JPH03280451A - Semiconductor device mounting wiring board and manufacture thereof - Google Patents

Abstract

PURPOSE:To enable a wiring board of this design to be improved in dense wiring and heat dissipating property by a method wherein a conductive circuit formed in contact with a wire bonding part, a plating-resistant resist film formed on a part of the upside of the conductive circuit, a through-hole formed penetrating through the conductive circuit and an alumina ceramic board, and a pin inserted into the through-hole and fixed are provided. CONSTITUTION:A photosensitive resist film is pasted on all the surface of a copper coating film, a negative film provided with a transparent part is pasted on the resist film, and a light exposure process is carried out to cure the photosensitive resist film provided under the transparent part of the negative film. In succession, the photosensitive resist film is removed, and an etching process is executed to remove the disused part of the copper coating film which is not required to be used as a conductive circuit. Thereafter, the photosensitive resist film is separated off to form a conductive circuit 3. In succession, a plating resistant resist film 5 is formed on the part other than a part which serves as a land of the conductive circuit 3 and its top, and a land part and a wire bonding part 4 are formed. Then, a nail head pin 5 plated with tin is inserted into a through-hole 2 making its one end exposed at the underside of an alumina ceramic board 1 and fixed with solder, and thus a semiconductor element mounting wiring board provided with the hermetically sealed through-hole 2 can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a wiring board for mounting semiconductor elements and a method for manufacturing the same.

(Conventional technology) Conventional wiring boards for mounting semiconductor elements are made of tungsten and molybdenum on ceramic green sheets.

A circuit is formed by printing a paste mainly composed of powdered metals with high melting points such as molybdenum and manganese, then these are laminated and fired, and the top surface of the circuit is plated with nickel and gold, and lead pins are attached. It is manufactured by silver brazing, or by forming a copper film on an organic substrate such as a glass epoxy board, and forming a circuit by etching or other methods.
Furthermore, the top surface of the circuit is nickel plated and gold plated,
It was manufactured by soldering lead pins.

(Problem to be solved by the invention) However, since the former method uses a printing method, the wiring density is low, and devices with a large number of wire bonding terminals need to be multilayered. The disadvantage is that the manufacturing process is complicated.

On the other hand, in the latter method, the thermal conductivity of the substrate is low.

A drawback is that the heat dissipation performance of the heat generated from the semiconductor element is poor.

An object of the present invention is to provide a wiring board for mounting semiconductor elements and a method for manufacturing the same, which overcomes the above-mentioned drawbacks.

(Means for Solving Problem 1111) The present invention provides a wire bonding portion formed on the peripheral surface of an alumina ceramic substrate excluding a portion where a semiconductor element is mounted at approximately the center thereof.

A conduction circuit formed in contact with the wire bonding part,
A wiring board for mounting a semiconductor element, comprising a plating-resistant resist film formed on a part of the upper surface of a conductive circuit, a pin inserted and fixed in a through hole formed by penetrating the conductive circuit and an alumina ceramic substrate, and After forming through holes at arbitrary locations on the alumina ceramic substrate, the surface of the alumina ceramic substrate is chemically roughened, a metal coating is then formed by a plating method, and a resist film is further formed on the top surface of the alumina ceramic substrate. Using the etching method, a conductive circuit is formed by leaving only the necessary parts of the metal coating, and a plating-resistant resist film is formed on a part of the conductive circuit, and a plating-resistant resist film is formed on the tip of the conductive circuit where the plating-resistant resist film is not formed. The present invention relates to a method of manufacturing a wiring board for mounting a semiconductor element, in which a wire bonding part is formed and then a pin is inserted into a through hole and fixed.

There are no particular limitations on the roughening method used in the present invention. For example, Snow solution or #'1NH4F, (NH4)2S
O4.

Thick H! It can be roughened by immersing it in a fluoride mixture consisting of a mixed solution of SO4, HzO, etc., or by immersing it in a heated melt of NaOH, KOH, etc.

Nickel, nickel alloy, copper, steel alloy, gold, etc. are used as the metal used to form the metal coating that constitutes the wire bonding portion and the conductive circuit. There are no particular restrictions on the plating method.

It is preferable to use an electroless plating method. As for the plating, it is preferable to apply electroless copper plating, for example, and then apply nickel or gold plating on the upper surface.

The resist film and plating-resistant resist film may be formed by screen printing a thermosetting resist on the top surface of the metal coating and heating and curing it, or may be formed by pasting a photosensitive resist film on the metal coating. There are no restrictions.

Etching method i11. It shall be appropriately selected depending on the method of forming the resist film, and there are no particular limitations.

The material of the pin is not limited to 9%, but it is copper.

