JPH03254078A - Joint structure for superconductive wire - Google Patents
Joint structure for superconductive wireInfo
- Publication number
- JPH03254078A JPH03254078A JP4930190A JP4930190A JPH03254078A JP H03254078 A JPH03254078 A JP H03254078A JP 4930190 A JP4930190 A JP 4930190A JP 4930190 A JP4930190 A JP 4930190A JP H03254078 A JPH03254078 A JP H03254078A
- Authority
- JP
- Japan
- Prior art keywords
- superconducting
- foil
- filament
- superconducting wire
- filaments
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 57
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 22
- 239000011888 foil Substances 0.000 claims abstract description 17
- 238000005304 joining Methods 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 238000007747 plating Methods 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 16
- 239000002887 superconductor Substances 0.000 abstract description 10
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 229910017604 nitric acid Inorganic materials 0.000 abstract description 2
- 239000003381 stabilizer Substances 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 238000002788 crimping Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002085 persistent effect Effects 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 229910020012 Nb—Ti Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Superconductors And Manufacturing Methods Therefor (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は接続抵抗が小さく、高い磁場中においても長時
間安定した信頼性の高い接続部が得られる超電導線の接
続構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a superconducting wire connection structure that has low connection resistance and provides a highly reliable connection that is stable for a long time even in a high magnetic field.
超電導線を実際の装置で使用する場合、線材の製造工程
上、超電導線−本当たりの長さに限界があること、また
、超電導線が使用される装置の構造上複雑な形状が要求
される等の理由から超電導線材同士の接続は不可欠であ
る。When superconducting wires are used in actual equipment, there is a limit to the length of each superconducting wire due to the wire manufacturing process, and a complex shape is required due to the structure of the equipment in which the superconducting wires are used. For these reasons, it is essential to connect superconducting wires to each other.
超電導コイルを永久電流モードで運転する場合、永久電
流ループにおける電流の減衰は接続部の抵抗値と超電導
コイルのインダクタンスの値で決まる。そのため、接続
部の抵抗をできる限り小さくすることが要求される。と
ころで、通常の金属系超電導線は、Ｃｕ、Ｃｕ−Ｎｉ合
金、Ａ氾等の常電導金属の安定化母体中に超電導フィラ
メントが複数本埋め込まれた構造になっている。超電導
線の接続方法として、安定化材同士のはんだ付、超音波
溶接等の方法が用いられてきた。しかし、常電導体であ
る安定化材が介在しているため、接続部は本質的に超電
導とはならず、抵抗値を１０−９Ω程度までしか小さく
することはできない。そこで、超電導フィラメント同士
の直接接合が必要となる。超電導フィラメント同士の直
接接合については、特開昭５９−１６２０７号公報に示
されるように超電導線材の接続部分の安定化材を除去し
、超電導フィラメントをすべて露出した後、接続する線
材のフィラメント同士をはんだ付けしたり、機械的に圧
着する方法がある。フィラメント材のはんだ付では、フ
ィラメントとはんだ材間で化合物が生威し特性が劣化し
てしまう。一方、圧着の手法を用いた場合には１０’″
１２Ω程度まで接続抵抗を小さくすることができる可能
性はあるが、接続時の非常にわずかな条件の違いにより
接続特性が大きく左右される。一方、接続抵抗を減少し
、接続部の安定化を図る接続方法として、特開昭６０−
３５４７８号公報ではフィラメント材の超音波接合方法
が提案されている。しかし、この超音波接合方法はフィ
ラメント材を束ね、かつ、撚って超音波接合を行ってい
るため、作業者による人為的要因が接続部の特性に大き
く影響し、安定した接続部が得られないという欠点があ
る。When operating a superconducting coil in persistent current mode, the attenuation of the current in the persistent current loop is determined by the resistance value of the connection and the inductance value of the superconducting coil. Therefore, it is required to reduce the resistance of the connection part as much as possible. By the way, a normal metal-based superconducting wire has a structure in which a plurality of superconducting filaments are embedded in a stabilizing matrix of a normal conducting metal such as Cu, Cu--Ni alloy, or A-type metal. As methods for connecting superconducting wires, methods such as soldering between stabilizing materials and ultrasonic welding have been used. However, since the stabilizing material, which is a normal conductor, is present, the connecting portion is not essentially superconducting, and the resistance value can only be reduced to about 10 −9 Ω. Therefore, direct bonding of superconducting filaments is required. For direct joining of superconducting filaments, as shown in Japanese Unexamined Patent Publication No. 59-16207, after removing the stabilizing material at the connecting part of the superconducting wire and exposing all the superconducting filaments, the filaments of the wire to be connected are bonded together. There are methods such as soldering and mechanical crimping. When soldering filament materials, compounds grow between the filament and the solder material, resulting in deterioration of properties. On the other hand, when using the crimping method, 10'''
