JPH0327444Y2 - - Google Patents

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Publication number
JPH0327444Y2
JPH0327444Y2 JP14006687U JP14006687U JPH0327444Y2 JP H0327444 Y2 JPH0327444 Y2 JP H0327444Y2 JP 14006687 U JP14006687 U JP 14006687U JP 14006687 U JP14006687 U JP 14006687U JP H0327444 Y2 JPH0327444 Y2 JP H0327444Y2
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JP
Japan
Prior art keywords
layer
thin copper
surface plate
coating layer
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14006687U
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Japanese (ja)
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JPS63127402U (en
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Publication date
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Priority to JP14006687U priority Critical patent/JPH0327444Y2/ja
Publication of JPS63127402U publication Critical patent/JPS63127402U/ja
Application granted granted Critical
Publication of JPH0327444Y2 publication Critical patent/JPH0327444Y2/ja
Expired legal-status Critical Current

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Description

【考案の詳細な説明】 〈産業上の利用分野〉 この考案は銅イオンの殺菌作用で水虫の治療及
び予防に効果がある靴の中敷きに関する。
[Detailed description of the invention] <Industrial application field> This invention relates to a shoe insole that is effective in treating and preventing athlete's foot due to the bactericidal action of copper ions.

〈従来の技術〉 実公昭55−42727号公報で中敷きの表面に銅、
或いはその合金の粉を含有する被覆層を設けたも
のが公知である。
<Prior art> Utility Model Publication No. 55-42727 discloses that copper is used on the surface of the insole.
Alternatively, it is known that a coating layer containing powder of the alloy is provided.

又、銅線製の網を通気性シートからなる表面板
の下面に敷いた中敷きは実開昭55−13872号公報
で公知である。
Furthermore, an insole in which a mesh made of copper wire is laid on the lower surface of a surface plate made of a breathable sheet is known from Japanese Utility Model Application Publication No. 13872/1983.

〈考案が解決しようとする問題点〉 上記実公昭55−42727号では、銅或いはその合
金の粉末はそのまゝでは中敷きの表面に付着しな
いため固まると硬化する接着剤に練込み、層とし
て付着させるため実際に銅イオンを発生するのは
被覆層の表面に露出した銅粉だけで、大部分の銅
粉は接着剤の硬化層中に閉じ込められ、銅粉の使
用量の割には殺菌効果が乏しい。
<Problems to be solved by the invention> In the above-mentioned Utility Model Publication No. 55-42727, the powder of copper or its alloy does not adhere to the surface of the insole as it is, so it is kneaded into an adhesive that hardens when it hardens and adheres as a layer. Therefore, only the copper powder exposed on the surface of the coating layer actually generates copper ions; most of the copper powder is trapped in the hardened layer of the adhesive, and the sterilizing effect is low considering the amount of copper powder used. is scarce.

又、実開昭55−13872号公報のものは銅線で網
を編成するのに手数がかゝると共に、これを通気
性シートの下面に敷くとゴワゴワして履き心地が
著しく悪い。
Furthermore, in the method disclosed in Japanese Utility Model Application Publication No. 55-13872, it is time-consuming to knit the net with copper wires, and when it is laid on the underside of the breathable sheet, it becomes stiff and extremely uncomfortable to wear.

〈問題点を解決するための手段〉 そこで本考案は一層又は複数層の通気性シート
からなる表面板の下面に、銅又はその合金からな
る薄層(銅薄層と記す。)を介在させてプラスチ
ツクの被覆層を設け、この被覆層には下面から上
記銅薄層に達する孔と、下面から下向きに突出す
る突起を設けたことを特徴とする。
<Means for solving the problem> Therefore, the present invention interposes a thin layer made of copper or its alloy (hereinafter referred to as a thin copper layer) on the lower surface of the surface plate made of one or more layers of breathable sheets. The present invention is characterized in that a plastic covering layer is provided, and this covering layer is provided with a hole reaching the thin copper layer from the lower surface and a protrusion projecting downward from the lower surface.

