JPH03250045A - Molding material for artificial marble - Google Patents
Molding material for artificial marbleInfo
- Publication number
- JPH03250045A JPH03250045A JP4580390A JP4580390A JPH03250045A JP H03250045 A JPH03250045 A JP H03250045A JP 4580390 A JP4580390 A JP 4580390A JP 4580390 A JP4580390 A JP 4580390A JP H03250045 A JPH03250045 A JP H03250045A
- Authority
- JP
- Japan
- Prior art keywords
- homopolymer
- polyester resin
- artificial marble
- parts
- aluminum hydroxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002928 artificial marble Substances 0.000 title claims description 17
- 239000012778 molding material Substances 0.000 title claims description 12
- 229920001519 homopolymer Polymers 0.000 claims abstract description 22
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 14
- -1 N-substituted maleimide Chemical class 0.000 claims description 21
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 abstract description 5
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 abstract description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 abstract 2
- 229920001225 polyester resin Polymers 0.000 abstract 2
- 239000004645 polyester resin Substances 0.000 abstract 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 2
- 238000013329 compounding Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 238000006116 polymerization reaction Methods 0.000 description 8
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- MKRBAPNEJMFMHU-UHFFFAOYSA-N 1-benzylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CC1=CC=CC=C1 MKRBAPNEJMFMHU-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004579 marble Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 239000012744 reinforcing agent Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- DSPZRAREZHBQMV-UHFFFAOYSA-N (4-butylcyclohexyl) (4-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(CCCC)CCC1OC(=O)OOC(=O)OC1CCC(CCCC)CC1 DSPZRAREZHBQMV-UHFFFAOYSA-N 0.000 description 1
- HZSAZNPWHKCGKO-UHFFFAOYSA-N 1,3-dimethylpyrrole-2,5-dione Chemical compound CN1C(=O)C=C(C)C1=O HZSAZNPWHKCGKO-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- RLTBRRMSUZLBLA-UHFFFAOYSA-N 1-(2-methylcyclohexyl)pyrrole-2,5-dione Chemical compound CC1CCCCC1N1C(=O)C=CC1=O RLTBRRMSUZLBLA-UHFFFAOYSA-N 0.000 description 1
- QYOJZFBQEAZNEW-UHFFFAOYSA-N 1-(2-methylphenyl)pyrrole-2,5-dione Chemical compound CC1=CC=CC=C1N1C(=O)C=CC1=O QYOJZFBQEAZNEW-UHFFFAOYSA-N 0.000 description 1
- CGGDDXJVSGFQON-UHFFFAOYSA-N 1-(4-propan-2-ylphenyl)pyrrole-2,5-dione Chemical compound C1=CC(C(C)C)=CC=C1N1C(=O)C=CC1=O CGGDDXJVSGFQON-UHFFFAOYSA-N 0.000 description 1
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 1
- MHEFNZSCICKHDS-UHFFFAOYSA-N 1-cyclododecylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCCCCCCCC1 MHEFNZSCICKHDS-UHFFFAOYSA-N 0.000 description 1
- PZQWVKKXPIZFHC-UHFFFAOYSA-N 1-decylpyrrole-2,5-dione Chemical compound CCCCCCCCCCN1C(=O)C=CC1=O PZQWVKKXPIZFHC-UHFFFAOYSA-N 0.000 description 1
- FDAOHAAJGZHMKN-UHFFFAOYSA-N 1-ethyl-3-hexylpyrrole-2,5-dione Chemical compound CCCCCCC1=CC(=O)N(CC)C1=O FDAOHAAJGZHMKN-UHFFFAOYSA-N 0.000 description 1
