JPH03263726A - Temperature fuse circuit board with protective case - Google Patents
Temperature fuse circuit board with protective caseInfo
- Publication number
- JPH03263726A JPH03263726A JP6115590A JP6115590A JPH03263726A JP H03263726 A JPH03263726 A JP H03263726A JP 6115590 A JP6115590 A JP 6115590A JP 6115590 A JP6115590 A JP 6115590A JP H03263726 A JPH03263726 A JP H03263726A
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- protective case
- board
- heat
- temperature fuse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 30
- 239000003779 heat-resistant material Substances 0.000 claims abstract description 6
- 238000005299 abrasion Methods 0.000 abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 7
- 229920006015 heat resistant resin Polymers 0.000 abstract description 4
- 229910052573 porcelain Inorganic materials 0.000 abstract 3
- 238000012856 packing Methods 0.000 abstract 2
- 210000003298 dental enamel Anatomy 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 238000004534 enameling Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
Landscapes
- Structure Of Printed Boards (AREA)
- Fuses (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は自動車用空気調和装置の制御用裁板として用い
られるホウロウ面状抵抗回路基板の温度ヒユーズ回路の
損傷防止とヒユーズ作動後の修復防止機能を有する保護
ケース付温度ヒユーズ回路基板に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention is directed to preventing damage to the temperature fuse circuit of an enameled sheet resistance circuit board used as a control board for automotive air conditioners and preventing repair after the fuse is activated. The present invention relates to a thermal fuse circuit board with a protective case having functions.
従来、「１動車用空気調和装置に用いられる制御用絶縁
ｈ（板などに於いては、使用時の異常発熱などにより、
１氏抗ト！１路が変化したりして所期の制御機能を発揮
しなくなる等のことを防止する目的で、回路を保護する
ためのヒユーズが設けられている。Conventionally, "control insulation h (plates, etc.) used in air conditioners for motor vehicles, due to abnormal heat generation during use, etc.
Mr. 1 resists! A fuse is provided to protect the circuit in order to prevent the circuit from failing to perform its intended control function due to a change in one path.
しかしながら、従来堤案されているヒユーズは電線や板
バネなどのＪ）一端を低融点金属で固定する方式のもの
が殆どであるため、作動温度のバラツキが多く、本来の
目的とするヒユーズの機能としては奸ましいものとは云
えないものであった。そこで本発明者らは先きに放熱性
と機械的強度に優れたホウロウ抵抗回路是板に犬常発熱
等により所定温度以上になった場合は正確にヒユーズが
作動する様にボウロウ批抗回路基板の分割された回路間
に所定形状の厚さと面積に低融点金属を粒重に印刷焼成
して形成させた温度ヒユーズ付きホウロウ把抗回路基板
を自動車用空気調和装置の制御用址板として用いること
を促案じ、これらの問題を解決したのである。However, most conventional fuses are fixed at one end with a low-melting metal such as an electric wire or a leaf spring, so there is a lot of variation in operating temperature, and the fuse does not function as intended. As such, it could hardly be called outrageous. Therefore, the present inventors first developed an enameled resistor circuit board with excellent heat dissipation and mechanical strength, so that the fuse would operate accurately when the temperature exceeds a predetermined temperature due to constant heat generation, etc. An enameled circuit board with a temperature fuse formed by printing and firing a low-melting point metal in a predetermined thickness and area between the divided circuits is used as a control board for an air conditioner for an automobile. These problems were solved by prompting the government.
しかし、この本発明者らが先きに提案したヒユーズ回路
付きホウロウ基板は温度ヒユーズの作動特性としては非
常に優れたものであるが、ヒユーズを形成する低融点金
属が比較的軟かい上に、薄層に形成されているため、梱
包や輸送時の振動による磨耗や装置に取付ける際の磨耗
などによって損傷するなどして、所定の温度で作動しな
くなり、誤動作の原因となることがあった。However, although the enamel board with a fuse circuit that the present inventors previously proposed has excellent operating characteristics as a temperature fuse, the low melting point metal that forms the fuse is relatively soft; Because they are formed in a thin layer, they can become damaged due to abrasion caused by vibrations during packaging and transportation, or abrasion during installation into equipment, resulting in them not operating at a specified temperature, which can lead to malfunctions.