〈作用〉 銅薄層が発生する銅イオンは通気性シートの表
面板を通じ足裏に作用する以外に、表面板の下面
のプラスチツクの被覆層の孔から突起で保たれた
靴底上面との間隙を通り靴の内部全体から足の表
にも作用する。
<Function> In addition to acting on the sole of the foot through the top plate of the breathable sheet, the copper ions generated by the thin copper layer also pass through the holes in the plastic coating layer on the bottom of the top plate and into the gap between the upper surface of the sole maintained by the protrusions. It acts from the entire inside of the shoe to the surface of the foot.

そして、銅薄層が表面板下面から剥れるのを被
覆層が防止する。
The coating layer also prevents the thin copper layer from peeling off from the bottom surface of the top plate.

〈実施例〉 図示の各実施例において、1は一枚或いは複数
枚の通気性シートからなる表面板、2はその下面
に設けた銅薄層、3は上記銅薄層2を介在させて
前記表面板1の下面を被覆するプラスチツクの被
覆層、4は上記被覆層の下面から銅薄層に達する
様に開設した孔、5は被覆層の下面に突設した突
起を示す。
<Example> In each of the illustrated examples, 1 is a surface plate made of one or more air permeable sheets, 2 is a thin copper layer provided on the lower surface thereof, and 3 is a thin copper layer provided on the lower surface of the surface plate, A plastic coating layer covers the lower surface of the surface plate 1. Reference numeral 4 indicates a hole formed from the lower surface of the coating layer to reach the thin copper layer. Reference numeral 5 indicates a protrusion extending from the lower surface of the coating layer.

表面板1を構成する通気性シートは編成或いは
織成した布地や、不織布、ヘチマやサランネツト
などの網材、その他天然或いは合成の皮革、細孔
を多数あけた天然或いは合成の薄ゴム板等、通気
性があり、且つ可撓であればどの様な材質でもよ
く、又、その二枚、三枚を接着剤等で貼合わせ、
例えば銅薄層を下面に介在させてプラスチツク被
覆層を下面に射出成形で設けた孔を有する薄ゴム
板の上面にタオルなどのパイル布地を接着しても
よい。
The breathable sheet constituting the surface plate 1 may be made of knitted or woven fabric, non-woven fabric, net material such as loofah or saran net, other natural or synthetic leather, natural or synthetic thin rubber plate with many pores, etc. Any material may be used as long as it is strong and flexible, and two or three pieces may be bonded together with adhesive, etc.
For example, a pile fabric such as a towel may be adhered to the upper surface of a thin rubber plate having holes formed by injection molding on the lower surface of a plastic covering layer with a thin copper layer interposed on the lower surface.

又、プラスチツクの被覆層3は表面板1の可撓
性を損わない様に弾性がある合成樹脂、例えば軟
質塩化ビニル、EVA、ポリエチレン、熱可塑性
ポリウレタン等で厚さ0.2〜1.5mm程度にする。こ
の被覆層3は銅薄層2を介在させて前記表面板1
の下面に射出成形で積層し、同時に孔4と突起5
を成形してもよいし、孔4と突起5を有するシー
ト状に成形し、表面板1の外形と同大に截断して
接着剤などで固定してもよい。尚、孔4は銅薄層
2を覆う部分にだけ設ければ足り、孔径は約1〜
3mm位、相互の間隔は約5〜10mm位でよい。これ
に対し、突起5は被覆層3の下面全体に相互の間
隔約5〜10mm位、下向き長さ約0.2〜2.0mm位と
し、一様に分散して設ける。
In addition, the plastic covering layer 3 is made of elastic synthetic resin such as soft vinyl chloride, EVA, polyethylene, thermoplastic polyurethane, etc. and has a thickness of about 0.2 to 1.5 mm so as not to impair the flexibility of the surface plate 1. . This coating layer 3 is applied to the surface plate 1 with a thin copper layer 2 interposed therebetween.
Laminated by injection molding on the bottom surface of the hole 4 and protrusion 5 at the same time.
Alternatively, it may be formed into a sheet having holes 4 and protrusions 5, cut to the same size as the outer shape of the surface plate 1, and fixed with an adhesive or the like. Note that the hole 4 only needs to be provided in the part that covers the thin copper layer 2, and the hole diameter should be approximately 1 to 1.
The distance between them may be about 3 mm, and the mutual spacing may be about 5 to 10 mm. On the other hand, the protrusions 5 are uniformly distributed over the entire lower surface of the coating layer 3 with a mutual interval of about 5 to 10 mm and a downward length of about 0.2 to 2.0 mm.

