JPH03250903A - Manufacture of dielectric resonator - Google Patents

Manufacture of dielectric resonator

Info

Publication number
JPH03250903A
JPH03250903A JP4873390A JP4873390A JPH03250903A JP H03250903 A JPH03250903 A JP H03250903A JP 4873390 A JP4873390 A JP 4873390A JP 4873390 A JP4873390 A JP 4873390A JP H03250903 A JPH03250903 A JP H03250903A
Authority
JP
Japan
Prior art keywords
conductor film
hole
inner conductor
lead terminal
coupling capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4873390A
Other languages
Japanese (ja)
Other versions
JP2827033B2 (en
Inventor
Masao Igarashi
五十嵐 雅夫
Satoshi Kazama
智 風間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP4873390A priority Critical patent/JP2827033B2/en
Publication of JPH03250903A publication Critical patent/JPH03250903A/en
Application granted granted Critical
Publication of JP2827033B2 publication Critical patent/JP2827033B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To easily and stably connect a coupling capacitor to an inner conductor film under the condition of no use of solder or less quantity of use of solder by inserting at least part of the coupling capacitor to a throughhole for resonance, bending a projection of a connection member simultaneously so as to be in elastic contact with an inner conductor film. CONSTITUTION:In order to couple 2nd electrodes 16, 17 of coupling capacitors 10, 11 to an inner conductor film with lead terminals 24, 25, a connection member 26 having a circular center part 32 made of a metallic plate with elasticity such as a phosphorous bronze having a thickness of 0.05mm whose diameter is 2.5mm and four fin-shaped or wing-shaped projections 34 projecting from an outer circumferential ridge 33 is prepared. In the connection members 26, 27, the 1st and 2nd coupling capacitors 10, 11 are engaged with the 2nd lead terminals 24, 25 before being inserted through a throughhole 4. Then the assembly is fitted to the throughhole 4 from a 1st end face 2 of the dielectric block 1.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、例えば自動車電話、パーソナル無線、コード
レス電話等の通信機器等に使用するための誘電体共振器
の製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a dielectric resonator for use in communication equipment such as, for example, car telephones, personal radios, and cordless telephones.

[従来の技術] 通信機器等に使用するための1/4波長の分布定数型誘
電体共振器として、1個又は複数個の共振用貫通孔を有
する誘電体ブロックと、共振用貫通孔内に設けた内導体
膜と、誘電体ブロックの外周面に設けた外導体膜と、内
導体膜に接続された結合コンデンサとから成るものが、
例えば特開平1−181203号公報に開示されている
[Prior Art] A 1/4 wavelength distributed constant dielectric resonator for use in communication equipment, etc. includes a dielectric block having one or more resonance through holes, and a dielectric block having one or more resonance through holes. The device consists of an inner conductor film provided, an outer conductor film provided on the outer peripheral surface of the dielectric block, and a coupling capacitor connected to the inner conductor film.
For example, it is disclosed in Japanese Patent Application Laid-Open No. 1-181203.

[発明が解決しようとする課題] ところで、結合コンデンサの電極と内導体膜は共振用貫
通孔内で接続されるので、両者の接続を容昌且つ確実に
達成することは困難であった。また、両者を半田で結合
すると、半田の熱による熱衝撃によって磁器誘電体ブロ
ックにマイクロクラックが発生し、特性変動の要因にな
ることがある。
[Problems to be Solved by the Invention] Incidentally, since the electrodes of the coupling capacitor and the inner conductor film are connected within the resonance through-hole, it has been difficult to achieve a robust and reliable connection between the two. Furthermore, when the two are bonded together with solder, microcracks may occur in the ceramic dielectric block due to thermal shock caused by the heat of the solder, which may cause characteristic fluctuations.

そこで、本発明の目的は、半田の無使用又は少量使用条
件で結合コンデンサを内導体膜に安定的且つ容易に接続
することができる誘電体共振器の製造方法を提供するこ
とにある。
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for manufacturing a dielectric resonator that can stably and easily connect a coupling capacitor to an inner conductor film without using solder or using a small amount of solder.