Although it is possible to reduce the connection resistance to about 12Ω, the connection characteristics are greatly influenced by very slight differences in connection conditions. On the other hand, as a connection method for reducing connection resistance and stabilizing the connection part,
No. 35478 proposes an ultrasonic bonding method for filament materials. However, since this ultrasonic bonding method involves bundling and twisting filament materials to perform ultrasonic bonding, human factors by the operator can greatly affect the characteristics of the connection, making it difficult to obtain a stable connection. There is a drawback that there is no
上記従来技術では、安定化同士の接続では接続部の抵抗
が太きい。一方、接続抵抗をできる限り小さくするため
に、超電導フィラメント同士で接続する場合には常に安
定した接続部の特性を得ることが難しく接合部の特性が
不安定で信頼性の点で問題があった。本発明の目的は、
接続抵抗が極めて小さく、常に信頼性の高い超電導フィ
ラメント同士の接続構造および接合体を提供することに
ある。In the above-mentioned conventional technology, the resistance of the connection part is large when the stabilizers are connected to each other. On the other hand, when connecting superconducting filaments to each other in order to minimize connection resistance, it is difficult to always obtain stable connection characteristics, resulting in unstable joint characteristics and reliability problems. . The purpose of the present invention is to
The object of the present invention is to provide a connection structure and bonded body between superconducting filaments that have extremely low connection resistance and are always highly reliable.
上記目的を達成するために、本発明は安定化材を剥離し
た超電フィラメント材を前記フィラメント材と同様の特
性をもつ箔を介して超音波接合することにより達成され
る。さらに、超音波接合後に接合部分に銅めつきまたは
銅めっきとニッケルめつきα複合めつきを施すことによ
り、接続部の安定化が図れる。In order to achieve the above object, the present invention is achieved by ultrasonically bonding a superelectric filament material from which the stabilizing material has been removed through a foil having the same characteristics as the filament material. Furthermore, by applying copper plating or α composite plating of copper plating and nickel plating to the joint portion after ultrasonic bonding, the connection portion can be stabilized.
安定化材から剥離されたフィラメント材は超音波接合方
法によって超電導体からなる箔を介して金属的に接続さ
れているため、接続抵抗が減少し、かつ、極低温化にお
ける使用状態でも接続部の熱的な安定化が図れる。また
、従来の接合方法のようにフィラメント材同士が撚しら
れて交差することなく接続されているため、接続の際に
生じる人為的要因がなくなり、再現性にも優れた接続部
が得られる。さらに、超音波接合後に接合部に銅めっき
、または、ニッケルめっきと銅めっきの複合めっきを施
すことにより、露出されたフィラメント材が銅、または
、ニッケル等の安定化材で覆われる。従って、接続部分
の熱的、磁気的安定化が得られる。また、必要に応じて
、銅、または、ニッケルめっき後、超電導特性が損われ
ない条件で熱処理を施すことにより、接続部の低抵抗化
と安定化が図られる。さらに、安定化材から露出した各
フィラメント材が箔の表面で、できるかぎり撚られない
で超音波接合されるためには、接続部分のみ安定化材か
ら露出させ、その端部は安定化材に固定された状態で超
音波接合することにより達威される。The filament material separated from the stabilizing material is metallically connected via a superconductor foil using an ultrasonic bonding method, which reduces connection resistance and maintains the connection even when used at extremely low temperatures. Thermal stabilization can be achieved. In addition, since the filament materials are connected without twisting and crossing each other as in conventional joining methods, there are no artificial factors that occur during connection, and connections with excellent reproducibility can be obtained. Further, by applying copper plating or composite plating of nickel plating and copper plating to the joint portion after ultrasonic bonding, the exposed filament material is covered with copper or a stabilizing material such as nickel. Therefore, thermal and magnetic stabilization of the connecting portion can be achieved. Further, if necessary, after copper or nickel plating, heat treatment is performed under conditions that do not impair superconducting properties, thereby reducing the resistance and stabilizing the connection portion. Furthermore, in order for each filament material exposed from the stabilizing material to be ultrasonically bonded on the surface of the foil with as little twisting as possible, only the connecting portion should be exposed from the stabilizing material, and the ends should be attached to the stabilizing material. This is achieved by ultrasonic bonding in a fixed state.
