JPH0329331Y2 - - Google Patents
Info
- Publication number
- JPH0329331Y2 JPH0329331Y2 JP1984185851U JP18585184U JPH0329331Y2 JP H0329331 Y2 JPH0329331 Y2 JP H0329331Y2 JP 1984185851 U JP1984185851 U JP 1984185851U JP 18585184 U JP18585184 U JP 18585184U JP H0329331 Y2 JPH0329331 Y2 JP H0329331Y2
- Authority
- JP
- Japan
- Prior art keywords
- thin
- tube
- etching
- walled cylinder
- thin tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 claims description 43
- 230000005284 excitation Effects 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 7
- 239000012212 insulator Substances 0.000 claims description 7
- 239000000243 solution Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000669 Chrome steel Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Combined Devices Of Dampers And Springs (AREA)
Description
【考案の詳細な説明】
＜産業上の利用分野＞
本考案は振動式密度計や航空用圧力計のセンサ
として用いられる薄肉円筒（以下薄筒という）の
加工装置に関する。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a processing device for thin-walled cylinders (hereinafter referred to as thin cylinders) used as sensors for vibrating density meters and aviation pressure gauges.
＜従来の技術＞
第５図は薄肉を振動子とした振動式密度計の一
例を示すブロツク図である。図において、１は薄
筒状の振動子、２はこの振動子を励振させる励振
手段、３は振動子の振動を検出する検出手段、４
は検出手段３からの信号を入力とし、励振手段２
に出力信号を与える発振器である。この発振器４
は、振動子１を含んで自励振回路を形成してお
り、出力端子５から振動子の共振周波数（振動子
１内の流体密度に対応）信号を得ることができ
る。<Prior Art> FIG. 5 is a block diagram showing an example of a vibrating density meter using a thin wall as a vibrator. In the figure, 1 is a thin cylindrical vibrator, 2 is an excitation means for exciting this vibrator, 3 is a detection means for detecting the vibration of the vibrator, 4
inputs the signal from the detection means 3, and the excitation means 2
This is an oscillator that provides an output signal to the This oscillator 4
includes the vibrator 1 to form a self-excited circuit, and a resonant frequency signal (corresponding to the fluid density within the vibrator 1) of the vibrator can be obtained from the output terminal 5.
ところで、このような密度計の振動子として用
いられる薄筒は、肉厚0.05〜0.08mmに加工する必
要があるが、この薄筒の加工には従来、旋盤、研
削盤、研磨盤等が用いられていた。 By the way, the thin tube used as the vibrator of such a density meter needs to be machined to a wall thickness of 0.05 to 0.08 mm, but conventionally, lathes, grinders, polishers, etc. have been used to process these thin tubes. It was getting worse.
＜考案が解決しようとする問題点＞
しかしながら、上記機械による加工では精度の
よい均一な品質の薄筒を得るのは難しいという問
題があつた。<Problems to be Solved by the Invention> However, there is a problem in that it is difficult to obtain thin tubes with high precision and uniform quality by processing using the above-mentioned machines.
＜問題点を解決するための手段＞
本考案は上記従来技術の問題点に鑑みてなされ
たもので、一方が閉塞され、他方が開口した薄筒
と、この薄筒の内径の略中心に緩入されその先端
部が前記薄肉円筒の底部近傍に配置された管と、
前記薄筒の開口部および前記管の外径部シールす
ると共に、前記薄筒の内部に連通する少なくとも
一つの貫通孔を有する絶縁体と、前記管に一定の
濃度のエツチング液を注入する手段と、前記薄筒
を陽極、前記管を陰極として電流を流す定電流源
と、前記薄筒を励振させる励振手段と、前記薄筒
の振動を検出する振動検出手段を具備したことを
構成上の特徴とするものである。<Means for Solving the Problems> The present invention has been made in view of the problems of the prior art described above. a tube whose tip is placed near the bottom of the thin-walled cylinder;
an insulator sealing the opening of the thin tube and the outer diameter of the tube and having at least one through hole communicating with the inside of the thin tube; and means for injecting an etching solution of a certain concentration into the tube. , a constant current source that flows a current using the thin tube as an anode and the tube as a cathode, excitation means for exciting the thin tube, and vibration detection means for detecting vibration of the thin tube. That is.