Ni-based alloys such as 42 alloy and 52 alloy, copper, and copper alloys can be used. The length of the pin is preferably longer than the conduction circuit and the alumina ceramic substrate forming the conduction circuit to protrude from the conduction circuit to be inserted and fixed and the alumina ceramic substrate forming the conduction circuit, and the protrusion length is 2. - or more is preferable. Solder, silver solder, thermosetting resin, heat-resistant thermoplastic resin, or the like is used to secure the pin to the conductive circuit.

(Example) The present invention will be explained in detail below.

Example 1 As shown in Fig. 1, the dimensions are 80 x 80 mm and the thickness is 1.
0 IIIm alumina ceramic substrate (manufactured by Hitachi Chemical Co., Ltd., trade name Halox 570) 1, at any location except for the area where the semiconductor element is mounted in the approximate center.
2 through holes 2 with a diameter of 0.64 me (φ) at 54-hole intervals.
He formed 08 pieces, degreasing liquid (manufactured by Hitachi Chemical, product name H
CR201), dried and heated to 350°C
a 1 minute in the OH melt! ! ! It was crushed and roughened. Next! 1 degree 10]RII immersed in 1% H280a solution for 5 minutes, neutralized by applying vibrational energy by ultrasonic waves,
Furthermore, after washing with water and drying, roughening was performed again by immersion in a NaOH melt heated to 350° C. for 1 minute in the middle of the melt. After that, in the same manner as above, it was immersed in Ichi 804 solution with a concentration of 10 parts Ichi for 5 minutes to neutralize it, washed with water, and then crushed in a thermal electrolytic plating solution (manufactured by Hitachi Chemical Co., Ltd., trade name L-592 for 6 hours to form a thick layer). A steel coating of 10 lm was formed.

Next, a photosensitive resist film (manufactured by Hitachi Chemical Co., Ltd.).

A film (trade name: PH'l'-862AP'-40) was applied to the entire surface of the copper film, and a negative film with a transparent part formed in the same shape as the conductive circuit to be obtained was applied to the upper surface of the film, and exposed. The photosensitive resist film placed on the lower surface of the transparent portion of the negative film was then cured. Next, the negative film is removed, and the photosensitive resist film is removed in areas that have not been developed and cured, specifically, areas that have not been exposed to light, and etched with mchloride etching solution to remove copper from areas that are unnecessary for conductor circuits. The coating was removed.

Ta.

Next, a plating-resistant resist (manufactured by Asahi Chemical Research Institute, trade name: CCR506) is applied to the portion of the conductive circuit 3 excluding the land portion and its tip portion to form a plating-resistant resist film 5. Nickel plating is applied to the copper coating on the part and its tip to a thickness of 2 μm in a Watts bath, and then gold plating is applied to the upper surface of the plated surface under further pressure [manufactured by Electroblating Engineers of Japan (EEJA), trade name: Temperex]. 401] to form a land portion (not shown) and a wire bonding portion 4.

Next, as shown in FIG.
The diameter applied to the thickness of am is 0.46m+.

52 with a length of 710m with one end shaped like a nail condyle.
Insert the rad pin 5 into the alloy nail and press the other end (
8n:Pb=60:4 after exposing the terminal) to the bottom surface
0 solder to fix the nail head pin 5 and through hole 2.
A wiring board for mounting a semiconductor element, the inside of which was hermetically sealed, was obtained.

(Effects of the Invention) The wiring board for mounting semiconductor elements according to the present invention is excellent in high-density wiring, does not require multilayering even when the number of wire bonding terminals is large, and has excellent heat dissipation properties. This is a wiring board for

[Brief explanation of the drawing]

FIG. 1 is a partially omitted cross-sectional view showing the manufacturing process of a wiring board for mounting a semiconductor element according to an embodiment of the present invention, and FIG. 2 shows a wiring board for mounting a semiconductor element according to an embodiment of the present invention. Explanation of symbols 1... Alumina ceramic substrate 2... Through hole 3... Continuity circuit 4...
・Wire bonding part 5... Anti-plating resist film 6... Rad pin to nail

Claims (1)

[Scope of Claims] 1. A wire bonding portion formed on the surface of the alumina ceramic substrate around the area excluding the portion where the semiconductor element is mounted, which is approximately in the center, and a conduction circuit formed in contact with the wire bonding portion. A wiring for mounting a semiconductor element, which is made up of a resist film formed on a part of the upper surface of the conductive circuit, a through hole formed through the conductive circuit and the alumina ceramic substrate, and a pin inserted and fixed in the through hole. Board. 2. After forming through-holes at arbitrary locations on the alumina ceramic substrate, the surface of the alumina ceramic substrate is chemically roughened, a metal coating is then formed by a plating method, and a resist film is further formed on the top surface. , a conductive circuit is formed by leaving only the necessary part of the metal film by etching, and then a plating resist film is formed on a part of the conductive circuit, and the conductive circuit without the plating resist film is formed. A method for manufacturing a wiring board for mounting a semiconductor element, which comprises forming a wire bonding part at the tip, and then inserting a pin into a through hole and fixing it.