さて、第1,2図の実施例は表面板1の下面
に、溶融状態の銅或いはその合金を圧風により噴
霧化して高速度で吹付ける溶射法で銅薄層2を設
けてある。溶射によるこの銅薄層2は銅の微粒子
の一部が表面板の網目、織目等の間隙に喰込んで
表面板とほゞ一体状になり、多孔質で、摩擦係数
が小さく、耐摩耗性に優れてはいるが、引張り強
さや、伸びなどの機械的性質が劣り、じん性も殆
どない。
In the embodiment shown in FIGS. 1 and 2, a thin copper layer 2 is provided on the lower surface of the surface plate 1 by a thermal spraying method in which molten copper or its alloy is atomized by pressure air and sprayed at high velocity. This thermally sprayed thin copper layer 2 is porous, has a small coefficient of friction, and is wear resistant, with some of the fine copper particles biting into the gaps between the meshes and textures of the surface plate and becoming almost integrated with the surface plate. Although it has excellent properties, it has poor mechanical properties such as tensile strength and elongation, and has almost no toughness.

しかしながら、この溶射による銅薄層2は表面
板の下面を被覆するプラスチツクの被覆層3で覆
われているため、履用中に応力が繰返して加わ
り、表面板1、被覆層3とともに撓んでも表面板
1の下面から殆ど剥離することはないが、剥離し
た粉末状の銅粒子が被覆層3の孔4から外に洩れ
出るのを完全に防ぐには第2図に示した様に溶射
層を不織布や布地2′で下から覆つたのち、その
下に被覆層3を設ければよい。
However, since the thermally sprayed thin copper layer 2 is covered with a plastic coating layer 3 that covers the bottom surface of the top plate, stress may be applied repeatedly during use, causing it to bend together with the top plate 1 and the coating layer 3. Although there is almost no peeling off from the bottom surface of the surface plate 1, in order to completely prevent the peeled powdery copper particles from leaking out from the holes 4 of the coating layer 3, a thermal spray layer is applied as shown in FIG. After covering it from below with a nonwoven fabric or cloth 2', a covering layer 3 may be provided underneath.

尚、溶射による銅薄層2の厚さは数10μから
300μ程度とし、表面板1、被覆層3の可撓性を
なるべく損わない様にする。又、この銅薄層は表
面板の下面にほゞ全域に設けもよいし、必要な一
部分に設けるだけでもよい。
The thickness of the thin copper layer 2 by thermal spraying is several tens of microns.
The thickness should be about 300μ so as not to impair the flexibility of the surface plate 1 and the coating layer 3 as much as possible. Further, this thin copper layer may be provided on the lower surface of the surface plate over substantially the entire area, or may be provided only on a necessary portion.

第3,4図の実施例は銅薄層2を銅或いはその
合金の箔によつて構成した場合のものである。
The embodiments shown in FIGS. 3 and 4 are those in which the thin copper layer 2 is made of foil of copper or its alloy.