＜作用＞
注入手段から管にエツチング液を注入すると、
エツチング液は管の先端（薄筒の底部近傍）から
薄筒内に導びかれその内部を満し、絶縁体に設け
た貫通孔を通じて外部へ排出される。エツチング
液が薄筒内に充満した状態で、薄筒を陽極、管を
陰極として電流を流すと陽極である薄筒の内壁が
エツチングされる。エツチングが少し進んだとこ
ろで陽極，陰極への給電を中止し、エツチング時
に発生した気泡や溶出物を排出した後薄筒を励振
手段により励振させ、この薄筒の共振周波数を検
出し、エツチング量をチエツクしながら薄筒の加
工を行なう。<Operation> When the etching solution is injected into the tube from the injection means,
The etching liquid is introduced into the thin tube from the tip of the tube (near the bottom of the thin tube), fills the inside of the thin tube, and is discharged to the outside through a through hole provided in the insulator. When the thin tube is filled with etching solution and a current is passed through the thin tube as an anode and the tube as a cathode, the inner wall of the thin tube, which is the anode, is etched. When etching has progressed a little, the power supply to the anode and cathode is stopped, and after expelling the bubbles and eluates generated during etching, the thin cylinder is excited by an excitation means, and the resonant frequency of this thin cylinder is detected, and the amount of etching is calculated. Process the thin tube while checking.
＜実施例＞
第１図は本考案の一実施例を示す薄筒加工装置
である。図において１はニツケル・クロム鋼（例
えば商品名Ni−spanC）からなり、一方が開口し
他方が閉塞され両端に厚肉部を有する薄筒であ
る。この薄筒の薄肉部は機械加工により、所定の
寸法（例えば0.05〜0.08μm）よりわずかに大きく
（例えば10μm）加工されている。２はニツケル・
クロム鋼（例えばJIS−SUS316）からなる管で、
その先端が薄筒１の底部付近まで緩入され、薄筒
１の開口部近傍で絶縁体３により固定されると共
にシールされている。絶縁体３には薄筒の内部に
連通する貫通孔４，４ａが設けられている。５は
薄筒１を陽極，管２を陰極として矢印Ａ方向に電
流を流す定電流源、６は一定濃度のエツチング液
が貯蔵されたタンク、７はエツチング液を一定の
速度で送出するポンプ、８，９は薄筒１の外壁に
設けられた励振手段および振動検出手段である。<Example> FIG. 1 shows a thin tube processing apparatus showing an example of the present invention. In the figure, numeral 1 is a thin tube made of nickel chrome steel (for example, trade name Ni-spanC), with one side open and the other side closed, and having thick walled portions at both ends. The thin wall portion of this thin tube is machined to be slightly larger (for example, 10 μm) than a predetermined size (for example, 0.05 to 0.08 μm). 2 is nickel
A tube made of chrome steel (e.g. JIS-SUS316),
Its tip is loosely inserted into the thin tube 1 near the bottom, and is fixed and sealed by an insulator 3 near the opening of the thin tube 1. The insulator 3 is provided with through holes 4, 4a that communicate with the inside of the thin tube. 5 is a constant current source that flows a current in the direction of arrow A using the thin tube 1 as an anode and the tube 2 as a cathode; 6 is a tank in which an etching solution of a certain concentration is stored; 7 is a pump that delivers the etching solution at a constant speed; Reference numerals 8 and 9 are excitation means and vibration detection means provided on the outer wall of the thin tube 1.
上記構成において、タンク６のエツチング液は
ポンプ７により管２を通じて薄筒１内に送出さ
れ、矢印に示すように薄筒１内を充満し、絶縁体
３に設けられた貫通孔４，４ａを通つて薄筒１の
外部に排出される。このような状態で定電流源か
ら薄筒１を陽極，管２を陰極として電流を流すと
エツチングが開始される。 In the above configuration, the etching liquid in the tank 6 is sent into the thin tube 1 through the pipe 2 by the pump 7, filling the thin tube 1 as shown by the arrow, and filling the through holes 4, 4a provided in the insulator 3. and is discharged to the outside of the thin tube 1. In this state, when a current is applied from a constant current source using the thin tube 1 as an anode and the tube 2 as a cathode, etching is started.
第２図は陽極をNi−spanC，陰極をステンレス
鋼JIS SUS316とし、エツチング電流を２アンペ
ア，エツチング液流量を１分当り10.5c.c.，エツチ
ング液温を室温，エツチング液をH3PO4と
H2SO4を８対２の割合で混合し、この混合液１
に対し50gのCrO3を加えたものとし、縦軸をエ
ツチング量，横軸をエツチング時間として示すも
のである。図によればエツチング時間に比例して
エツチング量がほぼ直線的に増加（エツチングレ
ート1.5μm／min）していることがわかる。 In Figure 2, the anode is Ni-spanC, the cathode is JIS SUS316 stainless steel, the etching current is 2 amperes, the etching liquid flow rate is 10.5 cc per minute, the etching liquid temperature is room temperature, and the etching liquid is H 3 PO 4 .
Mix H 2 SO 4 in a ratio of 8:2, and add 1
50 g of CrO 3 was added to the sample, and the vertical axis shows the etching amount and the horizontal axis shows the etching time. The figure shows that the etching amount increases almost linearly in proportion to the etching time (etching rate 1.5 μm/min).
