JPH03263346A - Inspecting device and pin attaching/detaching jig - Google Patents

Abstract

PURPOSE:To realize highly accurate electric contact and to improve the inspecting accuracy by providing a plurality of pin blocks having inspecting terminals corresponding to electrode terminals of a plurality of elements to be inspected, selecting the block corresponding to the element to be inspected, and bringing the terminal of a tough plate into contact with the output terminal. CONSTITUTION:A plurality of pin blocks 21 are provided corresponding to a plurality of elements 2a to be inspected. A desired one is selected, the inspection terminal 203 of the selected block 21 is brought into contact with an electrode pad provided corresponding to the electrode of the element 2a, and the terminal 305 of a touch plate 300 is brought into contact with the output terminal 203d of the block 21. Since the terminals 305 are all so arranged as to be brought into contact with the output terminals 203a of any block 21, even if they are brought into contact with any block 21, its output signal can be externally output. When the pressing part 506 of a pin attaching/detaching jig 500 is pressed, first and second pawls 503, 507 are cooperated to remove a pin connector 404.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to an inspection device and a pin attachment/detachment jig.

(Prior Art) In the recent semiconductor field, for example, mounting multiple chips with different functions on a multilayer ceramic substrate, making them modular, and directly using them as a chip array is gradually increasing. There is a strong desire for support for testing semiconductor modules.

On the other hand, as an inspection device for a mounted board, a board inspection device is used in which a test head with a large number of probe pins is arranged to hold the mounted board to be inspected, for example. When attempting to apply the above-mentioned conventional board inspection apparatus to the above, it cannot be said that it is sufficiently compatible with individual chips having different functions and specifications (number of electrode pads, electrode pad arrangement, etc.).

For example, when testing the basic performance of individual chips or the operating characteristics of semiconductor modules during intermediate processes, it is necessary to contact probe pins individually to the electrode pads of each chip, but current board testing In the device, it is extremely difficult to bring the probe pin into contact with the electrode pads formed at a pitch of several tens of micrometers with high precision. Also,
Dealing with semiconductor modules in which multiple chips with different standards are mounted in various layouts increases the frequency of test head replacement, which significantly reduces inspection efficiency.

(Problems to be Solved by the Invention) As described above, a plurality of chips of different standards are mounted on a substrate with internal wiring.1. Comprehensive testing of semiconductor modules that enable operation as a module involves electrically contacting probe pins with high precision to electrode pads provided in correspondence with chip electrodes in order to improve testing accuracy. In addition, in order to improve inspection efficiency, it is necessary to flexibly handle multiple chips with different standards.

Thus, there is a strong desire to develop an inspection device that can make highly accurate electrical contact with each chip of a semiconductor module.

In addition, in such semiconductor module inspection equipment, a large number of pin connectors may be arranged at high density on the interface board etc. with a part of the tester, and in such cases, it is necessary to remove the male and female pin connectors with your fingers. That was difficult.

The present invention has been made to address these issues, and provides a semiconductor inspection device that enables highly accurate electrical contact with individual test objects mounted on a substrate and satisfies high inspection accuracy. The purpose is to provide the following.

A second object of the present invention is to provide a pin attachment/detachment jig that can easily detach pin connectors arranged at high density.

[Configuration of the Invention (Means for Solving the Problem) In other words, the first invention provides an inspection apparatus that performs an inspection by bringing an inspection terminal into contact with electrode terminals of a plurality of objects to be inspected provided on a substrate. a plurality of pin blocks each having a test terminal corresponding to an electrode terminal of a test object; and a selection mechanism for selecting a pin block corresponding to the test object from the plurality of pin blocks when testing the test object. and a touch plate provided with a plurality of terminals that electrically contact the output terminals of the pin blocks during inspection and that are capable of contacting the output terminals of any one of the plurality of pin blocks. This is an inspection device comprising:

A second invention includes a pin attaching/detaching jig main body, a first claw provided near an end of the main body, and a spring interposed between the main body and the first claw, which is slidably provided on the main body. a second pawl provided near an end of the pressing portion and extracting the pin connector in cooperation with the first pawl in response to the depression of the pressing portion. This is a pin attachment/detachment jig.

(Function) In the inspection device of the first invention, a plurality of pin blocks are provided corresponding to a plurality of objects to be inspected, and a desired pin block is selected from among the plurality of pin blocks to be inspected. The test terminal of the selected pin block is brought into contact with the electrode pad provided corresponding to the electrode on the body, and the terminal of the touch plate is brought into contact with the output terminal of this pin block.