[課題を解決するための手段] 上記目的を達成するための本発明は、実施例を示す図面
の符号を参照して説明すると、互いに対向する第1及び
第2の端面2.3及びこれ等の間の外周面7を有し、且
つ前記第1の端面2から前記第2の端面3に至る単数又
は複数の共振用の貫通孔4を有する誘電体ブロック1と
、前記貫通孔4の壁面に設けられた内導体膜6と、前記
誘電体ブロック1の前記外周面7に設けられた外導体膜
8と、第1及び第2のリード端子20.24を有し、前
記第1のリード端子20が前記誘電体ブロック1の前記
第1の端面2側に導出されており、前記第2のリード端
子24が接続部材26を介して前記貫通孔4の前記内導
体膜6に接続されている結合コンデンサ10とを備えた
誘電体共振器の製造方法において、前記結合コンデンサ
10とこの結合コンデンサ10の前記貫通孔4に対する
挿入深さを制限するための部分29dを前記結合コンデ
ンサ10に一体化したものを用意する工程と、前記第1
の端面2において前記貫通孔4の前記内導体膜6の内に
挿入可能な寸法を有する中央部32と、前記貫通孔4か
らはみ出るように前記中央部32から外側に突出し且つ
屈曲可能に形成されている複数の突出部34とを備え、
前記中央部32に前記第2のリード端子24を圧入又は
係合させることが可能な切欠部35が設けられている導
電性接続部材26を用意する工程と、前記接続部材26
の前記切欠部35に前記第2のリード端子24を挿入す
ることによって前記接続部材26と前記第2のリード端
子24との電気的及び機械的結合を成立させ且つ前記制
限する部分29dが前記誘電体ブロック1の前記第1の
端面2に当接するように前記結合コンデンサ10の少な
くとも一部を前記貫通孔4に挿入し、同時に前記接続部
材26の前記突出部33を屈曲させて前記内導体膜6に
弾性的に接触させる工程とを備えていることを特徴とす
る誘電体共振器の製造方法に係わるものである。
[Means for Solving the Problems] To achieve the above object, the present invention will be described with reference to the reference numerals in the drawings showing the embodiments. a dielectric block 1 having an outer circumferential surface 7 between and one or more resonance through holes 4 extending from the first end surface 2 to the second end surface 3; and a wall surface of the through hole 4. an inner conductor film 6 provided on the outer peripheral surface 7 of the dielectric block 1, an outer conductor film 8 provided on the outer peripheral surface 7 of the dielectric block 1, and first and second lead terminals 20, 24, A terminal 20 is led out to the first end surface 2 side of the dielectric block 1, and the second lead terminal 24 is connected to the inner conductor film 6 of the through hole 4 via a connecting member 26. In the method for manufacturing a dielectric resonator, the coupling capacitor 10 and a portion 29d for limiting the insertion depth of the coupling capacitor 10 into the through hole 4 are integrated into the coupling capacitor 10. a step of preparing the first
a central portion 32 having a size that can be inserted into the inner conductor film 6 of the through hole 4 at the end surface 2 of the through hole 4; a plurality of protrusions 34,
a step of preparing a conductive connecting member 26 provided with a notch 35 into which the second lead terminal 24 can be press-fitted or engaged in the central portion 32;
By inserting the second lead terminal 24 into the notch 35, an electrical and mechanical connection is established between the connecting member 26 and the second lead terminal 24, and the limiting portion 29d is connected to the dielectric At least a portion of the coupling capacitor 10 is inserted into the through hole 4 so as to come into contact with the first end surface 2 of the body block 1, and at the same time, the protruding portion 33 of the connecting member 26 is bent to close the inner conductor film. 6. The present invention relates to a method for manufacturing a dielectric resonator characterized by comprising a step of bringing the dielectric resonator into elastic contact with the dielectric resonator.

[作 用] 本発明によれば、結合コンデンサ10と共に接続部材2
6を貫通孔4に押し込むのみで、第2のリード端子24
と内導体膜6との電気的接続が達成される。従って、こ
の接続が極めて容易になる。
[Function] According to the present invention, the coupling capacitor 10 and the connecting member 2
6 into the through hole 4, the second lead terminal 24
Electrical connection between the inner conductor film 6 and the inner conductor film 6 is achieved. Therefore, this connection becomes extremely easy.

[実施例コ 次に、第1図〜第9図を参照して本発明の実施例に係わ
るl/4波長分布定数型誘電体共振器を含む誘電体フィ
ルタを説明する。
Embodiment Next, a dielectric filter including a 1/4 wavelength distribution constant type dielectric resonator according to an embodiment of the present invention will be described with reference to FIGS. 1 to 9.

この誘電体フィルタは、チタン酸バリウム系磁器から成
る6、0X12X8.Omsの角柱状誘電体ブロック1
を備えている。誘電体ブロック1には、この第1の端面
2から第2の端面3に至る直径2.7Hの円形の2つの
共振用貫通孔4と1つの結合用貫通孔5とが設けられて
いる。各共振用貫通孔4の壁面には内導体膜6が夫々設
けられ、一対の端面2.3間の外周面7即ち4側面には
外導体膜8が設けられ、第2の端面3には内導体膜6と
外導体膜7とを接続するように端面導体膜9が設けられ
ている。内導体膜6、外導体膜8及び端面導体膜9は銀
ペーストを塗布して焼付けたものから成り、10μmの
膜厚を有する。なお、方の端面2は開放端面になってい
る。
This dielectric filter is made of barium titanate porcelain. Oms prismatic dielectric block 1
It is equipped with The dielectric block 1 is provided with two circular resonance through holes 4 and one coupling through hole 5 with a diameter of 2.7H extending from the first end surface 2 to the second end surface 3. An inner conductor film 6 is provided on the wall surface of each resonance through hole 4, an outer conductor film 8 is provided on the outer peripheral surface 7 between the pair of end surfaces 2. An end conductor film 9 is provided to connect the inner conductor film 6 and the outer conductor film 7. The inner conductor film 6, the outer conductor film 8, and the end face conductor film 9 are made of silver paste coated and baked, and have a film thickness of 10 μm. Note that the other end surface 2 is an open end surface.