又、この様に温度ヒユーズが露出した状態となっている
と、何かの原因で温度ヒユーズが作動した場合にサービ
ス関係者や、一般ユーザーによって誤った修復をされる
可能性があり、本来の１」的とするヒユーズの機能を発
揮しなくなるなどのおそれがあった。In addition, if the temperature fuse is exposed like this, if the temperature fuse is activated for some reason, there is a possibility that it will be repaired incorrectly by service personnel or general users. There was a risk that the fuse would no longer function as intended.
本発明はこの様な温度ヒユーズ付きホウロウ回路基板に
於ける梱包や輸送時の振動による磨耗や装置に取付ける
際の磨耗などによって生じる損傷を防止すると共に、一
般ユーザーによる誤った修復を防止し、本来の目的とす
る精密かつ正確な作動特性をＨする温度ヒユーズ付きホ
ウロウ回路基板の提供を１７１的とするものである。The present invention prevents damage caused by such enamel circuit boards with temperature fuses due to abrasion caused by vibrations during packaging and transportation, and abrasion during installation in equipment, and also prevents erroneous repairs by general users. The object of the present invention is to provide a enamel circuit board with a temperature fuse that achieves precise and accurate operating characteristics aimed at.
〔課題を角ｌｌ決するための手段〕
本発明はホウロウ話板上に形成された温度ヒユーズ上に
耐熱材料で、基板面より内側高さが１．０〜５．Ｃ）ａ
ｍのＷ形ヒユーズ保護ケースを、下辺でホウロウ基板上
に予め準備された取付穴に取り付けてなる保護ケース付
温度ヒユーズ回路基板である。[Means for resolving the problem] The present invention uses a heat-resistant material on the temperature fuse formed on the enamel board, and the height inside from the substrate surface is 1.0 to 5. C)a
This is a temperature fuse circuit board with a protective case, which is made by attaching a W-shaped fuse protective case (m) to a mounting hole prepared in advance on the enamel board at the lower side.
耐熱材料としてはアルミニウム板等の金属板、耐熱樹脂
（エンジニアリングプラスチックス）等が奸適である。Suitable heat-resistant materials include metal plates such as aluminum plates, heat-resistant resins (engineering plastics), and the like.
第１図は本発明の保護ケースをホウロウ基板に取り付け
た斜視図である。FIG. 1 is a perspective view of the protective case of the present invention attached to an enamel substrate.
ホウロウ基板に抵抗回路層を形成後、ヒユーズ部を除い
てオーバーグレーズ層を形成せしめた基板にヒユーズを
形成し、この回路を跨ぐようにＷ形に加工したアルミ板
、耐熱樹脂等の耐熱材料を取り付ける。After forming a resistor circuit layer on the enamel substrate, a fuse is formed on the substrate on which the overglaze layer is formed except for the fuse part, and a heat-resistant material such as an aluminum plate processed into a W shape or a heat-resistant resin is used to straddle this circuit. Attach.
ホウロウ基板は、金属コアに予め取付穴を穿孔し、穴は
ホウロウ施釉時に、穴の内部塩ホウロウ層を形成して絶
縁しておく。穴の直径はホウロウ施釉後で１〜２關程度
が好ましい。For the enamel substrate, mounting holes are drilled in advance in the metal core, and the holes are insulated by forming a salt enamel layer inside the holes during enamel glazing. The diameter of the hole is preferably about 1 to 2 diameters after enameling.