Multiple input terminals are arranged so that the input terminal of the touch plate can contact the output terminal of any pin block, so no matter which pin block the touch plate contacts, the output signal of the pin block will not be transmitted to the outside. can be derived.

In the second invention, when the pressing part is pressed, the first claw and the second
The claws work together to remove the pin connector.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a diagram schematically showing the configuration of a semiconductor testing device according to an embodiment of the present invention, in which a device main body 1 is capable of transporting and testing a semiconductor module 2, which is a test object, in a non-conductive inert liquid. It houses an inspection section 10 that performs a predetermined inspection of the workpiece 3 in a normal state, and a plurality of inspection contact terminals corresponding to a plurality of semiconductor elements (hereinafter referred to as chips) mounted on the semiconductor module 2. and a contact terminal supply section 20 for replacing and aligning the inspection section 1.
A part 30 of a work loader for loading and unloading the work 3 is removably installed at the end on the 0 side. Moreover, on the apparatus main body 1 and the work loader part 30, there are arranged parts that are movable along the parallel direction (hereinafter referred to as the X direction) of the work loader part 30, the inspection part 10, and the contact terminal supply part 20, respectively. A workpiece transport mechanism 40 and a contact terminal moving mechanism 50 are mounted.

The work 3 is, for example, as shown in FIG. 2, a semiconductor module 2 is attached to the bottom of a semiconductor module 2 configured by bonding a plurality of chips 2a onto a multilayer ceramic substrate 2b having internal wiring. The structure includes a socket 4 and a socket board 5 that are in electrical contact with individual output pins (not shown), and a holding plate 6, an O-ring 7, and a support board 8 arranged on the outer circumferential side of the semiconductor module 2.

Although not shown, there are electrode pads for measurement around the chip 29, alignment targets at the triangular corners of the top surface of the multilayer ceramic substrate 2b, and two diagonal targets on the bottom surface of the multilayer ceramic substrate 2b.
Targets for thermal expansion correction are provided at the corners, and positioning holes are provided at the four corners of the support board 8.

The inspection section 10 has a workpiece 3 on the upper surface side of the inspection section base 11.
The workpiece 3 is tightly fixed to the workpiece mounting table 12, and a non-conductive liquid 15 is injected into the liquid tank 13 to remove the workpiece 3. Inspection is performed while immersed. Note that there is an overflowing non-conductive liquid 15 in the inspection unit base 11.
A discharge pipe 16a and a discharge pipe 16b for exchanging workpieces are provided, and each is connected to a cooling mechanism (not shown).

Further, a workpiece set includes a number of pogo pins (not shown) that are inserted into the socket board 5 of the workpiece 3 and make an electrical connection below the opening of the workpiece mounting table 12. The base unit 17 and lower alignment cameras 18a and 18b are arranged according to the formation positions of a pair of thermal expansion correction targets provided on the lower surface of the ceramic substrate 2b of the workpiece 3.

In addition, the contact terminal supply section 20, which forms a selection mechanism together with a contact terminal moving mechanism 50 to be described later, probes according to the shape and pitch of the measurement electrode pads formed around the chip 2a mounted on the semiconductor module 2. A plurality of pin blowers each individually holding a plurality of pin blocks 21 in which pins are implanted. The pin block correction camera 23 is configured to check the holding position of the pin block 21 passed to the contact terminal moving mechanism 50 side.

FIG. 7(a) is a front view showing the configuration of the pin block 21. FIG. As shown in the figure, a plurality of probe pins 203 are provided to pass through the inside of this pin block 21.

M7 (b) As shown in the figure, an insulator 204 is provided on the upper and lower surfaces of the pin block 21, and the probe pin 203 is connected to the cylindrical conduction tube 206, the upper pin 203a and the lower pin 203b, and a spring between both pins. 205 is provided.

The upper pin 203a and the lower pin 203b are supported by a spring 205 and are expandable and contractible in the direction A in FIG. 7(b).

In the above-mentioned inspection apparatus, nine pin blocks are prepared in which the probe pins 203 are arranged in different ways so as to correspond to a plurality of semiconductor elements of different standards.

Figure 3.4 shows the arrangement of the probe pins of two pin blocks 2 out of the pin blocks 21, and as shown in the same figure, different pin blocks 2
1 has probe pins 203 arranged differently.

The pin block changer 22 is composed of a holding part 24 that holds the pin block 21 and a cylinder mechanism 25, for example, that raises this holding part 23 toward the contact terminal moving mechanism 50 side, and changes the pin block to be used according to the inspection program. 21 are individually raised and supplied to the contact terminal moving mechanism 50.