各共振用貫通孔4内に一部が挿入されるように夫々配置
されたアキシャルリード型のII及び第2の結合コンデ
ンサ10.11は、夫々の円筒状のコンデンサ用磁器誘
電体12.13と、各誘電体12.13の一端近傍に設
けられた夫々の第1の電極14.15と、他端近傍領域
に設けられた夫々の第2の電極16.17とを有し、第
1の電極14.15と第2の電極16.17との間に静
電容量が夫々得られるように形成されている。
The axial lead type II and second coupling capacitors 10.11, which are respectively disposed so as to be partially inserted into each resonance through hole 4, are connected to the respective cylindrical capacitor ceramic dielectrics 12.13. , a respective first electrode 14.15 provided near one end of each dielectric 12.13, and a respective second electrode 16.17 provided in a region near the other end; The electrodes 14.15 and the second electrodes 16.17 are formed so as to provide a capacitance between them.

各結合コンデンサ10,11の一方の電極14.15に
は金属キャップ18.19を介して夫々の第1のリード
端子20.21が接続されている。
A respective first lead terminal 20.21 is connected to one electrode 14.15 of each coupling capacitor 10, 11 via a metal cap 18.19.

第2の電極16.17にも金属キャップ23.24が夫
々覆せられ、夫々の第2のリード端子24.25が導出
されている。各リード端子20.21.24.25は直
径0.55mmのリード線から成る。
The second electrodes 16.17 are also respectively covered with metal caps 23.24, and respective second lead terminals 24.25 are led out. Each lead terminal 20.21.24.25 consists of a lead wire with a diameter of 0.55 mm.

共振用貫通孔4内の第2のリード端子24.25と内導
体膜6との間には夫々の接続部材26.27が配置され
ている。
Connection members 26 and 27 are arranged between the second lead terminals 24 and 25 in the resonance through-hole 4 and the inner conductor film 6, respectively.

第1及び第2の結合コンデンサ10,11と金属製シー
ルド部材28とは共通の熱可塑性合成樹脂から成る絶縁
支持体29によって一体化されている。この一体化は第
1及び第2の結合コンデンサ10.11を共振用貫通孔
4に配置する前に行う。即ち、第5図及び第6図に示す
ように第1及び12の結合コンデンサ10.11とH型
のシールド部材28とを用意し、これ等を絶縁支持体2
9で一体化して組立体30を得る。
The first and second coupling capacitors 10, 11 and the metal shield member 28 are integrated by a common insulating support 29 made of thermoplastic synthetic resin. This integration is performed before placing the first and second coupling capacitors 10.11 in the resonance through hole 4. That is, as shown in FIG. 5 and FIG.
9 to obtain an assembly 30.

シールド部材28は、厚さ0.2mmのりん青銅板に半
田メツキ処理したものから成り、結合用貫通孔5の上方
及び共振用貫通孔6の近傍を覆う上面部28aと、誘電
体ブロック1の長手の対の側面の外導体膜8に接続する
ための一対の側面部28b、28cと、回路基板(図示
せず)に対する取付は及びアースに対する接続に利用す
るための4つの突出部28dとから成り、上面部28a
が絶縁支持体29に固着されている。
The shield member 28 is made of a phosphor bronze plate with a thickness of 0.2 mm and soldered, and includes an upper surface portion 28a that covers the upper part of the coupling through hole 5 and the vicinity of the resonance through hole 6, and A pair of side surfaces 28b and 28c for connection to the outer conductor membrane 8 on the longitudinal pair of sides, and four protrusions 28d for attachment to a circuit board (not shown) and for connection to ground. The upper surface part 28a
is fixed to the insulating support 29.

絶縁支持体29は第1及び第2の結合コンデンサ10.
11の連結部29aと、共振用貫通孔6に対する第1及
び第2の結合コンデンサ10.11の径方向の位置決め
を達成するための突出部29b、29cと、共振用貫通
孔6に対する第1及び第2の結合コンデンサ10.11
の深さ方向の位置決めを達成するための鍔部29d、2
9eとを有し、位置制限体として機能する。なお、第1
及び第2の結合コンデンサ10.11は、リード端子2
0.21.24.25と金属キャップ18.19.22
.23の一部とを除いて絶縁支持体29で被覆されてい
る。
The insulating support 29 connects the first and second coupling capacitors 10.
11 connecting portions 29a, protrusions 29b and 29c for achieving radial positioning of the first and second coupling capacitors 10.11 with respect to the resonance through hole 6, and first and second coupling capacitors 10.11 with respect to the resonance through hole 6. Second coupling capacitor 10.11
Flange portions 29d, 2 for achieving positioning in the depth direction of
9e, and functions as a position limiter. In addition, the first
and the second coupling capacitor 10.11 is connected to the lead terminal 2.
0.21.24.25 and metal cap 18.19.22
.. 23 is covered with an insulating support 29.