保護ケースにはホウロウ基板上の取付穴と同じ径の穴を
穿ち、ハトメ等の取付具によって取り付ける。Drill a hole in the protective case with the same diameter as the mounting hole on the enamel board, and attach it using a fitting such as an eyelet.
又、保護ケースにアルミニウム等の金属板を使用した場
合には、金属板の取り付は平面部に取付穴の径より僅か
に小さい穴を開け、金属板の裏向に打抜きによる付き出
し部分（パリ）を発生させ、それによってカシメてもよ
い。In addition, if a metal plate such as aluminum is used for the protective case, the metal plate should be attached by drilling a hole slightly smaller than the diameter of the mounting hole on the flat surface, and punching out the protruding part ( Paris) may be generated and caulked accordingly.
第３図は金属板に打抜きによる付き出し部分を発生させ
るように穴を穿ち、第４図のように、その打抜きによる
付き出し部分をカシメることによって保護ケースを取り
付けた断面図を示す。FIG. 3 shows a cross-sectional view of a metal plate in which a hole is punched to create a protruding part, and a protective case is attached by caulking the punched protruding part as shown in FIG. 4.
第２図は本発明の保護ケースをホウロウ基板に取り付け
た別の態様を示した断面図を示す。FIG. 2 is a sectional view showing another embodiment in which the protective case of the present invention is attached to an enamel substrate.
即ち抵抗回路層を跨ぐように保護ケースを取り付けるの
ではなく、これと直角方向に取り付けたものである。オ
ーバーグレーズ層６があるので抵抗回路とは絶縁されて
いる。That is, the protective case is not attached so as to straddle the resistor circuit layer, but rather in a direction perpendicular to it. Because of the overglaze layer 6, it is insulated from the resistance circuit.
ホウロウＭＩＱの上に設けた導体回路層５と保護ケース
］を、導体回路上に設けたオーバーグレーズ層６で絶縁
している。The conductor circuit layer 5 provided on the enamel MIQ and the protective case] are insulated by the overglaze layer 6 provided on the conductor circuit.
又、保護ケース材料に、絶縁性耐熱樹脂を使用すること
によっても、抵抗体回路の短絡を防止することかできる
。Also, by using an insulating heat-resistant resin for the protective case material, short circuits in the resistor circuit can be prevented.
第２図は保護ケースを取付ける取付穴の箇所での断面図
を示しである。従って、１氏抗回路ｊφは断面にはでて
こないので点線で示しである。FIG. 2 shows a cross-sectional view of the mounting hole for attaching the protective case. Therefore, the 1-degree resistor circuit jφ does not appear in the cross section, so it is shown by a dotted line.
この意味からはヒユーズ部分も断面にはでてこす、断面
にはオーバーグレーズ層のみが出る筈であるか、断面が
複雑となるので、この部分のみ切欠いてヒユーズ部分を
点線で示した。In this sense, the fuse part should also be visible in the cross section, and only the overglaze layer should be visible in the cross section, or the cross section would be complicated, so I cut out only this part and indicated the fuse part with a dotted line.
第１図、第２図共、１は保護ケース、２は取付具、３は
ヒユーズ、４は抵抗回路層、６はオーバーグレーズ層、
７はホウロウ層、８は金属コアを示す。In both Figures 1 and 2, 1 is a protective case, 2 is a fixture, 3 is a fuse, 4 is a resistance circuit layer, 6 is an overglaze layer,
7 indicates an enamel layer, and 8 indicates a metal core.
保護ケースの凸部の高さは基板面よりケースの内向迄の
Ｆ’ｌ ＝ｊ法で１．０〜５．０ｍｍである。この寸法
が１．０關より小さいと、ケース内面とヒユーズとが接
触するおそれがある。又この寸法が５．０ｇ＋ｎより大
きくなると、基板の梱包、輻送時にこの保護ケースが障
害となることがあり、かえって、保護ケース脱落の原因
となることも考えられ好ましくない。The height of the convex portion of the protective case is 1.0 to 5.0 mm from the substrate surface to the inward direction of the case using the F'l=j method. If this dimension is smaller than 1.0, there is a risk that the inner surface of the case and the fuse may come into contact with each other. Moreover, if this dimension is larger than 5.0g+n, this protective case may become an obstacle when packaging and transporting the board, and may even cause the protective case to fall off, which is not preferable.