The workpiece transport mechanism 40 is movable along the X direction, and the contact terminal moving mechanism 50 includes an X stage 51 having a mouth shape mounted on a stage guide, and an X stage 51 disposed on the X stage. The pin block 2 is fixed to this Z stage 53 by a mouth-shaped Y stage 52 having a similar opening area and two stages 53 arranged within the openings of the X stage 51 and Y stage 52.
A measuring section 56 in which a chuck section 54 of 1 and a camera 55 for upper alignment are installed is configured to be movable in the x-y-z directions. is said to be rotatable.

The pin block 21 held by the chuck section 54 is then moved to the liquid tank 13 of the inspection section 10 by the Z stage 53.
The workpiece 3 descends into the liquid tank 13 and comes into contact with the workpiece 3 immersed in the liquid tank 13.

The measurement unit 56 includes a non-conductive liquid introduction pipe 57 connected to a cooling mechanism (not shown) adjacent to the chuck unit 54.
is installed.

Moreover, a touch plate connected to the pin block 21 and a tester (not shown) is arranged on the upper part of the chuck part 54.

This touch plate provides electrical connection between the pin block 21 and the tester.

5 and 6 are a perspective view and a bottom view of this touch plate 300. FIG. Further, FIG. 9 is a perspective view of the touch plate 300 and the substrate 401.

The touch plate 300 consists of a cylindrical main body 302 and a coaxial cable 303, and the other end of the coaxial cable 303 is connected to one end of a multi-layered board 401, and the other end of the board 401 is connected to the aforementioned not-illustrated cable. Connected to the tester.

As shown in FIG. 6, a signal cable terminal 305 connected to a coaxial cable 303 is exposed on the bottom side of the main body 302, and this signal cable terminal 305 is exposed during semiconductor inspection.
5 is brought into contact with the upper pin 203g of the pin block 21.

A plurality of signal cable terminals 305 are arranged so as to be able to contact the upper pins 203a of any of the different types of pin blocks 21 as shown in FIG. 3.4.

Therefore, even when testing semiconductor devices having different electrode terminals, the same touch plate 300 can be used by simply replacing the pin block 21. Therefore, it is possible to easily test semiconductor elements having different standards.

Moreover, as shown in FIG. 7(b), this touch plate 3
The main body 302 of 00 has a cylindrical conductive part 3 inside an insulator 310.
11 is provided, and a signal cable terminal 305 is provided at the lower end of this cylindrical conductive portion 3 311. Further, the upper end of this cylindrical conductive portion 311 is connected to a coaxial cable 303.

In this embodiment, since the distance of the cylindrical conductive portion 311 is shortened, the influence of high frequency noise can be reduced.

Further, as shown in FIG. 7(b), during inspection, the lower pin 203b of the pin block 21 is brought into contact with an electrode terminal of a semiconductor element (not shown), and the upper pin 203a of the pin block 21 is brought into contact with an electrode terminal of a semiconductor element (not shown).
The signal cable terminal 305 of the touch plate 300 is brought into contact with the upper pin 203 of the pin block 21.
Since the spring 205 is provided between the upper pin 203a and the lower pin 203b, contact between the upper pin 203a and the signal cable terminal 305 and contact between the lower pin 203b and the electrode terminal of the semiconductor element is facilitated.

FIG. 8 is a diagram of a substrate 401 on which pin connectors (not shown) are mounted at high density so as to connect one end of a signal cable connected to a touch plate 300, and a state in which the pin connector attachment/detachment jig is used. .

4 A support stand 402 is placed above the multilayered substrate 401.
are formed in large numbers. A cylindrical pin female portion 403 is erected on this support base 402 . This pin female part 403 is inserted into a pin male part 404, and a cylindrical grip part 405 is formed above this pin male part 404.
A cable 406 is connected above this gripping portion 405.

When attaching the female pin part 403 and the male pin part 404, the grip part 405 is pushed into the desired pin female part 403 using fingers or tweezers.

Also, the pin male part 404 pushed into the pin female part 403
A pin attachment/detachment jig 500 is used to remove the pin.

Pin attachment/detachment jig 5 C) 0 is an upper claw 5 at the lower end of the main body 502 having a protrusion 501 formed in a quarter circle shape on the lower surface side.
03 is formed. This body 5021: Two pores 504 are formed. A slide rod 505 is inserted into this small hole 504, a pressing portion 506 is provided at the upper end of this slide rod 505, and a lower claw 507 is provided at the lower end.

5 Upper claw 503 and lower claw 507 have U-shaped grooves 50 of the same shape.
8 is formed. In addition, the upper surface of the main body 502 and the pressing part 50
6, a spring 507 is attached around the slide rod 505.
a is provided. Since this spring 507a normally biases the pressing portion 506 in the direction B in FIG.
The lower claw 507 is in contact with the upper claw 503.