- FBPVUBVZRPURIU-UHFFFAOYSA-N 1-hexylpyrrole-2,5-dione Chemical compound CCCCCCN1C(=O)C=CC1=O FBPVUBVZRPURIU-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- HOLZCMFSCBLOLX-UHFFFAOYSA-N 1-octadecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCCCCCCCN1C(=O)C=CC1=O HOLZCMFSCBLOLX-UHFFFAOYSA-N 0.000 description 1
- NQDOCLXQTQYUDH-UHFFFAOYSA-N 1-propan-2-ylpyrrole-2,5-dione Chemical compound CC(C)N1C(=O)C=CC1=O NQDOCLXQTQYUDH-UHFFFAOYSA-N 0.000 description 1
- DABFKTHTXOELJF-UHFFFAOYSA-N 1-propylpyrrole-2,5-dione Chemical compound CCCN1C(=O)C=CC1=O DABFKTHTXOELJF-UHFFFAOYSA-N 0.000 description 1
- CISIJYCKDJSTMX-UHFFFAOYSA-N 2,2-dichloroethenylbenzene Chemical compound ClC(Cl)=CC1=CC=CC=C1 CISIJYCKDJSTMX-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- BSWWXRFVMJHFBN-UHFFFAOYSA-N 2,4,6-tribromophenol Chemical compound OC1=C(Br)C=C(Br)C=C1Br BSWWXRFVMJHFBN-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- ZKKDYLHSRWLPSP-UHFFFAOYSA-N 3-chloro-1-phenylpyrrole-2,5-dione Chemical compound O=C1C(Cl)=CC(=O)N1C1=CC=CC=C1 ZKKDYLHSRWLPSP-UHFFFAOYSA-N 0.000 description 1
- QAVUFFJVZGZJMO-UHFFFAOYSA-N 3-methyl-1-phenylpyrrole-2,5-dione Chemical compound O=C1C(C)=CC(=O)N1C1=CC=CC=C1 QAVUFFJVZGZJMO-UHFFFAOYSA-N 0.000 description 1
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical class OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- YMOONIIMQBGTDU-VOTSOKGWSA-N [(e)-2-bromoethenyl]benzene Chemical compound Br\C=C\C1=CC=CC=C1 YMOONIIMQBGTDU-VOTSOKGWSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- DAJSVUQLFFJUSX-UHFFFAOYSA-M sodium;dodecane-1-sulfonate Chemical compound [Na+].CCCCCCCCCCCCS([O-])(=O)=O DAJSVUQLFFJUSX-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Abstract
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は人工大理石用成形材料に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a molding material for artificial marble.
(従来の技術)
近年、天然大理石の代替品として有機、無機の素材を駆
使した人工大理石が製造されており、その代表的な製法
としてアクリル樹脂をベースとした方法、不飽和ポリエ
ステル樹脂をベースとした方法が公知である。(Conventional technology) In recent years, artificial marble has been manufactured using organic and inorganic materials as a substitute for natural marble. Typical manufacturing methods include methods based on acrylic resin and methods based on unsaturated polyester resin. This method is known.
不飽和ポリエステル樹脂を用いた人工大理石の成形方法
としては、−船釣な常温常圧注型法、加熱成形法および
加熱加圧成形法があるが、常温常圧注型法は生産性に劣
り、一方、加熱成形法は、クラックが生じやすく、その
ため熱可塑性樹脂を大量に添加し低収縮性を改善する方
法がとられていた。しかし、この方法によりクランク発
生は減少したが、成形物が不透明になる等の問題点があ
った。これらの問題に対し、特開昭63−118361
号にみられるような平均粒径を限定したポリスチレン等
の充填剤を含有した不飽和ポリエステル樹脂成形材料が
提案されているが、耐熱性の問題および表面光沢に欠け
る等の問題があった。There are three methods for molding artificial marble using unsaturated polyester resin: normal temperature and pressure casting, heat molding, and heat pressure molding, but the room temperature and pressure casting method is inferior in productivity; However, the heat molding method tends to cause cracks, and therefore a method has been used to improve low shrinkage by adding a large amount of thermoplastic resin. However, although this method reduced the occurrence of cranking, there were problems such as the molded product becoming opaque. For these problems, Japanese Patent Application Laid-Open No. 63-118361
An unsaturated polyester resin molding material containing a filler such as polystyrene with a limited average particle size has been proposed, as shown in No. 1, but there were problems such as heat resistance and lack of surface gloss.
