JPH0325246U - - Google Patents
Info
- Publication number
- JPH0325246U JPH0325246U JP1989085933U JP8593389U JPH0325246U JP H0325246 U JPH0325246 U JP H0325246U JP 1989085933 U JP1989085933 U JP 1989085933U JP 8593389 U JP8593389 U JP 8593389U JP H0325246 U JPH0325246 U JP H0325246U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- lsi
- flange
- hole
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 8
- 238000010292 electrical insulation Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989085933U JPH0648862Y2 (ja) | 1989-07-20 | 1989-07-20 | Ｌｓｉの実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989085933U JPH0648862Y2 (ja) | 1989-07-20 | 1989-07-20 | Ｌｓｉの実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0325246U true JPH0325246U (cs) | 1991-03-15 |
| JPH0648862Y2 JPH0648862Y2 (ja) | 1994-12-12 |
Family
ID=31635307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989085933U Expired - Lifetime JPH0648862Y2 (ja) | 1989-07-20 | 1989-07-20 | Ｌｓｉの実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648862Y2 (cs) |
-
1989
- 1989-07-20 JP JP1989085933U patent/JPH0648862Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648862Y2 (ja) | 1994-12-12 |