ヒユーズの作動に影響のないように、ヒユーズの先端２
方向は壁を設けない第１図の構造の方がより好ましい。Tip 2 of the fuse so as not to affect the operation of the fuse.
The structure shown in FIG. 1 without walls is more preferable.
ヒユーズの面積は通常２．５〜４．ＯＸ５．００程度で
あるのに対し、ヒユーズを覆う保護ケースの凸部の面積
は８×１５關捏度の大きさとし、ヒユーズはその中央に
位置する様に取り付けることが好ましい。The area of the fuse is usually 2.5 to 4. OX5.00, the area of the convex part of the protective case covering the fuse is 8 x 15 degrees, and it is preferable to install the fuse so that it is located in the center.
以下に実施例によって、本発明を更に具体的に説明する
が、本発明はこの実施例に限定されるものではないこと
は勿論である。EXAMPLES The present invention will be explained in more detail below with reference to Examples, but it goes without saying that the present invention is not limited to these Examples.
第１図について説明する。厚さ０．６ｍｍの金属コアに
予め、保護ケースを取り付ける穴を２箇所に開け、ホウ
ロウ施釉１時、穴の内面までホウロウを施釉する。ホウ
ロウ焼成後で、穴径１．６ｍｍとした。この焼成した基
板に抵抗回路層４および導体層５を厚さ１５μｍ 、
＋ｌＩ ４ 、 ０ ＋ｓｍに形成し、ヒユーズ部分は
両端部を形成するように導体層５を離隔する。更に、抵
抗回路層を含めヒユーズ部を除く延板全体をオーバーグ
レーズ層６で被覆する。FIG. 1 will be explained. Pre-drill two holes in the 0.6 mm thick metal core to attach the protective case, and apply enamel to the inner surface of the holes at 1:00. After enameling, the hole diameter was set to 1.6 mm. A resistor circuit layer 4 and a conductor layer 5 are formed on this fired substrate to a thickness of 15 μm.
+lI 4 , 0 +sm, and the conductor layer 5 is separated so that both ends of the fuse portion are formed. Further, the entire rolled plate including the resistor circuit layer and excluding the fuse portion is covered with an overglaze layer 6.
ヒユーズ部分は４ 、 Ｏｗ Ｘ ５ 、 Ｏ１１
１１とした。保護ケース］は材質はアルミ板とし、ヒユ
ーズを覆う山積は８．ＯｍｍＸ １５．０ｍ＋ｗとした
。アルミケースはホウロウ基板上の取付穴と同じ、内径
１．６關の穴２個を設け、外径１．．５＋ｕｍ、長さ１
．７〜２．２＋ｕのハトメを取付具として図のように取
りイ・１けた。アルミケースの内側の高さは４．Ｏｍ−
とした。The fuse part is 4, Ow X 5, O11
It was set to 11. The protective case] is made of aluminum plate, and the pile covering the fuse is 8. OmmX 15.0m+w. The aluminum case has two holes with an inner diameter of 1.6 mm, the same as the mounting holes on the enamel board, and an outer diameter of 1.6 mm. ．． 5+um, length 1
．． Take a 7~2.2+U eyelet as a fitting as shown in the figure and make it 1 digit. The height of the inside of the aluminum case is 4. Om-
And so.