(発明が解決しようとする課題)
本発明は、加熱成形が可能で、半透明で表面光沢があり
、そりや歪みのない優れた外観を有し、耐熱性の良い人
工大理石を得るための、大量生産可能な人工大理石用成
形材料を提供することを目的とする。(Problems to be Solved by the Invention) The present invention aims to obtain artificial marble that can be heat-formed, has a translucent and glossy surface, has an excellent appearance without warping or distortion, and has good heat resistance. The purpose is to provide a molding material for artificial marble that can be mass-produced.
(課題を解決するための手段)
すなわち本発明は、不飽和ポリエステル樹脂、この不飽
和ポリエステル樹脂100重量部に対して30〜300
重量部の水酸化アルミニウム、3〜50重量部のN−置
換マレイミドホモポリマー、および硬化剤を含有する人
工大理石用成形材料を提供するものである。(Means for Solving the Problems) That is, the present invention provides an unsaturated polyester resin, and 30 to 300 parts by weight per 100 parts by weight of this unsaturated polyester resin.
The present invention provides a molding material for artificial marble containing parts by weight of aluminum hydroxide, 3 to 50 parts by weight of an N-substituted maleimide homopolymer, and a hardening agent.
本発明における不飽和ポリエステル樹脂とは、α、β−
不飽和酸、必要に応じてさらに芳香族ジカルボン酸また
は飽和脂肪族ジカルボン酸と、多価アルコールとを例え
ば180℃〜250℃で縮合反応させ、これに他の単量
体を混合して得られる粘稠な液体である。The unsaturated polyester resin in the present invention refers to α, β-
Obtained by condensing an unsaturated acid, optionally an aromatic dicarboxylic acid or a saturated aliphatic dicarboxylic acid, and a polyhydric alcohol at, for example, 180°C to 250°C, and mixing other monomers with the condensation reaction. It is a viscous liquid.
α、β−不飽和酸としては、マレイン酸、無水マレイン
酸、フマル酸、イタコン酸、シトラコン酸等を挙げるこ
とができ、必要に応じて2種以上混合して用いることが
できる。必要に応じて用いられる芳香族ジカルボン酸、
または飽和脂肪族ジカルボン酸としては、フタル酸、無
水フタル酸、ハロゲン化無水フタル酸、イソフタル酸、
テレフタル酸、テトラヒドロフタル酸、3,6−ニンド
メチレンテトラヒドロフタル酸、コハク酸、アゼライン
酸、アジピン酸、グルタル酸、ピメリン酸、セパチン酸
等が挙げられる。Examples of the α,β-unsaturated acids include maleic acid, maleic anhydride, fumaric acid, itaconic acid, and citraconic acid, and two or more of them can be used as a mixture if necessary. aromatic dicarboxylic acid used as necessary;
Or saturated aliphatic dicarboxylic acids include phthalic acid, phthalic anhydride, halogenated phthalic anhydride, isophthalic acid,
Examples include terephthalic acid, tetrahydrophthalic acid, 3,6-nindomethylenetetrahydrophthalic acid, succinic acid, azelaic acid, adipic acid, glutaric acid, pimelic acid, and cepatic acid.
また多価アルコールとしては、エチレングリコール、ジ
エチレングリコール、トリエチレングリコール、ポリエ
チレングリコール、プロピレングリコール、ジプロピレ
ングリコール、トリプロピレングリコール、ポリプロピ
レングリコール、I。Examples of polyhydric alcohols include ethylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, polypropylene glycol, and I.
3−ブチレングリコール、1,6−ヘキサンジオール、
ネオペンチルグリコール、水素化ヒスフェノールA、ビ
スフェノールAのエチレンオキサイドやプロピレンオキ
サイドの付加物等を挙げることができる。3-butylene glycol, 1,6-hexanediol,
Examples include neopentyl glycol, hydrogenated hisphenol A, and adducts of bisphenol A with ethylene oxide and propylene oxide.
不飽和ポリエステル樹脂は、1種に限定するものではな
く、2種以上の併用も可能である。The unsaturated polyester resin is not limited to one type, and two or more types can be used in combination.