第1図〜第3図に示す誘電体フィルタを組立てる時には
、第4図に示す各導体膜6.8.9を設けた誘電体ブロ
ック1を用意し、また第5図及び第6図に示す結合コン
デンサ10.11とシールド部材28との組立体30を
用意する。絶縁支持体29の第1及び第2の結合コンデ
ンサ10.11を包囲する突出部29b、29cの寸法
及び相互間隔は共振用貫通孔4に適合するように決定さ
れているので、突出部29b、29Cを夫々の共振用貫
通孔4に同軸的に嵌入することができる。
When assembling the dielectric filter shown in FIGS. 1 to 3, a dielectric block 1 provided with each conductor film 6, 8, and 9 shown in FIG. 4 is prepared, and a dielectric block 1 shown in FIGS. 5 and 6 is prepared. An assembly 30 of the coupling capacitor 10.11 and the shield member 28 is prepared. Since the dimensions and mutual spacing of the protrusions 29b and 29c surrounding the first and second coupling capacitors 10.11 of the insulating support 29 are determined to fit the resonance through hole 4, the protrusions 29b, 29C can be coaxially fitted into each resonance through hole 4.

また、突出部29b、29cの挿入の深さは鍔部29d
、29eが誘電体ブロック1の上面に当接することによ
って決まる。
Further, the depth of insertion of the protrusions 29b and 29c is the flange 29d.
, 29e are in contact with the upper surface of the dielectric block 1.

シールド部材28の一対の側面部28b、28Cは誘電
体ブロック1の外導体膜8の側面間の距離にほぼ一致す
るように決定されているので、対の側面部28b、28
cで誘電体ブロック1の外導体膜8の対向側面部を挟持
した第3図の状態を容易に得ることができる。シールド
部材28は僅かに弾性変形可能な金属板で形成されてい
るので、側面部28b、28cの対向間隔が誘電体ブロ
ック1の幅よりも僅かに小さい場合であっても、装着を
容易に達成゛することができる。シールド部材28の外
導体膜8に対する電気的及び機械的結合を確実に達成す
るために第3図に原理的に示す半田31によって両者を
結合する。
The pair of side surfaces 28b, 28C of the shielding member 28 are determined to approximately match the distance between the side surfaces of the outer conductor film 8 of the dielectric block 1, so the pair of side surfaces 28b, 28C
The state shown in FIG. 3 in which the opposing side surfaces of the outer conductor film 8 of the dielectric block 1 are sandwiched at c can be easily obtained. Since the shield member 28 is formed of a slightly elastically deformable metal plate, even if the opposing distance between the side surfaces 28b and 28c is slightly smaller than the width of the dielectric block 1, mounting can be easily achieved. You can. In order to ensure electrical and mechanical connection of the shield member 28 to the outer conductor film 8, the two are connected by solder 31, which is shown in principle in FIG.

結合コンデンサ10.11の第2の電極16.17をリ
ード端子24.25によって内導体膜6に結合するため
に、第7図及び第8図に示す接続部材26を用意する。
In order to connect the second electrode 16.17 of the coupling capacitor 10.11 to the inner conductor membrane 6 by means of the lead terminal 24.25, a connecting member 26 shown in FIGS. 7 and 8 is prepared.

