JPH03243316A - Integrate transfer-and injection-molding machine - Google Patents

Abstract

PURPOSE:To reduce the number of parts and enhance space efficiency and productivity by a method wherein a function, which allows transfer-mold molten resin in a low pressure region, and a function, which allows to injection-mold plasticized molten resin in a high pressure region, are possessed in the molding machine concerned. CONSTITUTION:The molding process of the molding machine concerned consists of two stages or transfer molding process and injection molding process, both of which are carried out continuously or concretely performed by filling resin in the space, which is newly formed by slightly enlarging a mold cavity just after the molding at first stage, for molding at second stage. A mold consists mainly of a top force 311, a bottom force 312, a vertically movable core 313 and horizontally movable cores 315. Resin 12 for transfer molding is preheated up to a temperature not allowing to flow and, after that, introduced under molten state through a transferring port 13 into a mold cavity by being pressed with lowering transferring plunger 11 so as to be filled in the cavity for molding. After the volume of the mold cavity is enlarged by vertically and horizontally sliding the cores, resin for injection molding is injected by contacting a nozzle head part 21 with an an injection port 23 in the mold cavity so as to be filled in the cavity for molding. By carrying out both the transfer molding process and injection molding process in two continuous stages, a structural body, in which different kinds of functions are compounded, is obtained.

Description

[Detailed description of the invention] [! Fields of use on E-chestnut] The first layer is formed with a molded body of guidance and control, and the second layer is a two-layer IFI that combines functions with different functions such as control and control and excellent tactility. This invention relates to an integrated transfer/injection molding machine that is fully equipped with low-pressure injection and high-pressure injection functions suitable for obtaining integrated molded products.

[Conventional technology]

Conventionally, transfer fs molding machines have been widely used as molding machines for sealing semiconductor integrated circuits.

This is 8i:Iis for f & string! This is an example in which a transfer molding machine is used to seal aluminum M (long diameter: 20 μm) under low pressure into a stock that is desired to be deformed or to form a carbon layer with each other, and is used as a single shingle bottom shape. It has been used extensively.

Also, magnetic tape cassette cases.

Injection molding machines have traditionally been widely used for molding things such as TV back covers and camera bodies. These are examples of machines used as high-volume bottom molding machines, and most injection molding machines are used as single-a consumption machines.

However, the composite function molded product 1 is made of Japanese cypress, or is made of two-color molding or two-layer molding using different colored side fat or different colored resin like the key top of Type 2 Ita.
A molding machine that can be obtained is used. For example, 脣fair 1-2
4052 (May 10, 1999), which is a machine that performs injection molding using two types of resin simultaneously in one mold cavity.

This is a molding machine with two heating cylinders, and the injection pressure fluctuation range is not determined separately, but it is equipped with two normal injection acid type fIA functions, and is suitable for the purpose of two-layer molding. is considered to be a technical benefit for a favorable individual.

However, until now, there has been no molding machine in the world that has both a transfer molding function for molding under low pressure and an injection molding function for molding under high pressure.

[Problem to be solved by the invention]

Both the transfer molding machine and the injection molding machine in the above-mentioned conventional technology are mainly used for single-function molding, and are limited to transfer molding under low pressure or injection molding under high pressure. Ta.

The purpose of the present invention can only be achieved by using a rudder that combines low-pressure molding and high-pressure molding.

In other words, it is an object of the present invention to provide an integrated transfer/injection molding machine that has the ability to transfer-mold molten resin in a low-pressure region and the abrasion ability to injection-mold recirculated molten resin in a high-pressure region. purpose.

More specifically, the transfer molding function can control the transfer pressure within the range of 1 to 3 cans α, and the injection pressure can be adjusted to 25 to 5oQMpa.
It has an injection molding function that can be controlled within the range of What you get is an integrated transfer/injection molding machine with Ik% imitation.

One of the purposes of using this molding machine is, for example, to make ultra-thin metal plates (20~
200μ Horse) In order to insert mold the lead frame and optical path into the synthetic resin individually or simultaneously without deformation or contact, we use a molten resin mainly made of thermosetting resin.
Transfer molding of LF resin under low pressure is an essential requirement, and in order to finish the molded product as an electronic circuit board or a phantom body, it is necessary to transfer and mold the LF resin under low pressure. Since it is essential to injection mold resin under high pressure, the present invention provides a transfer/injection body molding machine that satisfies these two essential requirements.

[Means to solve the problem]

This is a newly developed integrated transfer/injection molding machine that combines molding functions under low pressure and high pressure.