他の単量体としては、例えば、スチレン、ハロゲン化ス
チレン、α−メチルスチレン、ビニルトルエン、ジビニ
ルベンゼン、ジアリルフタレート、ジアリルフタレート
プレポリマー、クロロスチレン、ジクロロスチレン、ブ
ロモスチレン、ジプロモスチレン、ジアリルベンゼンホ
スホネート、ジアリルアリールホスフィン酸エステル、
アクリル酸エステル類、メタクリル酸エステル類、トリ
アリルシアヌレート、トリブロモフェノールアリルエー
テル、N−置換マレイミド類などが用いられる。これら
の他の単量体は1種に限定するものではな(,2種以上
の併用も可能である。Other monomers include, for example, styrene, halogenated styrene, α-methylstyrene, vinyltoluene, divinylbenzene, diallyl phthalate, diallyl phthalate prepolymer, chlorostyrene, dichlorostyrene, bromostyrene, dipromostyrene, diallylbenzene. Phosphonates, diallylaryl phosphinic acid esters,
Acrylic esters, methacrylic esters, triallyl cyanurate, tribromophenol allyl ether, N-substituted maleimides, and the like are used. These other monomers are not limited to one type (although two or more types can also be used in combination).
本発明においてN−置換マレイミドホモポリマーを構成
するN−置換マレイミド化合物は、下記−量大(1)で
表すことができる。In the present invention, the N-substituted maleimide compound constituting the N-substituted maleimide homopolymer can be represented by the following large amount (1).
\
It NR3(1)
/
(式中R1及びRtはそれぞれ水素原子、ハロゲン原子
又はメチル基を表し、R3は炭素数1−18の直鎖又は
分校アルキル基、炭素数3〜12のシクロアルキル基、
炭素数3〜12のアルキル置換シクロアルキル基、炭素
数6〜18のアリール基又はアラルキル基を表す)。\ It NR3(1) / (In the formula, R1 and Rt each represent a hydrogen atom, a halogen atom, or a methyl group, and R3 is a straight chain or branched alkyl group having 1 to 18 carbon atoms, or a cycloalkyl group having 3 to 12 carbon atoms. ,
represents an alkyl-substituted cycloalkyl group having 3 to 12 carbon atoms, an aryl group having 6 to 18 carbon atoms, or an aralkyl group).
前記N−置換マレイミド化合物としては、例えば、N−
メチルマレイミド、N−エチルマレイミド、N−n−プ
ロピルマレイミド、N−イソプロピルマレイミド、N−
n−ブチルマレイミド、N5ec−ブチルマレイミド、
N−n−へキシルマレイミド、N−シクロへキシルマレ
イミド、N−2−メチルシクロへキシルマレイミド、N
−2−エチルへキシルマレイミド、N−デシルマレイミ
ド、N−ドデシルマレイミド、N−シクロドデシルマレ
イミド、N−オクタデシルマレイミド、Nフェニルマレ
イミド、N−2−メチルフェニルマレイミド、N−4−
イソプロピルフェニルマレイミド、N−2,4−ジメチ
ルフヱニルマレイミド、N−ベンジルマレイミド、N−
メチル−αメチルマレイミド、N−フェニル−α−メチ
ルマレイミド、N−フェニル−α−クロロマレイミド、
N−フェニル−α、β−ジメチルマレイミド等を好まし
く挙げることができる。As the N-substituted maleimide compound, for example, N-
Methylmaleimide, N-ethylmaleimide, N-n-propylmaleimide, N-isopropylmaleimide, N-
n-butylmaleimide, N5ec-butylmaleimide,
N-n-hexylmaleimide, N-cyclohexylmaleimide, N-2-methylcyclohexylmaleimide, N
-2-Ethylhexylmaleimide, N-decylmaleimide, N-dodecylmaleimide, N-cyclododecylmaleimide, N-octadecylmaleimide, N-phenylmaleimide, N-2-methylphenylmaleimide, N-4-
Isopropylphenylmaleimide, N-2,4-dimethylphenylmaleimide, N-benzylmaleimide, N-
Methyl-α-methylmaleimide, N-phenyl-α-methylmaleimide, N-phenyl-α-chloromaleimide,
Preferred examples include N-phenyl-α, β-dimethylmaleimide.