When the pads of the index finger and middle finger are brought into contact with the circular portions on the lower surface side of the left and right protrusions 501, and the pressing portion 506 is pressed with the pad of the thumb, a spring 507a is released as shown in FIG.
is contracted, and the upper claw 503 and lower claw 507 are separated.

The distance between adjacent substrates 401 is very narrow, and the distance between adjacent pin female parts 403 is also very narrow. When attaching the pin male part 404 and pin female part 403,
It is possible to insert the pin male part 404 and the pin female part 403 by grasping the grip part 405 and pushing it vertically downward, but as described above, the pin female part 403
Since the distance between the two and the distance between the substrates 401 is narrow, it is not easy to release the grip 6 part 405 and pull out the male pin part 404.

When removing the pin male part 404 from the pin female part 403, as shown in FIG.
06 is suppressed, the upper claw 503 and the lower claw 507
The pin male part 404 is brought into contact with the U-shaped groove 508 of the upper claw 5.
03 and the lower surface of the grip part 405 contact, and the lower claw 50
In a state where the lower surface of 7 and the upper surface of the support base 402 are in contact with each other, the pressing portion 506 is further suppressed.

At this time, the upper claw 503 moves in the direction B in the figure, and the lower claw 503 moves in the direction B in the figure.
A force is applied to 7 so that it moves in the direction C in the figure, and the grip part 4
05 in the direction B, the male pin part 404 is removed from the female pin part 403.

Thus, by using this pin attachment/detachment jig 500, the pin male portion 404 can be easily removed from the pin female portion 403.

Next, the testing procedure of the semiconductor testing device described above will be explained.

7 First, the workpiece 3 placed on the workpiece setting table 32 in the workloader part 30 is transported by the workpiece transport mechanism 40 to the workpiece delivery position above the workpiece mounting table 12 of the inspection section 10 . At this time, the contact terminal moving mechanism 50 moves toward the contact terminal supply section.

The workpiece 3 transported to the workpiece transfer position is transferred onto the workpiece transfer pin 19. At this time, the tip of one workpiece transfer pin is inserted into positioning holes provided at the four corners of the support board 8 of the workpiece 3, and the workpiece 3 is positioned. After that, the workpiece transfer pin 19 is lowered, the workpiece 3 is placed on the workpiece table 12, and is fixed liquid-tightly to the workpiece table 12 by the clamp 14, and is connected to the socket board 5 of the workpiece 3 for inspection. Electrical connection is made between the work set base unit 17 of the section 10.

At this time, the initial position of the thermal expansion correction target 8 provided on the lower surface of the multilayer ceramic substrate 2b of the workpiece 3 is recognized by the lower alignment camera 18a118b.

Before and after setting workpiece 3, pin block 2
1 is installed. The pin block 21 is first attached automatically according to the inspection program, and the contact terminal moving mechanism 50 is placed on the pin block changer 22 holding the pin block 21 corresponding to the chip 2a to be inspected first.
The X stage 51 and the Y stage 52 are driven so that the chuck portion 54 is positioned. When the chuck part 54 reaches the delivery position of the pin block 21, the cylinder mechanism 25 of the pin block changer 22 is raised, and the pin block 21 is held by the chuck part 54.

Thereafter, the holding state of the pin block 21 is imaged by the pin block correction camera 23, and after the position is confirmed with the upper alignment camera 55, the contact terminal moving mechanism 50 moves above the inspection section 10.

Next, the contact terminal moving mechanism 5 has moved upward to the inspection section 10.
The workpiece 3 and the pin block 21 are detected by the upper aligner 9
Alignment is performed. This alignment is performed by first imaging the surface of the multilayer ceramic substrate 2b using the upper alignment camera 55, and then moving the contact terminal moving mechanism 50 to the position of the alignment target provided at the triangular corner of the surface of the multilayer ceramic substrate 2b.
The position of each chip 2a is recognized as the position coordinate on the side XY stage, and the position of each chip 2a is determined as the position coordinate of the XY stage based on the alignment target position manually inputted in advance. Then, the position of the pin block 21 is determined according to the position coordinates of the chip 2a, and the
The stage 52 and the θ drive mechanism (not shown) are driven to align the measurement electrode pads formed around the chip 2a and the probe pins implanted in the pin block 21.

Next, from the non-conductive liquid introduction pipe 57, for example, a fluorine-based inert liquid is introduced into the liquid 111! ! 113, and the workpiece 3 is immersed in the non-conductive liquid 15.