The capacity of the molding machine is shown in Table 1.

1 & [Molding Machine Power] Figure 1 shows the basic structure of a transfer/injection molding machine.

Is this molding machine portable? S molding unit 1. Injection molding unit 2. From the main parts of mold unit 5 and m pongee unit 40 *
g, control/display unit as ancillary equipment), ffi@
This equipment consists of a heating medium/refrigerant merchandising system unit for temperature adjustment, a molded product removal device, a degreased dry wire supply system unit, etc.

As shown in Table 1, the steering force of this transfer e injection integral bottom ridge is as follows:
00 MPG g) Something with steering power, pressure turn I in molding type:! The files are as shown in 1PI2Ko. When the resin tablet 12 for transfer molding is transferred into the mold by the transfer plunger 11 at the time of opening t when the mold clamping is completed, the resin pressure increases from the time when the light weight of the molten resin starts ts 2), and the transfer pressure is further increased. After the joint pile was completed, the fluid solidification work was completed, and the mold cavity was constructed by Wakachi Sumika K (b~'
After step s), continue injection molding using injection molding fat.At this time, #injection molding bath melting @ light weight starts in the mold, and the resin pressure in the mold is Rising to 94 yuan
After the mold is opened, the mold is opened, and the molded product is taken out.The series of molding processes is completed.

The steering force of the transfer φ injection pressure at this time is as described above, but this molding machine has an injection pressure cuff 't Y O in the range of 8≦h/c≦50 for the positive pressure. , a pressure difference is provided, and the molding is performed continuously in two stages.

Furthermore, the mold for the acid type is of a variable cavity volume type. .

In other words, after the first step of transfer molding, the mold unit has a mold unit that allows the cavity to be slightly enlarged three-dimensionally in order to provide a space for the resin to be injected.

Since molding is to be carried out continuously and in a short time, and because it is important to reduce residual clearance in order to obtain high-quality molded products, the mold temperature should be set within the I@ range shown in Table 1. A bath was installed to control the temperature difference within the cabinet within the range of Ω to 50'C.

The applied W resin can be transfer molded and injection molded [j
Especially if it is l? 1iXl@ is not something to be done! 1
However, numerically speaking, a thermosetting resin or a composite material thereof is mainly used for transfer fs molding, and a thermosetting MIIi side resin or a composite material thereof is mainly used for injection molding.

[Effect]

The operation of the present invention will be briefly explained.

Since this is a molding machine that continuously performs transfer molding and injection molding in two stages, firstly, it is possible to mold transmission media type transverse ratio circuit plastic bodies. In other words, the transmission medium of electric value, 9th number, and energy energy is installed in the mold, and the circuit is created by transfer molding! After molding the body, this was used as the inner layer, and the outer layer was continuously injection molded to form a bath bottom with a 4e # property and a steering wheel that was comfortable to the touch.

Second, a lip-shaped conductive circuit body is formed by injection molding using a four-layer composite material, and then transfer molding is performed using a polymer elastomer to improve insulation and sensitivity. By imparting wear such as iLK*, an intermittent structure can be obtained.

Fifth, the electrical temporary shield material is formed by injection molding using a durable composite material, and then a two-layer structure with excellent insulation and feel is provided by transfer molding. The electromagnetic wave shield Reishaku body is obtained.

In this way, the present invention provides a comprehensive IF! This is an integrated transfer/injection molding machine that can mold corpses.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to screen '4I.

First, the transfer/injection integrated molding machine of the present invention! i! , 15. This is a diagram showing the schematic structure of the kite-shaped building.

The main parts of this molding machine are: transfer molding unit 1, 2
injection molding unit, 5 mold, 4 mold clamping unit, 5
6 resin tablet heating devices, and 6 control/display system units. The above-mentioned improvements (not shown) such as the quadrangular temperature control system unit are added as incidental equipment.

Next, the molding process of the molding machine of the present invention is shown in Figure 4. The advantage of this molding process is that the transfer molding and injection molding processes are performed continuously on the 2R floor, and the mold cavity is 31! It is a method in which the molding is slightly expanded to one stage, Naotoshi, and 82 stages of molding are performed in the newly created space to fill it with resin.

The example shown in FIG. 4 shows an example of insert molding of a transmission medium, and if an insert is not required, the process will be performed after mold clamping.

Furthermore, the order of transfer molding and injection molding can be arbitrarily set depending on the desired molded product.

