JPH032636U - - Google Patents

Info

Publication number
JPH032636U
JPH032636U JP6339389U JP6339389U JPH032636U JP H032636 U JPH032636 U JP H032636U JP 6339389 U JP6339389 U JP 6339389U JP 6339389 U JP6339389 U JP 6339389U JP H032636 U JPH032636 U JP H032636U
Authority
JP
Japan
Prior art keywords
stirring pin
pin
sphere
lead frame
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6339389U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6339389U priority Critical patent/JPH032636U/ja
Publication of JPH032636U publication Critical patent/JPH032636U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP6339389U 1989-05-30 1989-05-30 Pending JPH032636U (es)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6339389U JPH032636U (es) 1989-05-30 1989-05-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6339389U JPH032636U (es) 1989-05-30 1989-05-30

Publications (1)

Publication Number Publication Date
JPH032636U true JPH032636U (es) 1991-01-11

Family

ID=31593399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6339389U Pending JPH032636U (es) 1989-05-30 1989-05-30

Country Status (1)

Country Link
JP (1) JPH032636U (es)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54139770U (es) * 1978-03-10 1979-09-28
JPS5593838A (en) * 1978-12-29 1980-07-16 Yonesaka Pairu Orimono Kk Both side pile fabric and production thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54139770U (es) * 1978-03-10 1979-09-28
JPS5593838A (en) * 1978-12-29 1980-07-16 Yonesaka Pairu Orimono Kk Both side pile fabric and production thereof

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