JPH03257954A - Input-output device of ic package - Google Patents

Abstract

PURPOSE:To reduce the number of pins of an IC package and further reduce a package size by providing p-s conversion means included in the IC package for delivering a signal parallel-serial converting the signal among a plurality of input-output terminals and signal transmission means for transmitting a signal between the p-s conversion means and an external circuit in a serial data signal train. CONSTITUTION:There is provided, between an optical integrated circuit 5 and a plurality of input-output terminals of an IC chip 2, a management processor(MP) 6 composed of a decoder circuit for converting a serial (s) data signal supplied from the optical integrated circuit 5 to a parallel (P) data signal and a supplying the converted parallel (P) data signal to each input terminal of the IC chip 2 and of an encoder circuit for converting a parallel data signal supplied from each output terminal of the IC chip 2 to a serial data signal to supply the converted serial data signal to the optical integrated circuit 5. Such use of the serial data signal train transmission through the optical transmission means for the signal transmission between the plurality of the input-output terminals of the IC chip 2 and the external circuit ensures sharp reduction of the number of the pins of an IC package 1.

Description

TECHNICAL FIELD The present invention relates to an input/output device for an IC (integrated circuit) package, and more particularly to an input/output device for a high-density IC package.

BACKGROUND ART As integrated circuits such as memories and CPUs (Central Processing Units) are becoming increasingly dense and large in capacity, the number of pins on IC packages is increasing as the scale of these integrated circuits increases.

By the way, there are various shapes of IC packages, and a flat package as shown in FIG. 3 is known as a typical one.

In this flat package, the pin pitch is reduced, and the I
C chip bonding pad/end of CAR wiring)
At present, it is difficult to perform automatic soldering when connecting terminals and package terminals.

In addition, even as IC chips become more dense and their size remains small, the number of pins for connection with external circuits increases.
As a result, the package size will increase.

SUMMARY OF THE INVENTION [Object of the Invention] Accordingly, an object of the present invention is to provide an input/output device for an IC package that allows the number of pins of the IC package to be reduced and the package size to be reduced.

[Structure of the Invention] An input/output device for an IC package according to the present invention is an input/output device for inputting/outputting signals between a plurality of input/output terminals of a built-in IC chip and an external circuit, a built-in p-8 conversion means for transmitting and receiving signals while converting between p (parallel) and s (serial) between each of the plurality of input/output terminals; and the p-8 conversion means and the external circuit. The structure includes a signal transmission means for transmitting signals between the two in the form of a serial data signal train.

[Operation of the invention] In the input/output device for an IC package according to the present invention,
A p⇔s conversion means for transmitting and receiving p⇔s conversion signals between each of the plurality of input/output terminals of the IC chip is built into the IC package, and a The signals are transmitted in the form of a serial data signal train.

Example Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

FIG. 1 is a perspective view showing an IC package and its input/output device according to the present invention, and FIG. 2 is a plan view showing the internal structure of the IC package. 1 and 2, an IC package 1 has a built-in high-density IC chip 2,
Signals are transmitted between the IC package 1 and an external circuit (not shown) using, for example, an optical cable 3 as an optical transmission means in the form of a serial data signal train. The optical cable 3 is connected via an optical connector 4 to an optical integrated circuit (OE IC) 5 built into an IC package 1. In this optical integrated circuit 5, an optical signal is converted into an electrical signal, and an electrical signal is converted into an optical signal.

Between the optical integrated circuit 5 and the plurality of input/output terminals of the IC chip 2, a serial (s) data signal supplied from the optical integrated circuit 5 is converted into a parallel (p) data signal, and each of the IC chips 2 is connected. a management processor (MP) including a decoder circuit supplied to the input terminal and an encoder circuit that converts the parallel data signal supplied from each output terminal of the IC chip 2 into a serial data signal and supplies it to the optical integrated circuit 5;
6 is provided.

In this way, regarding signal transmission between the multiple input/output terminals of the IC chip 2 and external circuits,
Instead of mechanical contact using many pins of the package 1 or electrical connection using an alloy such as solder, for example, by using serial data signal train transmission using optical transmission means, the power supply (+/-/GND) and some parts can be connected. Because it is only necessary to use conventional electrical connections for the control signals of the Also, the ratio of chip size to package size can be brought closer to 1 compared to the conventional one, and the package size can be reduced.

In the above embodiment, the serial data signal string is transmitted using an optical transmission means, but the transmission means is not limited to the optical transmission means. Any device that can transmit a serial data signal sequence is sufficient.

Further, in the above embodiment, the optical integrated circuit 5 and the management processor 6 are separate chips from the IC chip 2, but it is also possible to incorporate only the management processor 6 or both into the IC chip 2.

As described in detail, the IC package input/output device according to the present invention transmits and receives signals while performing PWG conversion between each of the plurality of input/output terminals of the IC chip.
+s conversion means is built into the IC package, and this p −
Since the configuration is such that signals are transmitted between the +s conversion means and the external circuit in the form of a serial data signal train, the I
It is possible to reduce the number of bins of the C package and the package size.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing an IC package and its input/output device according to the present invention, Fig. 2 is a plan view showing the internal structure of the IC package, Fig. 3 is a plan view of a flat package IC, and Fig. 4 is a wire FIG. 3 is a plan view showing connection with package terminals by bonding. Explanation of symbols of main parts 1...IC package 2...IC
Chip 3... Optical cable 5...
・Optical integrated circuit 6...Management processor No. 257

Claims (3)

[Claims] (1) An input/output device for an IC package that inputs/outputs signals between a plurality of input/output terminals of a built-in IC chip and an external circuit, the input/output device being built in the IC package and of the plurality of input/output terminals. a p⇔s conversion means for transmitting and receiving signals while performing p (parallel)⇔s (serial) conversion between each; and a serial data signal for signal transmission between the p⇔s conversion means and the external circuit. 1. An input/output device characterized by comprising: means for transmitting signals in columns. (2) The signal transmission means includes an optical transmission means for transmitting the serial data signal string using an optical signal, and a conversion between the optical signal and the electrical signal between the optical transmission means and the p⇔s conversion means. 2. The input/output device according to claim 1, further comprising optical-to-electrical conversion means. (3) The input/output device according to claim 1, wherein the p⇔s conversion means is incorporated into the IC chip.