Thereafter, the measuring unit 56 is lowered by driving the Z stage 53, and while the probe pins of the pin block 21 are immersed in the non-conductive liquid 15, they are brought into contact with the measurement electrode pads, and the touch plate 300 and the pin block 21 are brought into contact. Then, a test voltage is supplied to the semiconductor module 2 to test the chip 2a.

The above operation completes the inspection of one chip 2a. Next, if there are chips 2a of the same standard in the semiconductor module 2, first the lower alignment camera 18
After confirming whether there is any deviation from the initial position of the multilayer ceramic substrate 2b using a and 18b and correcting the position as necessary, the next chip 2a is similarly inspected.

After chips of the same standard are finished, if there is an untested chip 2a, first move the contact terminal moving mechanism 50 to a position above the contact terminal supply section 20, and move the pin block 21.
The chip 2a is replaced and the chip 2a is similarly inspected.

In this case, the signal cable terminal 3 of the touch plate 300
05 is arranged so that it can contact the upper pin 203a of any pin block 21,
Semiconductor elements having different standards can be easily tested.

After the inspection of all the chips 2a is completed by repeating the above steps, the non-conductive liquid 15 is discharged,
The workpiece 3 is transferred to the workpiece transport mechanism 40 that has moved above the inspection section 10 using the workpiece transfer pin 19. Then, move the work transport mechanism 40 to the work loader part 30,
The workpiece 3 is carried out, and a series of inspection steps is completed.

As described above, according to the semiconductor inspection apparatus of this embodiment, the signal cable terminal 305 of the touch plate 300 is arranged so as to be able to contact the upper pin 203a of any pin block 21, so that semiconductor elements of different standards can be tested. can be easily inspected.

Further, since the spring 205 is provided between the upper pin 203a and the lower pin 203b of the pin block 21, it is possible to easily make electrical contact between the semiconductor element, the pin block 21, and the touch plate 300 during inspection. can.

Furthermore, by shortening the height of the cylindrical conductive portion 311 of the touch plate 300, the influence of high frequency noise can be prevented.

In addition, we have been able to provide a pin attachment/detachment jig that can easily remove pins arranged in high density, which makes it possible to arrange pin connectors in high density, reduces the size of the board 401, and reduces the size of the touch plate body. The distance between the substrate 302 and the substrate 401 is shortened, and the electrical characteristics are improved.

[Effects of the Invention] As explained above, according to the inspection apparatus of the present invention, it is possible to automatically handle each object to be inspected provided on a board by replacing only the inspection terminal portion, and also, It is possible to provide an inspection device that enables high-density and high-precision electrical contact and satisfies high inspection accuracy and efficiency.

Furthermore, it is possible to provide a pin attachment/detachment jig that can easily remove pins arranged at high density.

3 Wear.

[Brief explanation of drawings]

Figure 1 is a cross-sectional view of this semiconductor inspection device in the X direction, Figure 2 is a cross-sectional view of the workpiece, Figures 3 and 4 are diagrams showing pin arrangements of different pin blocks, and Figure 5 is a perspective view of the touch plate. Figure 6 is a bottom view of the touch plate, Figure 7(a)
The figure is a front view of the pin block, and FIG. 7(b) is a sectional view of the touch play 1 and the pin block in a contact state.
FIG. 8 is an explanatory diagram of the pins provided on the substrate 2, the pin attachment/detachment jig, and the usage state of the pin attachment/detachment jig, and FIG. 9 is a perspective view of the substrate, pin block, and touch plate. 20... Contact terminal supply section 21...
...Pin block 50... Contact terminal moving mechanism 203...
......Probe pin 300...Touch plate 305...Signal cable terminal 500...
...Pin attaching/detaching jig 502...Body 4 6...Press portion 7a...Spring 7...Lower claw 3・・・・・・・・・Upper nail

Claims (2)

[Claims] (1) In an inspection device that performs an inspection by bringing a test terminal into contact with the electrode terminals of a plurality of test objects provided on a board, a plurality of pins each having a test terminal corresponding to the electrode terminal of the plurality of test objects, respectively. a selection mechanism that selects a pin block corresponding to the object to be inspected from the plurality of pin blocks when inspecting the object to be inspected; and a terminal that electrically contacts the output terminal of the pin block during inspection. An inspection device comprising: a touch plate provided with a plurality of terminals capable of contacting output terminals of any one of the plurality of pin blocks; (2) A pin attaching/detaching jig main body, a first claw provided near an end of the main body, and a spring interposed between the main body and the first claw, which is slidably provided with respect to the main body. a pressing part; and a second pawl provided near an end of the pressing part and working with the first pawl to pull out the pin connector in response to the pressing force of the pressing part. Pin attachment/removal jig.