JPH03289483A - Containing tube for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent external leads from coming in contact with the internal bottom surface of a containing tube by forming a plurality of projected guides with the heights made larger than a distance between the bottom surface of a conductor device and the lower ends of the external leads, between the external leads of the containing conductor device, integrally on the shell-shaped internal bottom surface of the semiconductor device for enabling them to be aligned in the length direction and to be contained in. CONSTITUTION:By fitting a PLCC type semiconductor device 11 in a state that external leads 12 are arranged between projected guides 2, in a containing tube 1, a plurality of the semiconductor devices 11 can contain them to be arranged in the length direction. The width of the projected guide 2 is made smaller by about 0.2mm than a width (w) between the external lead 12, and the height (h) of the guide 2 is made larger by about 0.3mm than a distance d1 between the bottom surface of the semiconductor device 11 and the lower end of the external lead 12, so that the projected guide 2 may be positioned between the external leads 12 of the PLCC type semiconductor device 11.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a tube for housing a semiconductor device,
In particular, the present invention relates to a housing tube that is passed through a plastic leap-fit chip carrier (hereinafter abbreviated as PLCC) type semiconductor device.

[Conventional technology]

Conventionally, various tubes made of plastic have been proposed as storage tubes for storing, storing, or transporting semiconductor devices, and the plastic tube for PLCC type semiconductor devices is shown in Fig. 6. is provided. This plastic tube 21 is
It is configured as a rectangular tube with a cross-sectional shape matching the outer shape of the PLCC type semiconductor device 11, and a plurality of PLCC type semiconductor devices 11 can be housed therein in the length direction.

[Problem to be solved by the invention]

Such conventional plastic tubes have no special irregularities inside and are formed flat. For this reason,
The PLCC type semiconductor device 11 housed within the plastic tube 21 may be moved within the tube. In particular, the plastic tube 21 and the PLCC type semiconductor device 1
If there is a play of approximately ll1l111 between the PLC and the
Since the C-type semiconductor device 11 has external leads 12 in four directions, when it moves within the plastic tube 21,
There is a problem in that the external leads 12 of adjacent PLCC type semiconductor devices are brought into contact with each other, and external lead bending occurs due to mutual interference between the external leads.

In addition, the external lead 1 may be damaged by shocks applied during transportation.
Another problem is that the bottom of the plastic tube 21 directly collides with the inner surface of the plastic tube 21, causing bending of the external lead.

An object of the present invention is to provide a plastic tube that prevents external leads from bending.

[Means to solve the problem]

The storage tube of the present invention is located between the external leads of the semiconductor devices to be stored on the inner bottom surface of a cylinder capable of accommodating semiconductor devices side by side in the length direction, and the height of the storage tube is between the bottom surface of the semiconductor devices and the external leads. A plurality of convex guides whose distance is larger than the distance from the lower end are integrally formed.

Further, convex portions may be provided on the inner upper surface of the tube at intervals smaller than the width dimension of the semiconductor device.

[Effect]

According to the present invention, the convex guide prevents the external leads of the semiconductor device from coming into contact with the inner bottom surface of the storage tube, thereby preventing the external leads from bending. In addition, the convex guide allows
Lateral bending of the external leads is also prevented.

Further, the convex portion prevents friction between the semiconductor device and the tube, prevents static electricity from being generated, and prevents the stamped product name from being worn out.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

1 to 3 show a first embodiment of the present invention, with FIG. 1 being a front view and FIG. 2 being a partially cutaway view.

In these figures, the storage tube 1 is constructed by extrusion molding plastic, and is formed into a hollow cylindrical shape with a rectangular cross section as a whole. A plurality of convex guides 2 are provided on the inner bottom surface of the storage tube 1 and extend in the length direction of the storage tube 1 at small intervals in the width direction. And this storage tube 1
As shown in FIG. 3, a plurality of semiconductor devices 11 can be arranged in the length direction by installing the PLCC type semiconductor devices 11 inside with the external leads 12 inserted between the convex guides 2. It is possible to carry out storage according to the requirements.