本発明において、N−置換マレイミド化合物を重合させ
てN−置換マレイミドホモポリマーを製造するには、前
記N−置換マレイミド化合物を重合開始剤の存在下、公
知の懸濁重合、溶液重合、乳化重合、又は塊状重合等に
より重合させて得ることができる。具体的には、例えば
重合温度0〜120℃、特に好ましくは40〜100℃
の範囲、重合時間3〜12時間の範囲で重合させること
が望ましく、重合開始剤としては、公知の有機過酸化物
又はアゾ化合物等を用いることができる。該重合開始剤
の使用量は、N−置換マレイミド化合物に対して、0.
01〜5重量%の範囲であることが望ましい。また得ら
れるN−置換マレイミドホモポリマーの分子量は、特に
制限はないが、数平均分子量i、ooo−ioo、oo
oの範囲が好ましい。前記数平均分子量は、メルカプタ
ン類等の重合調整剤を重合の際に添加することにより調
整することができる。In the present invention, in order to polymerize an N-substituted maleimide compound to produce an N-substituted maleimide homopolymer, the N-substituted maleimide compound is subjected to known suspension polymerization, solution polymerization, or emulsion polymerization in the presence of a polymerization initiator. Alternatively, it can be obtained by polymerization such as bulk polymerization. Specifically, for example, the polymerization temperature is 0 to 120°C, particularly preferably 40 to 100°C.
It is desirable to carry out the polymerization within the range of 3 to 12 hours, and known organic peroxides or azo compounds can be used as the polymerization initiator. The amount of the polymerization initiator used is 0.0000000000 with respect to the N-substituted maleimide compound.
It is desirable that the amount is in the range of 0.01 to 5% by weight. The molecular weight of the obtained N-substituted maleimide homopolymer is not particularly limited, but the number average molecular weight is i, ooo-ioo, oo
A range of o is preferred. The number average molecular weight can be adjusted by adding a polymerization regulator such as mercaptans during polymerization.
本発明に用いられる水酸化アルミニウムは例えば市販品
としては昭和軽金属■製のハイシライトH310,32
0がある。無機充填材として水酸化アルミニウムを用い
ることにより、天然大理石類似の重厚な半透明感が得ら
れる。樹脂組成物へ水酸化アルミニウムを添加する場合
、その添加工程の前後あるいは同時に、必要に応じて本
発明の効果を阻害しない範囲の各種充填材、重合禁止剤
、内部離型剤、増結剤、可塑剤、難燃剤および繊維状の
補強剤などを加えることも可能である。The aluminum hydroxide used in the present invention is, for example, a commercially available product, Hisilite H310, 32 manufactured by Showa Light Metal ■.
There is 0. By using aluminum hydroxide as an inorganic filler, a deep translucent feel similar to natural marble can be obtained. When aluminum hydroxide is added to the resin composition, various fillers, polymerization inhibitors, internal mold release agents, binders, and plasticizers may be added before, after, or at the same time as necessary to the extent that the effects of the present invention are not impaired. It is also possible to add additives, flame retardants and fibrous reinforcing agents.
水酸化アルミニウムと併用が可能な他の充填材としては
例えば、水酸化マグネシウム、タルク、クレー、シリカ
、ケイ酸カルシウム、アルミナ、石英、ガラスパウダー
などが適当である。重合禁止剤としては、例えばハイド
ロキノン、ベンゾキノン、t−ブチルカテコールなどが
好ましく挙げられる。内部離型剤としては、例えばステ
アリン酸、ステアリン酸亜鉛などが使用できる。増粘剤
としては、例えば水酸化マグネシウム、水酸化カルシウ
ムなどが挙げられる。繊維状補強剤としてはガラス繊維
、アルミナウィスカー、アラミド繊維などが挙げられる
。Other suitable fillers that can be used in combination with aluminum hydroxide include, for example, magnesium hydroxide, talc, clay, silica, calcium silicate, alumina, quartz, and glass powder. Preferred examples of the polymerization inhibitor include hydroquinone, benzoquinone, and t-butylcatechol. As the internal mold release agent, for example, stearic acid, zinc stearate, etc. can be used. Examples of thickeners include magnesium hydroxide and calcium hydroxide. Examples of the fibrous reinforcing agent include glass fiber, alumina whiskers, and aramid fiber.