この接続部材26は例えば厚さ0.05mmのりん青銅
のようなバネ性を有する金属板から成り、直径2.5g
+mの円形中央部32と、この外周縁33から突出する
4つのヒレ又は翼状の突出部34とを有する。中央部3
2の中心には放射状に形成された幅0.2as、長さ1
゜O■會の複数のスリットの集りから成る切欠部35が
設けられている。これにより、中心方向に突出している
複数の鋭角部36が中央部32に生じている。複数の鋭
角部36の先端に対する内接円の径は第2のリード端子
24の径よりも幾らか小さい。中央部32の径は内導体
膜6を備えた共振用貫通孔4の径りとほぼ同−又は幾ら
か小さい。90度間隔で4方向に配置された突出部34
は、幅0.51履、長さ0.7層鱈こ形成され、第7図
の接続部材26を共振用貫通孔4に対して同軸配置した
時に、共振用貫通孔4からはみ出すような長さを有する
。なお、第2の結合コンデンサ11のための第2の接続
部材27は第1の接続部材26と全く同一に形成されて
いる。
This connecting member 26 is made of a metal plate having spring properties such as phosphor bronze with a thickness of 0.05 mm, and has a diameter of 2.5 g.
It has a +m circular center portion 32 and four fin or wing-shaped protrusions 34 protruding from this outer peripheral edge 33. Central part 3
2 has a width of 0.2 as and a length of 1 formed radially in the center.
A cutout portion 35 is provided which is a group of a plurality of slits of ゜O■. As a result, a plurality of acute angle portions 36 protruding toward the center are formed in the central portion 32. The diameter of the inscribed circle with respect to the tips of the plurality of acute angle portions 36 is somewhat smaller than the diameter of the second lead terminal 24. The diameter of the central portion 32 is approximately the same as or somewhat smaller than the diameter of the resonance through hole 4 provided with the inner conductor film 6. Projections 34 arranged in four directions at 90 degree intervals
is formed with a width of 0.51 layers and a length of 0.7 layers, and has a length that protrudes from the resonance through hole 4 when the connecting member 26 shown in FIG. 7 is arranged coaxially with the resonance through hole 4. It has a certain quality. Note that the second connecting member 27 for the second coupling capacitor 11 is formed exactly the same as the first connecting member 26.

接続部材26.27は、第1及び第2の結合コンデンサ
10.11を貫通孔4に挿入する前に第6図に示すよう
に第2のリード端子24.25に係合させる。即ち、第
2のリード端子24を接続部材26の切欠部35に圧入
する。これにより、鋭角部36が押し拡げられ、鋭角部
36が第2のリード端子24に弾性的に接触する。接続
部材26を金属キャップ22に当接するまで押し込むと
、接続部材26は第2のリード端子24に対して鋭角部
36で強固に電気的及び機械的に結合される。
The connecting member 26.27 is engaged with the second lead terminal 24.25 as shown in FIG. 6 before inserting the first and second coupling capacitor 10.11 into the through hole 4. That is, the second lead terminal 24 is press-fitted into the notch 35 of the connecting member 26. As a result, the acute angle portion 36 is pushed apart, and the acute angle portion 36 comes into elastic contact with the second lead terminal 24 . When the connecting member 26 is pushed in until it contacts the metal cap 22, the connecting member 26 is firmly electrically and mechanically coupled to the second lead terminal 24 at the acute angle portion 36.

なお、第2の接続部材27も第1の接続部材26と同様
に第2のリード端子25に係合させる。
Note that the second connecting member 27 is also engaged with the second lead terminal 25 in the same manner as the first connecting member 26 .

次に、第6図に示す組立体を誘電体ブロック1の第1の
端面2側から貫通孔4に嵌合させる。即ち、第2のリー
ド端子24.25を貫通孔4に挿入し、組立体30を第
1の端面2から第2の端面3に向うように押圧する。ヒ
レ状又は翼状の突出部34は共振用貫通孔4からはみ出
しているので、その先端が第1の端面2側を向くように
L字に押し曲げられ、内導体膜6に弾性的に接触しなが
ら共振用貫通孔4の内部に入り込む。接続部材26の押
し込みを続けると、絶縁支持体29の鍔部29d、29
eが第1の端面2に当接し、これ以上の押し込みが阻止
される。屈曲された突出部34は内導体膜6に弾性的に
接続し、電気的接続が成立する。第2の接続部材27の
共振用貫通孔4に対する押し込みも第1の接続部材26
と全く同様に行う。
Next, the assembly shown in FIG. 6 is fitted into the through hole 4 of the dielectric block 1 from the first end surface 2 side. That is, the second lead terminals 24, 25 are inserted into the through holes 4, and the assembly 30 is pressed from the first end surface 2 toward the second end surface 3. Since the fin-shaped or wing-shaped protrusion 34 protrudes from the resonance through hole 4, its tip is pressed and bent into an L shape so as to face the first end surface 2 side, and comes into elastic contact with the inner conductor film 6. while entering the inside of the resonance through hole 4. When the connection member 26 is continued to be pushed in, the flanges 29d, 29 of the insulating support 29
e comes into contact with the first end surface 2, and further pushing is prevented. The bent protrusion 34 is elastically connected to the inner conductor film 6, and an electrical connection is established. The pushing of the second connecting member 27 into the resonance through hole 4 is also done by the first connecting member 26.
Do exactly the same thing.