この場合の銅箔の厚さは同様に表面板1、被覆
層3の可撓性を損わない様に約0.05〜0.3mm位と
する。そして、所要の形状に打抜くと共に、片面
からバーリングパンチでプレスして他の片面に約
0.3〜1.00mm位突出したテーパ状のバリ筒6を数
個所打出し、このバリ筒6…を表面板1中に下面
から喰込ませて表面板と假結合し、被覆層3を成
形するプラスチツク用金型中に収め被覆層を射出
成形してある。
In this case, the thickness of the copper foil is approximately 0.05 to 0.3 mm so as not to impair the flexibility of the surface plate 1 and the coating layer 3. Then, punch it out into the desired shape, press it with a burring punch from one side, and press it to the other side.
Tapered burr tubes 6 that protrude by about 0.3 to 1.00 mm are punched out at several locations, and these burr tubes 6 are bitten into the surface plate 1 from below and are combined with the surface plate to form the plastic coating layer 3. It is placed in a mold and the coating layer is injection molded.

これにより第1,2図の実施例で被覆層3を表
面板1の下面に射出で成形した場合と同様に銅薄
層2が介在しない部分ではプラスチツクは表面板
1中に浸透するが、そのほかにこの実施例ではプ
ラスチツクの一部がバーリング筒6を通じ表面板
1中に浸透して接着し、銅薄層2が箔であつて、
溶射の様に銅微粒子が直接表面板に喰い込んで結
合することが行えない表面板との結合強度の弱さ
をこの接着部3′がカバーすると同時に、表面板
1と被覆層3の結合強度も高まる。
As a result, the plastic penetrates into the surface plate 1 in the areas where the thin copper layer 2 is not present, as in the case where the coating layer 3 is injection molded on the lower surface of the surface plate 1 in the embodiment shown in FIGS. In this embodiment, a part of the plastic penetrates into the surface plate 1 through the burring tube 6 and adheres thereto, and the thin copper layer 2 is a foil.
This adhesive part 3' covers the weak bonding strength between the surface plate and the surface plate, which cannot be bonded by directly biting the copper fine particles into the surface plate as in the case of thermal spraying, and at the same time increases the bond strength between the surface plate 1 and the coating layer 3. It also increases.

勿論、銅箔の銅薄層2は表面板1の下面を被覆
する被覆層で覆われているため表面板から剥離す
ることはない。
Of course, since the thin copper layer 2 of the copper foil is covered with a coating layer that covers the lower surface of the top plate 1, it will not peel off from the top plate.

第3,4図の実施例は表面板の下面のほゞ全域
に銅薄層2を設けたが、第5図の実施例の様に銅
薄層2は一部分に設けるだけでもよい。
In the embodiments shown in FIGS. 3 and 4, the thin copper layer 2 is provided over almost the entire lower surface of the surface plate, but the thin copper layer 2 may be provided only in a portion as in the embodiment shown in FIG.

第6,7図の第4実施例、第8,9図の第5実
施例、第10,11図の第6実施例は、第3,4
図や、第5図の実施例と同様に銅薄層2を銅或い
はその合金の箔で構成し、第5図と同様に複数個
を、表面板1の下面に射出で成型したプラスチツ
クの被覆層3により取付ける。
The fourth embodiment shown in Figs. 6 and 7, the fifth embodiment shown in Figs. 8 and 9, and the sixth embodiment shown in Figs.
Similarly to the embodiment shown in FIG. 5, the thin copper layer 2 is made of copper or copper alloy foil, and as in FIG. Attach by layer 3.