〈実施例１〉 本発明の実施例を図面にもとづいて説明する。 <Example 1> Embodiments of the present invention will be described based on the drawings.
第１図は本発明により超電導線１と２との接合方法を示
す。第１図の超電導線１および２はいずれも銅を安定化
材として、内部に各５０本のフィラメント材が埋め込ま
れている。なお、フィラメント材の材質はＮｂとＴｉと
の合金で径は５０ＪＬｍ、超電導線全体の外径は２ｍｍ
である。まず、第１図に示すように、超電導線１と２と
の接続部を硝酸溶液で除去し、フィラメント３および４
を露出させる。次に、フィラメント材３と４をフィラメ
ント材と同じ組成と特性をもつ超電導体からなる厚さ５
０μｍの箔５の表面でお互いに向き合うように配置する
。この場合、各フィラメント材がお互いに交差しないよ
うに配置することが望ましい。FIG. 1 shows a method of joining superconducting wires 1 and 2 according to the present invention. Both superconducting wires 1 and 2 in FIG. 1 have copper as a stabilizing material, and 50 filaments each are embedded inside. The filament material is an alloy of Nb and Ti, and the diameter is 50 JLm, and the outer diameter of the entire superconducting wire is 2 mm.
It is. First, as shown in FIG. 1, the connection between superconducting wires 1 and 2 is removed with a nitric acid solution, and
expose. Next, the filament materials 3 and 4 are made of a superconductor having the same composition and characteristics as the filament materials.
They are arranged so as to face each other on the surface of the 0 μm foil 5. In this case, it is desirable to arrange the filament materials so that they do not cross each other.
次に、超音波電極６をフィラメント材の上に接触させ、
超電導体の箔５の表面にフィラメント材を超音波接合す
る。このときの超音波接合条件は圧カフ０〜↓２ＯＮ、
周波数２０ｋＨｚ、時間０．７〜３ｓｅｃ、振幅２０μ
ｍで行った。次に前述の方法で接合されたフィラメント
材を銅製のスリーブに挿入し、外部から荷重１００ｋｇ
ｆで圧着する。Next, the ultrasonic electrode 6 is brought into contact with the filament material,
A filament material is ultrasonically bonded to the surface of the superconductor foil 5. The ultrasonic bonding conditions at this time are pressure cuff 0~↓2ON,
Frequency 20kHz, time 0.7-3sec, amplitude 20μ
I went with m. Next, the filament material joined by the above method is inserted into a copper sleeve, and an external load of 100 kg is applied.
Crimp with f.
第２図は前述の方法で接続された接続部の断面を示すが
、フィラメント３および４は超電導体の箔５に接続され
、かつ、周囲は銅スリーブ７で固定されている。この方
法によって接続された超電導体の接続抵抗を測定した結
果、試験温度４．２に、磁場０．５Ｔ、通電電流１００
Ａの条件で１０−１３Ω以下の抵抗値が得られた。さら
に、同様に接続体を１０本作成し、クエンチ電流を測定
結果、ＩＴの磁場で１００ＯＡの値を示し、安定した特
性が得られた。FIG. 2 shows a cross-section of a connection made in the manner described above, in which the filaments 3 and 4 are connected to a superconductor foil 5 and secured around the circumference by a copper sleeve 7. As a result of measuring the connection resistance of superconductors connected by this method, the test temperature was 4.2, the magnetic field was 0.5T, and the current was 100.
Under condition A, a resistance value of 10-13Ω or less was obtained. Furthermore, 10 connected bodies were made in the same manner, and the quench current measurement results showed a value of 100 OA in the IT magnetic field, and stable characteristics were obtained.