絶縁支持体29の突出部29b、29cは共振用貫通孔
4に圧入され、且つシールド部材28の一対の側面部2
8b、28cは弾性を有して外導体膜8に圧接され、且
つ第2のリード端子24.25に接続部材26.27が
係合しているので、第1及び第2の結合コンデンサ10
.11を含む組立体30は誘電体ブロック1に対して比
較的に強固に一体化される。しかし、より強固に結合さ
せるために、この実施例では、シールド部材28を半田
31で外導体膜8に結合する。
The protrusions 29b and 29c of the insulating support 29 are press-fitted into the resonance through hole 4, and the pair of side surfaces 2 of the shield member 28
8b and 28c have elasticity and are pressed against the outer conductor film 8, and the connecting members 26.27 are engaged with the second lead terminals 24.25, so that the first and second coupling capacitors 10
.. The assembly 30 including the dielectric block 11 is relatively firmly integrated with the dielectric block 1. However, in order to bond more firmly, in this embodiment, the shield member 28 is bonded to the outer conductor film 8 with solder 31.

完成した誘電体フィルタは、例えば入力及び出力リード
端子20.21及びシールド部材28の突出部28dを
回路基板(図示せず)の貫通孔に挿入し、入力及び出力
リード端子20.21を信号伝送ラインに接続すると共
に、シールド部材28をアースに接続する。
In the completed dielectric filter, for example, the input and output lead terminals 20.21 and the protrusion 28d of the shield member 28 are inserted into a through hole of a circuit board (not shown), and the input and output lead terminals 20.21 are used for signal transmission. At the same time, the shield member 28 is connected to the ground.

第9図は誘電体フィルタの等価回路を示す。コンデンサ
C1とインダクタンスLLとから成る第1の共振回路は
一対の貫通孔4の内の一方の内導体膜6と接地される外
導体膜8と端面導体膜9と誘電体ブロック1とに基づい
て形成され、コンデンサC2とインダクタンスL2とか
ら成る第2の共振回路は一対の貫通孔4の内の他方の内
導体膜6と接地される外導体膜8と端面導体膜9と誘電
体ブロック1とに基づいて形成され、2つの共振回路は
誘電性インピーダンスZ1によって結合されている。
FIG. 9 shows an equivalent circuit of a dielectric filter. The first resonant circuit consisting of the capacitor C1 and the inductance LL is based on the inner conductor film 6 of one of the pair of through holes 4, the grounded outer conductor film 8, the end surface conductor film 9, and the dielectric block 1. A second resonant circuit that is formed and includes a capacitor C2 and an inductance L2 is formed by connecting the other inner conductor film 6 of the pair of through holes 4, the grounded outer conductor film 8, the end surface conductor film 9, and the dielectric block 1. The two resonant circuits are coupled by a dielectric impedance Z1.

本実施例によれば、接続部材26.27を結合コンデン
サ10.11と共に共振用貫通孔6に押し込むのみで、
結合コンデンサ10.11と内導体膜6との接続が達成
されるので、この接続が容易になる。
According to this embodiment, simply pushing the connecting members 26, 27 together with the coupling capacitors 10, 11 into the resonance through hole 6,
Since the connection between the coupling capacitor 10.11 and the inner conductor film 6 is achieved, this connection becomes easy.

また、半田を使用しないで上記の接続を達成することが
できるので、半田付は時の熱衝撃によるマイクロクラッ
ク発生の問題が生じない。
Further, since the above connection can be achieved without using solder, the problem of microcracking due to thermal shock during soldering does not occur.

また、第1及び第2の結合コンデンサ10.11を絶縁
支持体29で支持し、ここに鍔部29d129eを設け
たので、これがストッパとして機能し、第1及び第2の
コンデンサ10.11の共振用貫通孔4の深さ方向の位
置決めが達成され、接続部材26.27の埋込位置が一
定になる。
In addition, since the first and second coupling capacitors 10.11 are supported by the insulating support 29 and the flange portions 29d129e are provided there, this functions as a stopper and prevents the resonance of the first and second capacitors 10.11. The positioning of the through-hole 4 in the depth direction is achieved, and the embedded position of the connecting member 26, 27 becomes constant.

[変形例] 本発明は上述の実施例に限定されるものでなく、例えば
次の変形が可能なものである。
[Modifications] The present invention is not limited to the above-described embodiments, and, for example, the following modifications are possible.

(1) 誘電体ブロック1が1つの共振用貫通孔4のみ
を有する誘電体共振器にも本発明を適用することができ
る。即ち、1つの共振回路のみを形成する場合にも本発
明を適用することができる。
(1) The present invention can also be applied to a dielectric resonator in which the dielectric block 1 has only one resonance through hole 4. That is, the present invention can be applied even when forming only one resonant circuit.

1つの共振回路のみを構成する場合には誘電体ブロック
は通常円筒型に形成される。
When configuring only one resonant circuit, the dielectric block is usually formed in a cylindrical shape.

(2) 誘電体ブロック1に3個以上の共振用貫通孔4
を設け、多段誘電体フィルタを構成する場合にも本発明
を適用することができる。
(2) Three or more resonance through holes 4 in the dielectric block 1
The present invention can also be applied to a case where a multi-stage dielectric filter is configured.