箔によるこの銅薄層2は第3,4図や、第5図
と同様に表面板1に下面から喰込むバーリング筒
6を有し、射出した被覆層3のプラスチツクは上
記バーリング筒6の中を埋めて表面板1の下面と
接着するが、そのほか各銅薄層2は直径5〜15mm
程度の比較的大きな開口部7をも有する。このた
め被覆層3を射出成形すると、そのプラスチツク
は同様に上記開口部7を埋めて表面板1の下面に
接着する。この接着部3″は、バーリング筒6で
の接着部3′と同様に箔の銅薄層3の表面板1に
対する結合強度と、被覆層3の表面板1に対する
結合強度を高めるが、そのほかに、表面板1の下
面から遊離している銅薄層の箔が、使用中に繰返
し加わる応力により被覆層3で覆われた内部でペ
コペコと音を発するのを効果的に防止する。開口
部7は銅薄層2の中央部に一つ宛開設してある
が、一つに限定されず複数個開設してもよい。
This thin copper layer 2 made of foil has a burring tube 6 that is bitten into the surface plate 1 from below as shown in FIGS. 3 and 4 and FIG. The copper thin layer 2 is filled with a diameter of 5 to 15 mm.
It also has a relatively large opening 7. For this purpose, when the covering layer 3 is injection molded, the plastic likewise fills the opening 7 and adheres to the underside of the top plate 1. This adhesive part 3'', like the adhesive part 3' in the burring tube 6, increases the bonding strength of the thin copper layer 3 of the foil to the surface plate 1 and the bonding strength of the covering layer 3 to the surface plate 1. This effectively prevents the copper thin layer foil that is loose from the lower surface of the surface plate 1 from emitting a clicking sound inside the cover layer 3 due to stress repeatedly applied during use.Opening 7 Although one is provided in the center of the thin copper layer 2, the number is not limited to one and a plurality may be provided.

第6,7図の第4実施例は銅薄層2を複数個、
表面板1の下面に配置し、これを表面板の下面全
体に射出成形した被覆層3で覆つて固定し、被覆
層3には全面に孔と下向きの突起5を均等に配置
してある。従つて、上記孔のうち銅薄層2の下に
位置するもの4からは銅イオンが靴底上面に出
る。
The fourth embodiment shown in FIGS. 6 and 7 includes a plurality of thin copper layers 2,
It is placed on the lower surface of the surface plate 1, and is fixed by covering the entire lower surface of the surface plate with a coating layer 3 injection molded, and the coating layer 3 has holes and downward protrusions 5 evenly arranged over the entire surface. Therefore, copper ions exit from the holes 4 located below the thin copper layer 2 to the upper surface of the sole.

第8,9図の第5実施例は被覆層3を表面板1
の下面全体ではなく、銅薄層2より一回り大き
く、表面板1の下面に部分的に射出で設けたもの
で、この各被覆層3には全面に孔4と、下向きの
突起5が設けてある。この実施例では被覆層3を
表面板の下面全体に設けないので、その分、中敷
きの重量が軽減する。
In the fifth embodiment shown in FIGS. 8 and 9, the covering layer 3 is
They are not formed on the entire bottom surface, but are formed by injection molding on a portion of the bottom surface of the surface plate 1, which is slightly larger than the thin copper layer 2, and each coating layer 3 is provided with holes 4 and downward protrusions 5 on the entire surface. There is. In this embodiment, since the covering layer 3 is not provided on the entire lower surface of the top plate, the weight of the insole is reduced accordingly.

第10,11図の第6実施例は、第5図よりも
更に重量を軽減するため、表面板1の下面の銅薄
層取付位置に、箔よりも一回り大きな窪み8を形
成し、窪み8の内部に射出した被覆層3で銅薄層
の箔を窪み8の上底面に固定してある。尚、被覆
層3の下向きの突起5の各下端は表面板1の下面
よりも下に突出することは勿論である。
In the sixth embodiment shown in FIGS. 10 and 11, in order to further reduce the weight than that shown in FIG. A thin copper layer foil is fixed to the upper bottom surface of the recess 8 by means of a coating layer 3 injected into the interior of the recess 8. It goes without saying that each of the lower ends of the downward protrusions 5 of the covering layer 3 protrudes below the lower surface of the surface plate 1.

これによつて表面板の下面に窪み8を形成した
分だけ第8,9図の実施例よりも更に重量を軽減
することができると共に、可撓性も高まる。
As a result, the weight can be further reduced compared to the embodiments shown in FIGS. 8 and 9 by the amount of the recess 8 formed on the lower surface of the surface plate, and flexibility can also be increased.