〈実施例２〉
第３図は実施例１と同様の超電導線のフィラメント材３
と４を超電導体からなる厚さ５０μｍｉ５の間にフィラ
メント材が平行になるように配置した後、超音波接合す
る。なお、本実施例ではフィラメント材を分割し、三枚
の箔に超音波接合を行った。次に、これを第４図に示す
ような形状の銅スリーブ６内に挿入して外部から圧着す
る。前述の方法によって得られた超電導体の接続部を評
価した結果、実施例１と同様の特性が安定して得られた
。<Example 2> Figure 3 shows the filament material 3 of a superconducting wire similar to Example 1.
and 4 are arranged so that the filament material is parallel to the 50 μm thick superconductor, and then ultrasonically bonded. In this example, the filament material was divided and ultrasonic bonding was performed on three pieces of foil. Next, this is inserted into a copper sleeve 6 having a shape as shown in FIG. 4 and crimped from the outside. As a result of evaluating the connection portion of the superconductor obtained by the above method, the same characteristics as in Example 1 were stably obtained.
〈実施例３〉
第５図は接続すべき超電導線１と２のフィラメント材の
接続部分だけを安定化材から露出させ、その端部は安定
化材に固定された状態で超音波接合を行った実施例を示
す。フィラメント材を超電導体から箔の表面でお互いに
平行になるように配置する。この実施例における超電導
線の安定化材およびフィラメント材の材質９寸法は実施
例１と同じである。第５図に示したように、箔５の表面
に平行に配置した一方のフィラメント材を超音波接合す
る。次いで他方のフィラメント材を超音波接合する。こ
のときの超音波接合条件は実施例１と同じである。次に
、露出されたフィラメント材と超音波接合部に銅めっき
を施す。このときの銅めっきの方法は化学めっきでその
厚さは約１０μｍである。銅めっき後超電導線の特性が
損われない温度、すなわち、Ｎｂ−Ｔｉの場合は３００
°ＣでＩＯ時間の熱処理を行った。次に、これを第２図
で示したと同様の銅のスリーブ内に挿入し、外部から２
００ｋｇｆの荷重で圧着した。前述の方法で接合された
超電導体の特性を実施例１と同様の方法で評価した結果
、接合部の抵抗は１０−１４Ωであった。このようにし
て接合した超電導線によって超電導マグネットを作製し
た。<Example 3> Figure 5 shows that only the connecting portion of the filament materials of superconducting wires 1 and 2 to be connected is exposed from the stabilizing material, and ultrasonic bonding is performed with the ends fixed to the stabilizing material. An example is shown below. The filament materials are placed parallel to each other on the surface of the foil from the superconductor. The materials and dimensions of the stabilizing material and filament material of the superconducting wire in this example are the same as in Example 1. As shown in FIG. 5, one of the filament materials arranged parallel to the surface of the foil 5 is ultrasonically bonded. Next, the other filament material is ultrasonically bonded. The ultrasonic bonding conditions at this time are the same as in Example 1. Next, copper plating is applied to the exposed filament material and the ultrasonic bonding area. The method of copper plating at this time is chemical plating, and the thickness thereof is about 10 μm. The temperature at which the characteristics of the superconducting wire are not impaired after copper plating, that is, 300°C in the case of Nb-Ti.
Heat treatment was performed at °C for IO hours. Next, it is inserted into a copper sleeve similar to that shown in Figure 2, and the
It was crimped with a load of 00 kgf. The characteristics of the superconductor bonded by the above-described method were evaluated in the same manner as in Example 1, and the resistance of the bonded portion was 10-14Ω. A superconducting magnet was produced using the superconducting wires joined in this way.
本発明によれば接続抵抗の小さい超電導線材のフィラメ
ント同士の接続が可能で、接続状態、および、それに伴
う接続特性が安定しており信頼性の高い超電導線の接続
を得ることが可能となる。According to the present invention, it is possible to connect filaments of superconducting wires with low connection resistance, and it is possible to obtain a highly reliable connection of superconducting wires in which the connection state and the associated connection characteristics are stable.
第１図、第３図及び第５図は本発明の実施例を示す斜視
図、第２図、第４図はその接合部の断面図を示す。
１．２・・・超電導線、３，４・・・超電導フィラメン
ト、５・・・超電導箔、６・・・超音波ホーン。
一つ、第
１
図
第
図
第
図FIGS. 1, 3 and 5 are perspective views showing embodiments of the present invention, and FIGS. 2 and 4 are sectional views of the joints thereof. 1.2... Superconducting wire, 3, 4... Superconducting filament, 5... Superconducting foil, 6... Ultrasonic horn.
