JPH03256394A - Connecting method of coated wire - Google Patents

Abstract

PURPOSE:To connect a plurality of coated wires by the small number of processes and surely, to arbitrarily distribute the individual coated wires and to arbitrarily form interconnections by a method wherein end parts of coated wires are inserted into wire insertion parts formed at terminal parts on the surface of an insulating board, tip parts are situated at the terminal parts, a laser beam is irradiated and the end parts and the terminal parts are melted and bonded. CONSTITUTION:A plurality of coated solid wires 2 are bonded in parallel separately on two wiring boards 1, 1; end parts 3 of the respective coated solid wires 2 are made to protrude from tip parts of the wiring boards 1. At a connecting board 4, a circuit pattern 6 made of copper or a copper alloy is formed on the surface of an insulating board 5 made of a synthetic resin. A plurality of circular terminal parts 7 are formed on the circuit pattern 6. Wire insertion holes 8 which pass the terminal parts 7 are made in the insulating board 5. The end parts 3 of the coated solid wires 2 are inserted into the insertion holes 8; the tip parts 12 of the wiring boards 1 are fitted to positioning grooves 10. The terminal parts 7 are irradiated with a laser beam 13; the end parts 3 and the terminal parts 7 are melted and bonded. Coatings 14 at tip parts of the end parts 3 are burnt and exfoliated; conductor parts 15 at the tip parts and the terminal parts 7 are melted and bonded to each other.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for quickly and reliably connecting a covered wire to a circuit pattern on an insulated substrate.

[Conventional technology]

FIG. 8 shows a conventional method of connecting covered electric wires. This connection method uses a plurality of coated single wires 2 on an insulating substrate 27.
8 in parallel, and the terminal portion 2 of the coated single wire 28.
The conductor portion 31 is exposed by mechanically or chemically removing the covering 30 of 9, and the conductor portion 31 is connected to the terminal 32.

However, this method has the problem of requiring a large number of man-hours to remove the coating 30, resulting in poor productivity.

Therefore, a connection method was invented as shown in FIGS. Insulating substrate 3
6, one coated single wire 37 is wired in parallel with the upper coated single wire 34. (a) For the L insulating substrates 33 and 36, press punching or the like is made at the intersection of each coated single wire 34° 35.37. (Figure (b))
, forming a conductive plating layer 39 inside the through hole 38,
The broken surfaces 40 of each coated single wire 34, 35, 37 are integrally connected by the conductive plating layer 39 (
Figure (C)). However, in this method, when the through hole 38 is formed, the fracture surface 4 of the coated single wire 34, 35, 37
0 was shifted deeper than the inner wall surface 41 of the through-hole 38, and the conductive plating layer 39 did not adhere well to the fracture surface 40, resulting in poor contact.

In the connection method shown in FIGS. 10(a) and 10(b), two coating units t#42 and 42 are crossed, and a laser beam 44 is irradiated to the intersection point 43 to ensure a reliable connection. The conductor parts 46 and 46 are welded to each other at the same time as the conductor parts 45 are burned off. However, in this method, a special jig (not shown) is required because the welding will not be successful unless the coated single wires 42 are firmly attached and fixed to each other. I was only able to make a simple connection.

[Problems to be Solved by the Invention] In view of the above-mentioned points, the present invention provides a connection method that can reliably connect a plurality of covered electric wires with a small number of man-hours, and can arbitrarily form the distribution and wiring between each covered electric wire. The purpose is to provide

[Means for Solving the Problems] In order to achieve the above object, the present invention forms a circuit pattern having a plurality of terminal portions on the surface of an insulating substrate, and also provides a circuit pattern having a plurality of terminal portions penetrating the insulating substrate. A wire insertion section is provided, a terminal portion of the covered wire is inserted into the wire insertion section, the tip of the terminal section is positioned in the terminal section, and a laser beam is irradiated to the terminal section to connect the terminal section with the terminal section. The basic method is to connect the covered wire by welding it to the terminal.

It is also possible to irradiate the circuit pattern with the laser beam to form a non-conducting portion in a part of the circuit pattern.

[For production]

By irradiating the terminal portion with a laser beam, the coating on the tip of the terminal portion of the covered wire is peeled off, and at the same time, the conductor portion at the tip and the terminal portion are firmly welded. Further, by irradiating a part of the circuit pattern with a laser beam, that part is fused and a non-conducting part can be obtained.

〔Example〕

FIGS. 1 to 5 show, in order of steps, an embodiment of a method for connecting covered electric wires according to the present invention.