不飽和ポリエステル樹脂、N−置換マレイミドホモポリ
マー、水酸化アルミニウムおよび硬化剤の配合比は制限
されるものではないが、混合物の分散性、成形物の低収
縮化および外観上から不飽和ポリエステル樹脂100重
量部に対して、N−置換マレイミドホモポリマー3〜5
0重量部、水酸化アルミニウム30〜300重量部、硬
化剤1〜3重量部の範囲が好ましい。N−置換マレイミ
ドホモポリマーの割合が3重量部未満では成形時に著し
く収縮する。また50重量部を超えると外観上好ましく
ない。The blending ratio of the unsaturated polyester resin, N-substituted maleimide homopolymer, aluminum hydroxide, and curing agent is not limited, but from the viewpoint of dispersibility of the mixture, low shrinkage of the molded product, and appearance, the unsaturated polyester resin 100 3 to 5 parts by weight of N-substituted maleimide homopolymer
The preferred range is 0 parts by weight, 30 to 300 parts by weight of aluminum hydroxide, and 1 to 3 parts by weight of the curing agent. If the proportion of the N-substituted maleimide homopolymer is less than 3 parts by weight, significant shrinkage occurs during molding. Moreover, if it exceeds 50 parts by weight, the appearance is unfavorable.
水酸化アルミニウムの割合が30重量部未満では、成形
硬化時の収縮が大きくなり、得られる硬化成形物は歪み
を生じやすい。また300重量部を超えると水酸化アル
ミニウムの分散時の作業性の低下および得られる硬化成
形物の透明性が損なわれることがある。If the proportion of aluminum hydroxide is less than 30 parts by weight, shrinkage during molding and curing increases, and the resulting cured molded product is likely to be distorted. If the amount exceeds 300 parts by weight, the workability during dispersion of aluminum hydroxide may be reduced and the transparency of the resulting cured molded product may be impaired.
本発明に用いられる硬化剤としては、例えばベンゾイル
ペルオキシド、メチルエチルケトンペルオキシド、ラウ
ロイルペルオキシド、ビス−(4−プチルシクロヘキシ
ル)ペルオキシジカーボネート、t−ブチルペルオキシ
ベンゾエートなどの通常のものを使用することができ、
これらの1種または2種以上を用いることができる。As the curing agent used in the present invention, common ones such as benzoyl peroxide, methyl ethyl ketone peroxide, lauroyl peroxide, bis-(4-butylcyclohexyl) peroxydicarbonate, and t-butyl peroxybenzoate can be used.
One or more of these can be used.
本発明の人工大理石用成形材料の成形法としては、加熱
加圧成形法を含む加熱成形法であり、不飽和ポリエステ
ル樹脂、水酸化アルミニウム、N−置換マレイミドホモ
ポリマーおよび硬化剤を配合した組成物を60〜160
℃に加熱した合せ金型内や押出機で成形硬化させれば良
い。The molding method for the molding material for artificial marble of the present invention is a heat molding method including a hot pressure molding method, and a composition containing an unsaturated polyester resin, aluminum hydroxide, an N-substituted maleimide homopolymer, and a curing agent. 60-160
It may be molded and hardened in a molding die heated to ℃ or in an extruder.
(発明の効果)
本発明の人工大理石用成形材料を用いれば、前記に特定
した4成分を含有するので、大量生産が可能で、半透明
で表面に光沢感があり、線収縮率が小さく、そりや歪み
のない、しまった感じの質感を与える耐熱性の良い人工
大理石成形品が得られる。(Effects of the invention) If the molding material for artificial marble of the present invention is used, it contains the four components specified above, so mass production is possible, it is translucent, has a glossy surface, has a small linear shrinkage rate, A molded artificial marble product with good heat resistance and a solid texture without warping or distortion can be obtained.
