JPH0328750U - - Google Patents
Info
- Publication number
- JPH0328750U JPH0328750U JP8967789U JP8967789U JPH0328750U JP H0328750 U JPH0328750 U JP H0328750U JP 8967789 U JP8967789 U JP 8967789U JP 8967789 U JP8967789 U JP 8967789U JP H0328750 U JPH0328750 U JP H0328750U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- cut
- leads
- electronic component
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8967789U JPH0328750U (es) | 1989-07-28 | 1989-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8967789U JPH0328750U (es) | 1989-07-28 | 1989-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0328750U true JPH0328750U (es) | 1991-03-22 |
Family
ID=31639248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8967789U Pending JPH0328750U (es) | 1989-07-28 | 1989-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328750U (es) |
-
1989
- 1989-07-28 JP JP8967789U patent/JPH0328750U/ja active Pending