JPH0325236U - - Google Patents

Info

Publication number
JPH0325236U
JPH0325236U JP8577589U JP8577589U JPH0325236U JP H0325236 U JPH0325236 U JP H0325236U JP 8577589 U JP8577589 U JP 8577589U JP 8577589 U JP8577589 U JP 8577589U JP H0325236 U JPH0325236 U JP H0325236U
Authority
JP
Japan
Prior art keywords
semiconductor chip
submount
needle
semiconductor
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8577589U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8577589U priority Critical patent/JPH0325236U/ja
Publication of JPH0325236U publication Critical patent/JPH0325236U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP8577589U 1989-07-20 1989-07-20 Pending JPH0325236U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8577589U JPH0325236U (enrdf_load_stackoverflow) 1989-07-20 1989-07-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8577589U JPH0325236U (enrdf_load_stackoverflow) 1989-07-20 1989-07-20

Publications (1)

Publication Number Publication Date
JPH0325236U true JPH0325236U (enrdf_load_stackoverflow) 1991-03-15

Family

ID=31635075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8577589U Pending JPH0325236U (enrdf_load_stackoverflow) 1989-07-20 1989-07-20

Country Status (1)

Country Link
JP (1) JPH0325236U (enrdf_load_stackoverflow)

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