(実施例) 以下、実施例に基づき本発明を具体的に説明する。(Example) Hereinafter, the present invention will be specifically explained based on Examples.
参考例I N−シクロへキシルマレイミド重合体の調製
撹拌機、温度計、窒素ガス導入管及びジムロート冷却管
を備えた4つロフラスコに、部分けん化ポリビニルアル
コール1部、ラウリルスルホン酸ナトリウ去1部及び脱
イオン水400部を仕込み溶解させた。次に、N−シク
ロへキシルマレイミド100部をメチルエチルケトン1
00部に溶解させた溶液とラウリルメルカプタン0.5
部とを仕込み撹拌下に懸濁溶液とした。次に重合開始剤
としてジベンゾイルペルオキシド1.0部をメチルエチ
ルケトン5部に溶解し、前記懸濁溶液に添加した後、系
内温度を80℃に昇温させ重合を開始した。8時間撹拌
を続けた後、室温まで冷却し、懸濁液を濾過、水洗し、
その後、真空加熱乾燥を行い、N−シクロヘキシルマレ
イミドホモポリマーを得た。Reference Example I Preparation of N-cyclohexylmaleimide Polymer In a four-bottle flask equipped with a stirrer, a thermometer, a nitrogen gas inlet tube, and a Dimroth condenser, 1 part of partially saponified polyvinyl alcohol, 1 part of sodium lauryl sulfonate, and 400 parts of deionized water was charged and dissolved. Next, 100 parts of N-cyclohexylmaleimide was added to 1 part of methyl ethyl ketone.
00 parts solution and lauryl mercaptan 0.5 parts
A suspension solution was prepared under stirring. Next, 1.0 part of dibenzoyl peroxide as a polymerization initiator was dissolved in 5 parts of methyl ethyl ketone and added to the suspension solution, and then the temperature inside the system was raised to 80° C. to initiate polymerization. After continuing stirring for 8 hours, it was cooled to room temperature, the suspension was filtered, washed with water,
Thereafter, vacuum drying was performed to obtain an N-cyclohexylmaleimide homopolymer.
収量は86部であり、数平均分子量は18,000であ
った。The yield was 86 parts, and the number average molecular weight was 18,000.
参考例2 N−フェニルマレイミドホモポリマーの調製
N−シクロへキシルマレイミドの代わりにNフェニルマ
レイミドを用いた以外は、参考例1と同様な方法により
数平均分子量21,000のN−フェニルマレイミドホ
モポリマーを得た。Reference Example 2 Preparation of N-phenylmaleimide homopolymer N-phenylmaleimide homopolymer having a number average molecular weight of 21,000 was prepared in the same manner as in Reference Example 1, except that N-phenylmaleimide was used instead of N-cyclohexylmaleimide. I got it.
参考例3 N−ベンジルマレイミドホモポリマーの調製
N−シクロへキシルマレイミドの代わりにN−ペンジル
マレイミドを用いた以外は、参考例1と同様な方法によ
り数平均分子量30,000のN−ベンジルマレイミド
ホモポリマーを得た。Reference Example 3 Preparation of N-benzylmaleimide homopolymer N-benzylmaleimide with a number average molecular weight of 30,000 was prepared in the same manner as in Reference Example 1, except that N-penzylmaleimide was used instead of N-cyclohexylmaleimide. A homopolymer was obtained.
参考例4 N−ドデシルマレイミドホモポリマーの調製
N−シクロへキシルマレイミドの代わりにN−ドデシル
マレイミドを用いた以外は、参考例1と同様な方法によ
り数平均分子量52.000ON−ドデシルマレイミド
ホモポリマーを得た。Reference Example 4 Preparation of N-dodecylmaleimide homopolymer A N-dodecylmaleimide homopolymer with a number average molecular weight of 52.000 was prepared in the same manner as in Reference Example 1, except that N-dodecylmaleimide was used instead of N-cyclohexylmaleimide. Obtained.