第12図は上述した第10,11図の実施例と
ほゞ同様であつて、相違するのは銅薄層2の箔
と、表面板下面の窪み8の上底面との間に殺菌
剤、脱臭剤等の薬剤の粉末や、これらを保持した
布やシート9を介在させた点である。
FIG. 12 is almost the same as the embodiments shown in FIGS. 10 and 11 described above, except that a sterilizing agent, This is because a powder of a chemical such as a deodorizing agent or a cloth or sheet 9 holding the powder is interposed therebetween.

これによつて、この実施例では孔4から靴底上
に銅薄層2からの銅イオンが出るほかに、殺菌剤
や脱臭剤等の薬効成分も出るので水虫の予防、治
療効果以外に、脱臭、殺菌等の効果も発揮する。
As a result, in this embodiment, not only copper ions from the thin copper layer 2 are released from the holes 4 onto the sole of the shoe, but also medicinal ingredients such as disinfectants and deodorizers are released, so that in addition to preventing and treating athlete's foot, It also has deodorizing and sterilizing effects.

第13図の実施例は、第10,11図の第6実
施例と同様に表面板1の下面に複数の窪み8を形
成し、そのうちの1つ又は幾つかには箔による銅
薄層2を嵌め、窪みの内部に射出した孔4と突起
5を有するプラスチツクの被覆層3で銅薄層2を
窪みの上底面に固定してある。そして、残りの窪
み8の中には殺菌剤、脱臭剤9を入れ、これを窪
み8の中にプラスチツクを射出するか、上記窪み
8を覆つて表面板1の下面に接着などで取付けた
可撓なカバー10により殺菌剤、脱臭剤9を封
入、保持してある。この殺菌剤や脱臭剤は粉末状
のものでもよく、その成分は表面板1を通じ足裏
に作用する。尚、粉末状のときはカバー10に孔
を設けると、そこから外に洩れるが、殺菌剤や脱
臭剤をしみ込ませた不織布などのシートを窪みに
入れた場合はカバー10に孔を設け、その孔から
も成分が出るようにすることができる。
The embodiment shown in FIG. 13, like the sixth embodiment shown in FIGS. A thin copper layer 2 is fixed to the upper bottom surface of the recess by a plastic covering layer 3 having holes 4 and projections 5 injected into the recess. Then, a disinfectant and a deodorizing agent 9 are put into the remaining depressions 8, and these can be injected into the depressions 8 with plastic, or they can be attached to the lower surface of the surface plate 1 by covering the depressions 8 with adhesive or the like. A sterilizer and a deodorizer 9 are enclosed and held by a flexible cover 10. This disinfectant or deodorizer may be in powder form, and its components act on the soles of the feet through the surface plate 1. When the powder is in the form of a powder, if a hole is made in the cover 10, it will leak out from there, but if a sheet of non-woven fabric impregnated with a disinfectant or deodorizer is placed in the cavity, a hole should be made in the cover 10 to leak it. The components can also be made to come out from the pores.

尚、被覆層3は透明ないし半透明にし、銅薄層
2の存在が外見して判る様にすることが好まし
い。
The coating layer 3 is preferably transparent or semi-transparent so that the presence of the thin copper layer 2 can be visually recognized.

〈考案の効果〉 本案によれば銅薄層が発生する銅イオンは通気
性の表面板から足裏に作用する以外に、被覆層の
孔から、突起で形成された被覆層下面と靴底上面
との間の空間を通じ靴の内部全体に行き渡る。
<Effect of the invention> According to the present invention, copper ions generated by the thin copper layer not only act on the sole of the foot from the breathable surface plate, but also penetrate through the holes in the coating layer to the bottom surface of the coating layer formed by the protrusions and the top surface of the sole. It spreads throughout the interior of the shoe through the space between.

