JPH032650U - - Google Patents
Info
- Publication number
- JPH032650U JPH032650U JP6212089U JP6212089U JPH032650U JP H032650 U JPH032650 U JP H032650U JP 6212089 U JP6212089 U JP 6212089U JP 6212089 U JP6212089 U JP 6212089U JP H032650 U JPH032650 U JP H032650U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- resin
- semiconductor integrated
- sealed semiconductor
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6212089U JPH032650U (me) | 1989-05-29 | 1989-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6212089U JPH032650U (me) | 1989-05-29 | 1989-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032650U true JPH032650U (me) | 1991-01-11 |
Family
ID=31590981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6212089U Pending JPH032650U (me) | 1989-05-29 | 1989-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032650U (me) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011165836A (ja) * | 2010-02-09 | 2011-08-25 | Mitsubishi Electric Corp | 電力用半導体装置 |
-
1989
- 1989-05-29 JP JP6212089U patent/JPH032650U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011165836A (ja) * | 2010-02-09 | 2011-08-25 | Mitsubishi Electric Corp | 電力用半導体装置 |