実施例1〜5
不飽和ポリエステル樹脂(日本ユビカー社製、商品名:
ユビカ6500、イソ系)、水酸化アルミニウム(昭和
軽金属社製、商品名ハイシライトH310)および各種
N−置換マレイミドホモポリマーをデシルバーで混練し
て、成形材料を得た。Examples 1 to 5 Unsaturated polyester resin (manufactured by Nippon Ubicar Co., Ltd., product name:
Yuvika 6500 (iso-based), aluminum hydroxide (manufactured by Showa Light Metal Co., Ltd., trade name Hisilite H310), and various N-substituted maleimide homopolymers were kneaded with DeSilver to obtain a molding material.
第1表に示す割合で配合した人工大理石用コンパウンド
をあらかじめ160 X 80 X 30 (ms)の
金型に注入し、60℃で15分間加熱成形し、得られた
人工大理石成形品の線収縮率および表面の光沢感の有無
を測定した。The artificial marble compound compounded in the proportions shown in Table 1 was injected into a 160 x 80 x 30 (ms) mold in advance and heated and molded at 60°C for 15 minutes. Linear shrinkage rate of the obtained artificial marble molded product The presence or absence of surface gloss was also measured.
配合、成形条件および得られた人工大理石の評価結果を
第1表に示した。Table 1 shows the formulation, molding conditions, and evaluation results of the obtained artificial marble.
比較例I
N−置換マレイミドホモポリマーの代わりに、粒径10
趨のスチレンポリマーを用い実施例1と同様に操作して
成形材料を得た。その後、実施例1と同様にして得られ
た人工大理石成形品の線収縮率および表面の光沢感の有
無を測定した。Comparative Example I Instead of N-substituted maleimide homopolymer, particle size 10
A molding material was obtained using the same styrene polymer and operating in the same manner as in Example 1. Thereafter, the linear shrinkage rate and the presence or absence of surface gloss of the artificial marble molded product obtained in the same manner as in Example 1 were measured.
配合、成形条件および得られた人工大理石の評価結果を
第1表に示した。Table 1 shows the formulation, molding conditions, and evaluation results of the obtained artificial marble.
第1表から判るように、比較例1のスチレンポリマーを
用いた成形材料に比べ、N−置換マレイミドホモポリマ
ーを用いた実施例1〜5では、線収縮率が小さく、光沢
感を有する優れた人工大理石用成形材料が得られる。As can be seen from Table 1, compared to the molding material using the styrene polymer of Comparative Example 1, Examples 1 to 5 using the N-substituted maleimide homopolymer had a smaller linear shrinkage rate and an excellent glossy appearance. A molding material for artificial marble is obtained.
Claims (1)
ル樹脂100重量部に対して30〜300重量部の水酸
化アルミニウム、3〜50重量部のN−置換マレイミド
ホモポリマー、および硬化剤を含有する人工大理石用成
形材料。(1) Artificial marble containing an unsaturated polyester resin, 30 to 300 parts by weight of aluminum hydroxide, 3 to 50 parts by weight of N-substituted maleimide homopolymer, and a hardening agent based on 100 parts by weight of the unsaturated polyester resin. molding material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4580390A JPH03250045A (en) | 1990-02-28 | 1990-02-28 | Molding material for artificial marble |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4580390A JPH03250045A (en) | 1990-02-28 | 1990-02-28 | Molding material for artificial marble |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03250045A true JPH03250045A (en) | 1991-11-07 |
Family
ID=12729427
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4580390A Pending JPH03250045A (en) | 1990-02-28 | 1990-02-28 | Molding material for artificial marble |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03250045A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0863939A4 (en) * | 1995-09-13 | 2001-06-27 | Mohammed W Katoot | Novel polymer additives for forming objects |
-
1990
- 1990-02-28 JP JP4580390A patent/JPH03250045A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0863939A4 (en) * | 1995-09-13 | 2001-06-27 | Mohammed W Katoot | Novel polymer additives for forming objects |
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