The width of the convex guide 2 is about 0.2 mm narrower than the interval W between the external leads 12 of the semiconductor device 11 so that the convex guide 2 is positioned between the external leads 12 of the PLCC type semiconductor device 11. . Moreover, the height h is the semiconductor device 1
The distance d between the bottom surface of the lead 1 and the lower end of the external lead 12 is 0.
It has been raised by about 3tam. Further, in this state, the distance d2 between the upper surface of the semiconductor device 11 and the inner upper surface of the storage tube 1 is approximately 0.71III+.

Therefore, if the housing tube 1 having this configuration is used, the bottom surface of the semiconductor device 11 is supported by the convex guide 2, and since the height of the convex guide 2 is set as described above, the external lead 12 of the semiconductor device 11 is supported by the convex guide 2. The bottom surface of the housing tube 1 does not come into direct contact with the inner bottom surface of the storage tube 1, and bending of the external lead 12 due to contact with the inner bottom surface of the tube can be prevented. Furthermore, even if mutual interference occurs between external leads of adjacent semiconductor devices, each external lead 12 is restrained in the left-right direction by the convex guide 2, so that the external lead 12 is prevented from bending in the left-right direction. can. Furthermore, since the convex guide 2 also restricts the distance between the top surface of the semiconductor device 11 and the inner top surface of the storage tube 1, the semiconductor device 11 is prevented from colliding with the storage tube 1 due to external impact, etc., and the semiconductor device It is also possible to prevent damage to 11.

FIG. 4 is a front view of a second embodiment of the invention.

In this embodiment, two convex portions 3 are formed at both ends of the upper surface of a storage tube IA formed in the same manner as in the first embodiment, with an interval slightly smaller than the width dimension of the semiconductor device 110. This convex portion 3 is also formed to extend in the length direction of the storage tube 1.

If the storage tube IA of this embodiment is used, as shown in FIG. 5, the upper surface of the stored PLCC type semiconductor device 11 contacts the convex portion 3, but the area in contact with the inner upper surface of the storage tube l can be reduced. . This suppresses the generation of static electricity that is likely to occur due to friction between the semiconductor device 11 and the storage tube 1, and prevents the product name stamp provided on the top surface of the semiconductor device 11 from coming into contact with the upper surface of the storage tube 1 and being worn out. can be prevented.

[Effects of the Invention] As explained above, the present invention prevents the external leads of the semiconductor device from coming into contact with the inner bottom surface of the storage tube by using the convex guides formed at the required intervals and heights, thereby preventing the external leads from bending. It can be prevented. Furthermore, even if the external leads of adjacent semiconductor devices interfere with each other, the convex guide can prevent the external leads from bending in the lateral direction.

Furthermore, by providing the convex portion, friction between the semiconductor device and the tube can be prevented, static electricity can be prevented from being generated, and the stamped product name can also be prevented from being worn out.

[Brief explanation of the drawing]

FIG. 1 is a front view of a first embodiment of the present invention, FIG. 2 is a partially cutaway view, FIG. 3 is a front view of a state in which a semiconductor device is housed, and FIG. 4 is a front view of a second embodiment of the present invention. FIG. 5 is a front view of a state in which a semiconductor device is housed, and FIG. 6 is a perspective view of a conventional storage tube. 1, IA... Storage tube, 2... Convex guide, 3
...Convex portion, 11...PLCC type semiconductor device, 12
...External lead, 21...Plastic tube. Figure 1 Figure 4 Figure 2 Figure 5 Figure 3

Claims (2)

[Claims] 1. It has a cylindrical shape that can accommodate semiconductor devices lined up in the length direction, and the inner bottom is located between the external leads of the semiconductor devices to be stored, and its height is the same as the bottom of the semiconductor device and the lower end of the external leads. A storage tube for semiconductor devices characterized by integrally forming a plurality of convex guides that are larger than the distance. 2. 2. A storage tube for a semiconductor device according to claim 1, wherein the inner upper surface is provided with convex portions having an interval smaller than the width dimension of the semiconductor device.