本発明の構造の保護ケースを取り付ける１１■こよって
、ヒユーズ作動後の修復は事実上不可能になり、しかも
強固な保護ケースによって梱包、輸送、保管１１；や装
置に組込む際の磨耗による損傷を防止することが出来る
から本来の目的とする精密で正確な作動特性を得ること
が可能となった。Attaching a protective case with the structure of the present invention 11 Therefore, repair after the fuse is activated is virtually impossible, and the strong protective case prevents damage caused by abrasion during packaging, transportation, storage 11; and when assembling it into equipment. Since this can be prevented, it has become possible to obtain the precise and accurate operating characteristics that were originally intended.
第１図Figure 1
第１図は本発明の保護ケースをホウロウ基板に取り付け
た斜視図である。
第２図は本発明の保護ケースをホウロウ基板に取り付け
た別懇様のものの断面図である。
第３図は保護金属ケースに打抜きによる付き出し部分を
生ずるように穴を穿った図を示す。
第４図は打抜きによる付き出し部分を形成させた金属ケ
ースを該付き出し部分をカシメることにより取り付けた
図の断面図を示す。
第２図
８：金属コアFIG. 1 is a perspective view of the protective case of the present invention attached to an enamel substrate. FIG. 2 is a sectional view of a different case in which the protective case of the present invention is attached to an enamel substrate. FIG. 3 shows a hole punched in the protective metal case to create a protrusion. FIG. 4 is a sectional view of a metal case having a protruding portion formed by punching and attached by caulking the protruding portion. Figure 2 8: Metal core
Claims (1)
料で、基板面より内側高さが１．０〜５．０ｍｍの凸形
ヒューズ保護ケースを、下辺でホウロウ基板上に予め準
備された取付穴に取り付けてなる保護ケース付温度ヒュ
ーズ回路基板。A convex fuse protection case made of heat-resistant material with a height of 1.0 to 5.0 mm inward from the board surface is placed over the thermal fuse formed on the enameled board, with a mounting hole prepared in advance on the enameled board at the bottom side. A thermal fuse circuit board with a protective case attached to it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2061155A JP2862316B2 (en) | 1990-03-14 | 1990-03-14 | Thermal fuse circuit board with protective case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2061155A JP2862316B2 (en) | 1990-03-14 | 1990-03-14 | Thermal fuse circuit board with protective case |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03263726A true JPH03263726A (en) | 1991-11-25 |
| JP2862316B2 JP2862316B2 (en) | 1999-03-03 |
Family
ID=13162962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2061155A Expired - Fee Related JP2862316B2 (en) | 1990-03-14 | 1990-03-14 | Thermal fuse circuit board with protective case |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2862316B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1045625A1 (en) * | 1999-04-14 | 2000-10-18 | Helvar Oy Ab | A foil fuse made on a circuit board |
| US6198376B1 (en) * | 1998-09-21 | 2001-03-06 | Yazaki Corporation | Safety device for electric circuit |
| DE102016219771A1 (en) * | 2016-10-12 | 2018-04-12 | Continental Automotive Gmbh | Electronic assembly with a current limiting arrangement |
-
1990
- 1990-03-14 JP JP2061155A patent/JP2862316B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6198376B1 (en) * | 1998-09-21 | 2001-03-06 | Yazaki Corporation | Safety device for electric circuit |
| EP1045625A1 (en) * | 1999-04-14 | 2000-10-18 | Helvar Oy Ab | A foil fuse made on a circuit board |
| DE102016219771A1 (en) * | 2016-10-12 | 2018-04-12 | Continental Automotive Gmbh | Electronic assembly with a current limiting arrangement |
| DE102016219771B4 (en) | 2016-10-12 | 2020-07-02 | Continental Automotive Gmbh | Electronic assembly with an arrangement for current limitation and use of such an electronic assembly in a motor vehicle |
| US11362511B2 (en) | 2016-10-12 | 2022-06-14 | Vitesco Technologies GmbH | Electronic unit having an assembly for limiting current |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2862316B2 (en) | 1999-03-03 |
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| LAPS | Cancellation because of no payment of annual fees |