper plate was degreased, treated with Kirins, and activated, then at a plating temperature of 50°C and a current density of 1.8A/
Semi-bright nickel plating with a thickness of approximately 4 μm was applied at a pH of 4.1 and without stirring.
上記のようにして得られた放熱板表面の半光沢ニッケル
めっきに、トランジスタチップ、電極、端子などのパワ
ートランジスタモジュール部品のはんだ付けをしたとこ
ろ、従来の無光沢ニッケルめっきと同等の良好なはんだ
付は性を示した。また表面粒子が細かく、半光沢表面で
あることから、はんだフラックス洗浄性は良好で、フラ
ックス残査は認められなかった。さらにそれ以降の組立
工程におけるハンドリングによる指紋の付着も起こらな
かった。また、各工程中での汚れの付着もきわめて少な
かったが、経時的に進行した汚れもメチルアルコールま
たはイソプロピルアルコールによる簡単な拭き取り作業
で、組立前の放熱板表面まで回復できた。When power transistor module components such as transistor chips, electrodes, and terminals were soldered to the semi-bright nickel plating on the surface of the heat sink obtained as described above, good soldering was achieved, equivalent to conventional matte nickel plating. showed gender. Furthermore, since the surface particles were fine and the surface was semi-glossy, the solder flux was easily cleaned, and no flux residue was observed. Furthermore, no fingerprints were deposited during handling during the subsequent assembly process. Furthermore, although there was very little dirt adhesion during each process, the dirt that had progressed over time could be recovered to the surface of the heat sink before assembly by simple wiping with methyl alcohol or isopropyl alcohol.
また上記の実施例では、放熱板素材は無酸素銅板の場合
について説明したが、他の銅系材料および鉄系材料であ
ってもよく、上記実施例同様の効果を奏する。Further, in the above embodiments, the heat sink material is an oxygen-free copper plate, but other copper-based materials or iron-based materials may be used, and the same effects as in the above embodiments can be achieved.
以上のように、この発明によれば放熱板表面皮膜を汚れ
にくい半光沢ニッケルめっきにしたことにより、汚れ拭
き取りにトリクロールエチレン、トリクロールエタンな
どの有害物質を使用していたものを、メチルアルコール
またはイソプロピルアルコールに変更できると同時に、
拭き取り作業も簡単になることがら、作業に係る人件費
の削減が図れ、製品単価の低減が得られる効果がある。As described above, according to the present invention, the surface film of the heat sink is made of stain-resistant semi-bright nickel plating, which replaces the use of toxic substances such as trichlorethylene and trichloroethane for wiping with methyl alcohol. or at the same time can be changed to isopropyl alcohol
Since the wiping work becomes easier, the labor costs associated with the work can be reduced, and the unit price of the product can be reduced.
代 理 人 曾 我 道 照手
続
補
正
書
事件の表示
特願平2−94947号
発明の名称
放熱板の表面皮膜形成方法
補正をする者
事件との関係 特許出願人
住 所 東京都千代田区丸の内二丁目2番3号
名 称 (601)三菱電機株式会社代表者 志岐守
哉Agent: Zeng I Michi Indication of written amendment case Patent application No. 1994-94947 Name of the invention Relationship to the case concerning the person amending the method for forming a surface film on a heat sink Patent applicant address 2-chome Marunouchi, Chiyoda-ku, Tokyo Number 2 and 3 Name (601) Moriya Shiki, Representative of Mitsubishi Electric Corporation
Claims (1)
リン2.0〜3.09g/l、2次光沢剤として2ブチ
ン−1,4ジオール0.007〜0.02g/lを添加
しためっき液を用いて、銅または鉄系の放熱板表面に、
半光沢ニッケルめっきを3〜9μmの厚さに施すことを
特徴とする、放熱板の表面皮膜形成方法。A plating solution containing 2.0 to 3.09 g/l of saccharin as a primary brightener and 0.007 to 0.02 g/l of 2-butyne-1,4 diol as a secondary brightener is added to a Watt type nickel plating solution. on the surface of a copper or iron-based heat sink.
A method for forming a surface film on a heat sink, characterized by applying semi-bright nickel plating to a thickness of 3 to 9 μm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9494790A JPH03294494A (en) | 1990-04-12 | 1990-04-12 | Formation of film on surface of heat radiating plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9494790A JPH03294494A (en) | 1990-04-12 | 1990-04-12 | Formation of film on surface of heat radiating plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03294494A true JPH03294494A (en) | 1991-12-25 |
Family
ID=14124140
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9494790A Pending JPH03294494A (en) | 1990-04-12 | 1990-04-12 | Formation of film on surface of heat radiating plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03294494A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000064084A (en) * | 1998-08-20 | 2000-02-29 | Kobe Steel Ltd | Plating material for heat radiating board of electronic parts |
JP2010232626A (en) * | 2009-03-25 | 2010-10-14 | Wah Hong Industrial Corp | Heat sink and method of fabricating the same |
US8142638B2 (en) | 2002-09-10 | 2012-03-27 | Intri-Plex Technologies, Inc. | Method for making a base plate for suspension assembly in hard disk drive |
JP2017179550A (en) * | 2016-03-31 | 2017-10-05 | Dowaメタルテック株式会社 | Nickel plating material, and production method thereof |
-
1990
- 1990-04-12 JP JP9494790A patent/JPH03294494A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000064084A (en) * | 1998-08-20 | 2000-02-29 | Kobe Steel Ltd | Plating material for heat radiating board of electronic parts |
US8142638B2 (en) | 2002-09-10 | 2012-03-27 | Intri-Plex Technologies, Inc. | Method for making a base plate for suspension assembly in hard disk drive |
JP2010232626A (en) * | 2009-03-25 | 2010-10-14 | Wah Hong Industrial Corp | Heat sink and method of fabricating the same |
JP2017179550A (en) * | 2016-03-31 | 2017-10-05 | Dowaメタルテック株式会社 | Nickel plating material, and production method thereof |
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