One, Figure 1
Claims (1)
フィラメント材が埋め込まれた構造を持つ合金系または
化合物系超電導線の接続において、接続部分のフィラメ
ント材を安定化材から露出し、前記フィラメント材と同
様の特性をもつ超電導部材を介して超音波接合され、か
つ、銅のスリーブで固定されていることを特徴とする超
電導線の接続構造。 ２、請求項１において、前記超電導特性をもつ部材は、
厚さが１０〜１０００μｍの箔であることを特徴とする
超電導線の接続構造。 ３、接続部分のフィラメント材を安定化材から露出し、
前記フィラメント材と同様の超電導特性をもつ箔の表面
に接続すべき二束以上の超電導線の前記フィラメント材
同士がお互いに交差しないように配置されて、前記箔と
超音波接合され、かつ、銅スリーブで固定されているこ
とを特徴とする超電導線の接続構造。 ４、請求項１において、接合すべき前記超電導線の前記
フィラメント材は、接合部分でだけを安定化材から露出
し、その端部は安定化材に埋め込まれ、固定された状態
で超音波接合を行う超電導線の接合構造。 ５、請求項１、２、３または４において、超音波接合後
銅めつきまたはＮｉめつきと銅めつきの複合めつきが施
されている超電導線の接合構造。 ６、請求項５において、めつき工程後、６００℃以下の
温度で熱処理が行われる超電導線の接続構造。 ７、超電導装置用の超伝導線が超伝導特性をもつ箔を介
して超音波接合されていることを特徴とする超伝導装置
。[Claims] 1. In the connection of alloy-based or compound-based superconducting wires that have a structure in which a stabilizing material of a normal conductive metal is used as a base material and a plurality of filament materials are embedded therein, the filament material of the connecting portion is 1. A superconducting wire connection structure, which is exposed from a stabilizing material, ultrasonically bonded via a superconducting member having the same characteristics as the filament material, and fixed with a copper sleeve. 2. In claim 1, the member having superconducting properties is
A superconducting wire connection structure characterized by being a foil having a thickness of 10 to 1000 μm. 3.Expose the filament material of the connection part from the stabilizing material,
The filament materials of two or more bundles of superconducting wires to be connected to the surface of a foil having superconducting properties similar to those of the filament material are arranged so as not to cross each other, and are ultrasonically bonded to the foil, and A superconducting wire connection structure characterized by being fixed with a sleeve. 4. In claim 1, the filament material of the superconducting wire to be joined is exposed from the stabilizing material only at the joining portion, and the end thereof is embedded in the stabilizing material and ultrasonic joining is performed in a fixed state. A superconducting wire bonding structure that performs 5. The superconducting wire bonding structure according to claim 1, 2, 3 or 4, wherein copper plating or composite plating of Ni plating and copper plating is applied after ultrasonic bonding. 6. The superconducting wire connection structure according to claim 5, wherein a heat treatment is performed at a temperature of 600° C. or less after the plating step. 7. A superconducting device characterized in that a superconducting wire for the superconducting device is ultrasonically bonded via a foil having superconducting properties.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4930190A JPH03254078A (en) | 1990-03-02 | 1990-03-02 | Joint structure for superconductive wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4930190A JPH03254078A (en) | 1990-03-02 | 1990-03-02 | Joint structure for superconductive wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03254078A true JPH03254078A (en) | 1991-11-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4930190A Pending JPH03254078A (en) | 1990-03-02 | 1990-03-02 | Joint structure for superconductive wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03254078A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130193193A1 (en) * | 2012-01-27 | 2013-08-01 | Apple Inc. | Ultrasonic bonding |
| GB2498961A (en) * | 2012-02-01 | 2013-08-07 | Siemens Plc | Methods of joining superconducting wires |
-
1990
- 1990-03-02 JP JP4930190A patent/JPH03254078A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130193193A1 (en) * | 2012-01-27 | 2013-08-01 | Apple Inc. | Ultrasonic bonding |
| US8800846B2 (en) * | 2012-01-27 | 2014-08-12 | Apple Inc. | Ultrasonic bonding |
| GB2498961A (en) * | 2012-02-01 | 2013-08-07 | Siemens Plc | Methods of joining superconducting wires |
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