(3) 端面導体膜9を省いて1/2波長の誘電体共振
器又はフィルタを形成することができる。
(3) A 1/2 wavelength dielectric resonator or filter can be formed by omitting the end face conductor film 9.

(4) 第1及び第2の結合コンデンサ10.11の誘
電体12.13を円柱状にすることができる。
(4) The dielectrics 12.13 of the first and second coupling capacitors 10.11 can be cylindrical.

(5) 接続部材26.27の中央部32の中心に切欠
部35として円形の孔を形成し、この孔から放射状に延
びる複数の割り溝を、設け、この孔に第2のリード端子
24を圧入又は嵌入するようにしてもよい。
(5) A circular hole is formed as a notch 35 at the center of the central portion 32 of the connecting member 26, 27, a plurality of grooves are provided radially extending from this hole, and the second lead terminal 24 is inserted into this hole. It may be press-fitted or fitted.

(6) 接続部材26.27を内導体膜6とリード端子
24.25と金属キャップ18.19の内の1つ又は複
数に少量の半田で結合してもよい。
(6) The connecting members 26, 27 may be bonded to one or more of the inner conductor membrane 6, the lead terminals 24, 25, and the metal caps 18, 19 with a small amount of solder.

半田を併用する場合であっても、接続部材26.27が
バネ性を有して強固に接触しているので、半田の量を多
くする必要はない。半田量が少量の場合は熱衝撃が小さ
い。
Even if solder is used in combination, there is no need to increase the amount of solder because the connecting members 26 and 27 have spring properties and are in firm contact. If the amount of solder is small, the thermal shock will be small.

(7) 接続部材26.27を第1の端面2上において
貫通孔4に同軸的に位置決めし、この切欠部35に第2
のリード端子24.25を挿入し、第1及び第2の結合
コンデンサ10.11を貫通孔4に挿入しながら、第2
のリード端子24.25の接続部材26.27に対する
係合を行ってもよい。この場合、接続部材26.27に
貫通孔4に対する位置決め用の突起を設けておくと都合
が良い。
(7) Coaxially position the connecting members 26 and 27 in the through hole 4 on the first end surface 2, and insert the second
While inserting the lead terminals 24.25 of and the first and second coupling capacitors 10.11 into the through hole 4,
The lead terminals 24.25 may be engaged with the connecting members 26.27. In this case, it is convenient to provide the connecting members 26, 27 with projections for positioning with respect to the through hole 4.

[発明の効果] 上述から明らかなように、本発明によれば、結合コンデ
ンサと内導体膜との接続を容易且つ確実に達成すること
ができる。
[Effects of the Invention] As is clear from the above, according to the present invention, the connection between the coupling capacitor and the inner conductor film can be easily and reliably achieved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の実施例に係わる誘電体フィルタを第2
図のI−I線で示す断面図、 第2図は第1図の誘電体フィルタの平面図、第3図は第
2図の■−■線断面図、 第4図は第1図の各導体膜を有する誘電体ブロックの斜
視図、 第5図は第1図の誘電体フィルタを構成するための組立
体を示す平面図、 第6図は第5図の組立体のV[−Vl線断面図、第7図
は装着前の接続部材を示す平面図、第8図は17図の接
続部材の正面図、 第9図は第1図の誘電体フィルタの等価回路図である。 1・・・誘電体ブロック、2・・・第1の端面、3・・
・第2の端面、4・・・共振用貫通孔、6・・・内導体
膜、7・・・外周面、8・・・外導体膜、10・・・第
1の結合コンデンーサ、11・・・第2の結合コンデン
サ、20.21・・・第1のリード端子、24.25・
・・第2のリード端子、26・・・第1の接続部材、2
7・・・第2の接続部材、28・・・シールド部材、2
9・・・絶縁支持体、32・・・中央部、34・・・突
出部、35・・・切欠部。 代  理  人   高  野  則  次第1図 第5図 第6図
FIG. 1 shows a second dielectric filter according to an embodiment of the present invention.
Figure 2 is a plan view of the dielectric filter shown in Figure 1, Figure 3 is a cross-sectional view taken along line ■-■ in Figure 2, Figure 4 is a cross-sectional view of the dielectric filter shown in Figure 1. A perspective view of a dielectric block having a conductive film, FIG. 5 is a plan view showing an assembly for configuring the dielectric filter of FIG. 1, and FIG. 6 is a perspective view of the assembly shown in FIG. 7 is a plan view showing the connection member before attachment, FIG. 8 is a front view of the connection member shown in FIG. 17, and FIG. 9 is an equivalent circuit diagram of the dielectric filter shown in FIG. 1. 1... Dielectric block, 2... First end surface, 3...
- Second end surface, 4... Resonance through hole, 6... Inner conductor film, 7... Outer peripheral surface, 8... Outer conductor film, 10... First coupling capacitor, 11. ...Second coupling capacitor, 20.21...First lead terminal, 24.25.
...Second lead terminal, 26...First connection member, 2
7... Second connection member, 28... Shield member, 2
9... Insulating support body, 32... Center part, 34... Projection part, 35... Notch part. Agent Nori Takano Figure 1 Figure 5 Figure 6