特に歩行の際の応力で突起が形成する空間は、
突起の圧縮、復元により呼吸作用をして空気を給
排するため常に空気が流通し、その空気に乗つて
銅イオンは靴内で拡散し、足の全体に作用し、同
時に発汗等による湿気を乾燥して靴内に水虫の発
生、存在に適さない環境を作り出す。
In particular, the spaces formed by protrusions due to stress during walking are
Compression and restoration of the protrusions act as a breathing force to supply and expel air, so air is constantly circulating, and copper ions are carried by the air and diffuse within the shoe, acting on the entire foot, and at the same time removing moisture from sweat etc. This dries and creates an environment unsuitable for the growth and existence of athlete's foot inside the shoes.

従つて少ない銅の使用量で、水虫の治療、予防
に抜群に優れた効果を発揮する中敷きを提供する
ことができる。
Therefore, it is possible to provide an insole that is extremely effective in treating and preventing athlete's foot with a small amount of copper.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の中敷きの実施例を示すもので、
第1図は一半を表、他半を裏から見た第1実施例
の平面図、第2図は一部を拡大した第1図の断面
図、第3図は第2実施例の裏から見た平面図、第
4図は第3図の一部の拡大断面図、第5図は第3
実施例の裏から見た平面図、第6図は第4実施例
の一部を裏から見た平面図、第7図は第6図の要
部の拡大断面図、第8図は第5実施例の一部を裏
から見た平面図、第9図は第8図の要部の拡大断
面図、第10図は第6実施例の一部を裏から見た
平面図、第11図は第10図の要部の拡大断面
図、第12図は7実施例の第11図の同様な要部
の拡大断面図、第13図は他の一実施例の一部を
欠截して裏から見た平面図で; 図中、1は表面板、2は銅薄層、3は被覆層、
4は孔、5は突起を示す。
The drawing shows an example of the insole of the present invention.
Figure 1 is a plan view of the first embodiment, with one half seen from the front and the other half from the back, Figure 2 is a partially enlarged sectional view of Figure 1, and Figure 3 is the back of the second embodiment. 4 is an enlarged sectional view of a part of FIG. 3, and FIG. 5 is a partially enlarged sectional view of FIG.
FIG. 6 is a plan view of a part of the fourth embodiment seen from the back, FIG. 7 is an enlarged sectional view of the main part of FIG. 6, and FIG. 8 is a plan view of the fifth embodiment. FIG. 9 is an enlarged sectional view of the main part of FIG. 8; FIG. 10 is a plan view of a portion of the sixth embodiment as seen from the back; FIG. 11 10 is an enlarged sectional view of the main part of FIG. 10, FIG. 12 is an enlarged sectional view of the same main part as shown in FIG. 11 of the seventh embodiment, and FIG. A plan view seen from the back; In the figure, 1 is the surface plate, 2 is the thin copper layer, 3 is the coating layer,
4 indicates a hole, and 5 indicates a protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一層又は複数層の通気性シートからなる表面板
の下面に、銅薄層を介在させてプラスチツクの被
覆層を設け、この被覆層には下面から上記銅薄層
に達する孔と、下面から下向きに突出する突起を
設けたことを特徴とする靴の中敷き。
A plastic coating layer is provided on the bottom surface of the surface plate made of one or more layers of breathable sheets with a thin copper layer interposed therebetween, and this coating layer has holes that reach the thin copper layer from the bottom surface and holes that extend downward from the bottom surface. An insole for shoes characterized by having a protruding protrusion.
JP14006687U 1986-09-25 1987-09-16 Expired JPH0327444Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14006687U JPH0327444Y2 (en) 1986-09-25 1987-09-16

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14583686 1986-09-25
JP14006687U JPH0327444Y2 (en) 1986-09-25 1987-09-16

Publications (2)

Publication Number Publication Date
JPS63127402U JPS63127402U (en) 1988-08-19
JPH0327444Y2 true JPH0327444Y2 (en) 1991-06-13

Family

ID=33455152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14006687U Expired JPH0327444Y2 (en) 1986-09-25 1987-09-16

Country Status (1)

Country Link
JP (1) JPH0327444Y2 (en)

Also Published As

Publication number Publication date
JPS63127402U (en) 1988-08-19

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