FIG. 1 is an exploded perspective view showing the state before connection, and FIG. 2 is a vertical cross-sectional view. A plurality of coated single wires 2 are glued in parallel, and the end portion 3 of each coated single wire 2 is made to protrude from the tip of the wiring board 1. Reference numeral 4 indicates a connection board, and the connection board 4 has a circuit pattern 6 made of copper or prepared alloy formed on the surface of a synthetic resin type insulating base [5] by punching or etching. , the circuit pattern 6 includes a plurality of circular terminal portions 7.
It is formed. The terminal portion 7 is provided on the insulating substrate 5.
A wire insertion hole 8 passing through is provided, and a tapered enlarged diameter portion 9 is formed at the entrance side of the insertion hole 8, and a positioning groove 1 for the wiring board 1 is formed in the longitudinal direction of the insulating substrate 5.
0 is formed. Here, the protruding length L of the terminal part 3 is set so that when the terminal part 3 is inserted into the insertion hole 8, the tip 11 thereof is flush with the surface of the terminal part 7.

Then, as shown by arrow A, the end portion 3 of the covered single wire 2 is inserted into the insertion hole 8, and the tip portion 12 of the wiring board 1 is fitted into the positioning groove 10. FIG. 3 is a perspective view showing this assembled state, in which each terminal part 3 is attached to the terminal part 7.
The distal end surface 11 of is exposed.

Then, as shown in FIG. 4, the terminal section 7 to be connected is irradiated with a laser beam 13 to weld the terminal section 3 and the terminal section 7 together. That is, as shown in the cross-sectional view in FIG. 5, the coating 14 at the tip of the terminal section 3 is burned off by the laser beam 13, and at the same time, the conductor section 15 at the tip and the terminal section 7 are welded to each other. be. 16 indicates a welded portion.

Note that when the terminal portion 7 is not irradiated with the laser beam 13, the coating 14 of the terminal portion 3 blocks electrical continuity with the terminal portion 7, and a non-conducting portion 17 can be obtained. Furthermore, by irradiating the circuit pattern 6 with the laser beam 18, the circuit in that portion can be fused and a non-conducting portion 19 can be formed. Finally, on the surface of the connection board 4,
It is completed by applying an insulating film treatment (not shown) such as a cover or coating.

FIG. 6 shows, as another embodiment, a connection board '20,
A plurality of wire insertion grooves 23 are formed from the upper and lower side surfaces to the terminal portion 22 of the circuit pattern 21, and a covered electric wire 24 is inserted into each insertion groove 23 from above and below. Furthermore, as shown in FIG. 7, multiple rows of circuit patterns 26 may be formed on the connection board 25. In this case as well, the method shown in FIGS. (not shown) can be connected.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to quickly and reliably connect a plurality of coated wires to a board by irradiation with a laser beam, and also to connect a printed circuit, a conductive plating circuit, or a die stamp with the laser beam. Because it is possible to easily create a non-conducting part by cutting a part of the circuit, etc.
This makes it possible to improve productivity and connection reliability.

[Brief explanation of drawings]

Figures 1 to 5 show an embodiment of the present invention in the order of steps, with Figure 1 being an exploded perspective view, Figure 2 being a longitudinal sectional view,
Fig. 3 is a perspective view, Fig. 4 is a perspective view, Fig. 5 is a vertical sectional view thereof, Figs. 6 to 7 are perspective views showing other embodiments, and Fig. 8 is an exploded perspective view showing a conventional example. 9(a) to 9(C) are vertical sectional views showing another conventional example, and FIGS. 10(a) and 10(b) are perspective views showing other conventional examples. 2.24... Covered electric wire, 3... Terminal part, 5... Insulating board, 6, 21, 26... Circuit pattern, 7, 22
...Terminal part, 8...Wire insertion hole, 13.18
. . . Laser light, 19 . . . Non-conducting portion, 23 . . . Wire insertion groove. Figure 1 Figure 2 Figure 7 Figure 8 Figure 506- (0) Figure 10

Claims (2)

[Claims] (1) A circuit pattern having a plurality of terminal parts is formed on the surface of an insulating substrate, and a wire insertion part that penetrates the insulating board is provided in the terminal part, and the terminal part of the covered electric wire is inserted into the wire insertion part. A method for connecting covered electric wires, comprising: positioning the tip of the terminal portion on the terminal portion; and irradiating the terminal portion with a laser beam to weld the terminal portion and the terminal portion. (2) The method for connecting covered electric wires according to claim 1, wherein a non-conducting portion is formed in a part of the circuit pattern by irradiating the laser beam onto the circuit pattern.