第３図は第２図と同様のエツチング液を使用
し、エツチング液流量を１分当り10c.c.，エツチン
グ時間を20分として、縦軸をエツチングレート、
横軸をエツチング電流として示したものである。
図によればエツチング電流の増加に比例してエツ
チングレートもほぼ直線的に増加（例えばエツチ
ング電流２アンペア近傍で1.46μm／min）してい
ることがわかる。 In Figure 3, the same etching solution as in Figure 2 was used, the etching solution flow rate was 10 c.c. per minute, and the etching time was 20 minutes, and the vertical axis represents the etching rate.
The horizontal axis represents the etching current.
The figure shows that the etching rate increases almost linearly in proportion to the increase in etching current (for example, to 1.46 μm/min when the etching current is around 2 amperes).
上記第２図，第３図から明らかなように、エツ
チング電流またはエツチング時間をコントロール
することにより、薄筒１の内壁を微細加工するこ
とができる。 As is clear from FIGS. 2 and 3, the inner wall of the thin tube 1 can be finely machined by controlling the etching current or etching time.
第４図は上記装置により薄筒を加工する前と、
後の薄筒１の各円環次数モードにおける共振周波
数の変化を示すものである。図中、点線は加工前
の、実線は加工後の状態である。図によれば２次
モード付近では加工前後での共振波数はほとんど
変化がないが、３次モード近辺では−0.118kHz，
４次モード近辺では−0.81kHz，５次モード近辺
では−1.334kHz共振周波数が減少している。従つ
て、例えば薄筒１の４次モードでの共振周波数を
使用し、その使用限界共振周波数が8.5kHz以下と
した場合、第４図では9kHzから8.19kHzになつて
おり使用限界周波数内に入つている。この装置に
よれば、エツチング時に発生した気泡や溶出物
は、ポンプ７からの圧力により強制的に薄筒１内
から排出され、常に一定の濃度を保つてエツチン
グを行なうことができる。また薄筒１の周波数チ
エツクを行なう場合は、エツチング電流を切り、
気泡を全て排出した状態で励振手段８により薄筒
１を励振し、振動検出手段９により共振周波数を
検出することができ、つまり薄筒１を加工装置に
取り付けた状態で共振周波数（エツチングの度合
い）をチエツクしながら加工を進めることができ
る。 Figure 4 shows before processing the thin tube with the above device,
It shows the change in resonance frequency in each annular order mode of the thin tube 1 afterward. In the figure, the dotted line shows the state before processing, and the solid line shows the state after processing. According to the figure, there is almost no change in the resonant wave number before and after machining near the second mode, but -0.118kHz near the third mode.
The resonant frequency decreases by -0.81kHz near the 4th mode and -1.334kHz near the 5th mode. Therefore, for example, if the resonance frequency of the 4th mode of the thin tube 1 is used and the usable limit resonance frequency is 8.5 kHz or less, in Figure 4 it goes from 9 kHz to 8.19 kHz, which is within the usable limit frequency. It's on. According to this apparatus, bubbles and eluate generated during etching are forcibly discharged from the thin tube 1 by the pressure from the pump 7, and etching can be performed while always maintaining a constant concentration. Also, when checking the frequency of the thin tube 1, turn off the etching current and
With all the air bubbles expelled, the excitation means 8 excites the thin tube 1, and the vibration detection means 9 detects the resonant frequency. ) You can proceed with machining while checking.
なお、薄肉円筒振動子の共振周波数は圧力，密
度により変化し、円筒内が空気の場合とエツチン
グ液が満たされた状態では当然異なるが、この関
係は一定の相関関係（二次の曲線）となるので、
エツチング液の密度が分れば空気や密度の異なる
他の液体中での共振周波数を求めることが可能で
ある。 Note that the resonant frequency of a thin-walled cylindrical resonator changes depending on pressure and density, and is naturally different when the cylinder is filled with air and when it is filled with etching liquid, but this relationship is a constant correlation (quadratic curve). So,
If the density of the etching liquid is known, it is possible to find the resonance frequency in air or other liquids with different densities.
また、エツチングされた薄筒の削り屑は大部分
がエツチング液とともに流れさるが、一部は陰極
である管２に付着する。ここでは、共振周波数の
相関はその切り屑も含めた状態で求めておくもの
とする。なお、付着する切り屑の量は僅かであり
共振周波数への影響は無視することができる。 Further, most of the etched thin cylinder shavings flow away together with the etching solution, but some of them adhere to the tube 2, which is the cathode. Here, it is assumed that the correlation between the resonance frequencies is determined including the chips. Note that the amount of adhering chips is small and the influence on the resonance frequency can be ignored.