Claims (1)

【特許請求の範囲】 [1]互いに対向する第1及び第2の端面 (2)(3)及びこれ等の間の外周面(7)を有し、且
つ前記第1の端面(2)から前記第2の端面(3)に至
る単数又は複数の共振用の貫通孔(4)を有する誘電体
ブロック(1)と、 前記貫通孔(4)の壁面に設けられた内導体膜(6)と
、 前記誘電体ブロック(1)の前記外周面(7)に設けら
れた外導体膜(8)と、 第1及び第2のリード端子(20)(24)を有し、前
記第1のリード端子(20)が前記誘電体ブロック(1
)の前記第1の端面(2)側に導出されており、前記第
2のリード端子(24)が接続部材(26)を介して前
記貫通孔(4)の前記内導体膜(6)に接続されている
結合コンデンサ(10)とを備えた誘電体共振器の製造
方法において、 前記結合コンデンサ(10)とこの結合コンデンサ(1
0)の前記貫通孔(4)に対する挿入深さを制限するた
めの部分(29d)を前記結合コンデンサ(10)に一
体化したものを用意する工程と、 前記第1の端面(2)において前記貫通孔(4)の前記
内導体膜(6)の内に挿入可能な寸法を有する中央部(
32)と、前記貫通孔(4)からはみ出るように前記中
央部(32)から外側に突出し且つ屈曲可能に形成され
ている複数の突出部(34)とを備え、前記中央部(3
2)に前記第2のリード端子(24)を圧入又は係合さ
せることが可能な切欠部(35)が設けられている導電
性接続部材(26)を用意する工程と、 前記接続部材(26)の前記切欠部(35)に前記第2
のリード端子(24)を挿入することによって前記接続
部材(26)と前記第2のリード端子(24)との電気
的及び機械的結合を成立させ且つ前記制限する部分(2
9d)が前記誘電体ブロック(1)の前記第1の端面(
2)に当接するように前記結合コンデンサ(10)の少
なくとも一部を前記貫通孔(4)に挿入し、同時に前記
接続部材(26)の前記突出部(33)を屈曲させて前
記内導体膜(6)に弾性的に接触させる工程と を備えていることを特徴とする誘電体共振器の製造方法
[Claims] [1] Having first and second end surfaces (2) and (3) facing each other and an outer circumferential surface (7) between them, and from the first end surface (2) A dielectric block (1) having one or more resonance through holes (4) reaching the second end surface (3), and an inner conductor film (6) provided on the wall of the through hole (4). and an outer conductor film (8) provided on the outer circumferential surface (7) of the dielectric block (1), and first and second lead terminals (20) and (24), and the first A lead terminal (20) is connected to the dielectric block (1).
) is led out to the first end surface (2) side, and the second lead terminal (24) is connected to the inner conductor film (6) of the through hole (4) via the connecting member (26). A method for manufacturing a dielectric resonator comprising a coupling capacitor (10) connected to the coupling capacitor (10).
0) of integrating a portion (29d) into the coupling capacitor (10) for limiting the insertion depth into the through hole (4); a central portion (
32), and a plurality of protrusions (34) that protrude outward from the center part (32) and are bendable so as to protrude from the through hole (4),
2) preparing a conductive connecting member (26) provided with a notch (35) into which the second lead terminal (24) can be press-fitted or engaged; ) in the notch (35) of the second
By inserting the lead terminal (24) of the connecting member (26) and the second lead terminal (24), an electrical and mechanical connection is established between the connecting member (26) and the second lead terminal (24), and the limiting portion (2
9d) is the first end surface (
2), at least a portion of the coupling capacitor (10) is inserted into the through hole (4) so as to be in contact with the inner conductor film. (6) A method for manufacturing a dielectric resonator, comprising the step of bringing the material into elastic contact with the material.
JP4873390A 1990-02-28 1990-02-28 Manufacturing method of dielectric resonator Expired - Lifetime JP2827033B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4873390A JP2827033B2 (en) 1990-02-28 1990-02-28 Manufacturing method of dielectric resonator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4873390A JP2827033B2 (en) 1990-02-28 1990-02-28 Manufacturing method of dielectric resonator

Publications (2)

Publication Number Publication Date
JPH03250903A true JPH03250903A (en) 1991-11-08
JP2827033B2 JP2827033B2 (en) 1998-11-18

Family

ID=12811491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4873390A Expired - Lifetime JP2827033B2 (en) 1990-02-28 1990-02-28 Manufacturing method of dielectric resonator

Country Status (1)

Country Link
JP (1) JP2827033B2 (en)

Also Published As

Publication number Publication date
JP2827033B2 (en) 1998-11-18

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