＜考案の効果＞
以上、実施例と共に具体的に説明したように本
考案によれば、機械加工によりわずかに大きく加
工された薄筒をエツチング加工するに際しては管
の先端から一定の濃度のエツチング液を一定の速
度で注入しながら行うので加工量を精密に制御す
ることができ，チエツクの回数を少なくすること
ができる。さらに、その薄筒を取外すことなく共
振周波数をチエツクしながら所定の寸法に仕上げ
るので、精度のよい均一な品質を有する薄筒を得
ることができる。<Effects of the invention> As described above in detail with the embodiments, according to the invention, when etching a thin tube that has been slightly enlarged by machining, an etching solution of a certain concentration is applied from the tip of the tube. Since the process is performed while injecting at a constant rate, the amount of processing can be precisely controlled and the number of checks can be reduced. Furthermore, since the thin tube is finished to a predetermined size while checking the resonance frequency without removing the thin tube, it is possible to obtain a thin tube with high precision and uniform quality.
第１図は本考案の一実施例を示す薄肉円筒加工
装置、第２図はエツチング時間とエツチング量と
の関係を示す説明図、第３図はエツチング電流と
エツチングレートの関係を示す説明図、第４図は
薄肉円筒加工前後における円環次数モードと共振
周波数との関係を示す説明図、第５図は薄肉円筒
を密度計として用いた状態を示すブロツク図であ
る。
１…薄肉円筒、２…管、３…絶縁体、４，４ａ
…貫通孔、５…定電流源、６…タンク、７…ポン
プ、８…励振手段、９…振動検出手段。
FIG. 1 is a thin-walled cylindrical processing apparatus showing an embodiment of the present invention, FIG. 2 is an explanatory diagram showing the relationship between etching time and etching amount, and FIG. 3 is an explanatory diagram showing the relationship between etching current and etching rate. FIG. 4 is an explanatory diagram showing the relationship between the annular order mode and the resonance frequency before and after processing the thin cylinder, and FIG. 5 is a block diagram showing the state in which the thin cylinder is used as a density meter. 1... Thin cylinder, 2... Tube, 3... Insulator, 4, 4a
...Through hole, 5... Constant current source, 6... Tank, 7... Pump, 8... Excitation means, 9... Vibration detection means.
Claims (1)
該薄肉円筒の内径の略中心に緩入されその先端部
が前記薄肉円筒の底部近傍に配置された管と、前
記薄肉円筒の開口部および前記管の外径部をシー
ルすると共に、前記薄肉円筒の内部に連通する少
なくとも一つの貫通孔を有する絶縁体と、前記管
に一定の濃度のエツチング液を一定の速度で注入
する手段と、前記薄肉円筒を陽極、前記管を陰極
として電流を流す定電流源と、前記薄肉円筒を励
振する励振手段と前記薄肉円筒の振動を検出する
振動検出手段を具備したことを特徴とする薄肉円
筒加工装置。 a thin cylinder with one end closed and the other open;
a tube that is loosely inserted approximately into the center of the inner diameter of the thin-walled cylinder and whose tip end is disposed near the bottom of the thin-walled cylinder; and a tube that seals the opening of the thin-walled cylinder and the outer diameter of the tube; an insulator having at least one through hole communicating with the inside of the tube; a means for injecting an etching solution of a certain concentration into the tube at a constant rate; and a constant means for passing an electric current using the thin-walled cylinder as an anode and the tube as a cathode. A thin-walled cylinder processing apparatus comprising: a current source; an excitation means for exciting the thin-walled cylinder; and a vibration detection means for detecting vibrations of the thin-walled cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984185851U JPH0329331Y2 (en) | 1984-12-07 | 1984-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984185851U JPH0329331Y2 (en) | 1984-12-07 | 1984-12-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61103479U JPS61103479U (en) | 1986-07-01 |
| JPH0329331Y2 true JPH0329331Y2 (en) | 1991-06-21 |
Family
ID=30743312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984185851U Expired JPH0329331Y2 (en) | 1984-12-07 | 1984-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0329331Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS504186A (en) * | 1973-05-15 | 1975-01-17 | ||
| JPS5838782B2 (en) * | 1975-08-01 | 1983-08-25 | ミノルタ株式会社 | Denshishashin Fukushiyaki |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5838782U (en) * | 1981-09-10 | 1983-03-14 | 株式会社東芝 | Electrolytic polishing equipment |
-
1984
- 1984-12-07 JP JP1984185851U patent/JPH0329331Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS504186A (en) * | 1973-05-15 | 1975-01-17 | ||
| JPS5838782B2 (en) * | 1975-08-01 | 1983-08-25 | ミノルタ株式会社 | Denshishashin Fukushiyaki |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61103479U (en) | 1986-07-01 |
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