I will now explain the variable cavity volume type.

Figures 5 to 7 show the mold structure and operating mechanism.

The violet-shaped part is the upper type 511. Lower mold 512. It is composed of a vertically movable core 515 and a pressed stone movable core 315. In addition to this, there is a drive unit for vertical movement)
514 and drive units 521 and 522 for movement in the left stone direction. Also, heat W & flow #M for mold temperature adjustment
! (not shown) is provided as a matter of course.

Next, the molding process will be explained.

Figure 5 shows the transfer molding state. Regarding the mold temperature and transfer molding pressure at this time.

As described in Table 1.

Resins that can be used for transfer molding include epoxy atheroma,
Thermosetting resins such as polyimide mercury, phenol gR shield, unsaturated polyester resin, Jeep Rilphtale) or 1 tadiene to styrene elastomer, ethylene to getadiene yarn elastomer.

Modified gruel or the like can be used.

When proceeding to the injection molding process, as shown in step 6-, the vertically movable core 515 is slid downward by its drive unit 514 to expand the space in the vertical direction of the mold cavity, and to expand the space in the horizontal direction. The movable core 315 is slid by its drive units 521 and 522,
Expand the space in the left and right direction of the mold cavity. Under this condition, the gR resin for injection molding was used, and the injection pressure shown in Table 1 was reached.
Injection molding is carried out under conditions of m°

The injection molding resins used at this time are polyphenylene sulfide (PPS), polyethylene terephthalate (CPET), polyether sulfone (pEs), and polyetherimide (FEZ).

Single materials such as polysulfone CPSF), polyetheretherketone (pEEK), fully aromatic cyan polyester, and a-crystalline polymers, or composite materials with non-porous fillers (e.g., quartz powder, glass fibers, *metallic fibers, etc.) These include ethylene to pyrene yarn elastomer, butadiene to styrene yarn elastomer, elastomer-modified resin, and the like.

In the first step of the molding, if Bk 12 for transfer molding, which has been shaped in advance into a tablet (K), is preheated before it is ready for use, and as shown in FIG. Then, the molten resin is introduced into the mold cavity through the transfer port 15, and then the molding is performed. Next, attach the mold cavity part to the sixth
As shown in the figure, by sliding it up and down and left and right as described above, the cavity volume is enlarged to ip1, and the molten emphysema Y is made into a star by enlarging the lf tumor for injection molding.
The atom part 21 is injected into the nozzle of the molding machine while in contact with the injection port 25, and the mold cavity is filled to perform molding. By performing these transfer molding and injection molding iiMt in two successive steps, a structure in which A-decoctions are combined can be obtained.

A specific example of a molded product obtained by the integrated transfer/injection molding machine of the present invention will now be described.

Molding Example 1 FIG. 8 shows an electric shield molded circuit electric body molded using the molded sheet of the present invention.

41 is an electrical or optical transmission medium, 42 is an epoxy resin molded housing containing quartz powder that has excellent electrical isolation properties, and 45 is a conductive thermal Molded from flexible composite material, xm
Is, a two-layer molded case with shielding capabilities.

Next, the molding process will be explained in detail using FIG. 11-1, FIG. 12, and FIG. First, the children's thin plate lead frame used as the transmission medium of the electric signal shown in Fig. 12 is connected to the lead frame shown in Fig. 5.
A quartz powder-containing epoxy resin tablet was placed in the mold cavity held at 50°C, preheated to 9Ω°C, and then transferred into a transfer molding cylinder for 12 years.
A circuit trenching structure is obtained by pressurizing with # and transferring the molten epoxy resin into the mold.

Next, after expanding the cavity volume using the method described in Section 6, a stainless steel ultra-fine fiber (If diameter f3pm) was used.
Polyphenylene sulfide 11 with 6wt p light term
The fat was melted in a plasticizing bath by an injection molding unit (FIG. 5, 2), and was poured into the mold cavity from the injection port 23 through the nozzle portion 21' to form a bottom shape. The resulting molded product! ! 11
Shown in prisoner (C). 41 is a metal thin plate lead frame for electrical signal transmission, 42 is an epoxy resin molded layer containing quartz powder,
45 is a polyphenylene sulfide 1/M resin molding layer containing stainless steel.

Molding Example 2 FIG. 9 shows a rig-shaped conductive body. Masu rope wire (IL diameter 50μ71%) including 1j A B
Injection molded into a mold cavity at 70°C using S11 resin.

Next, by the method described above, the transfer? 1 Tashien for S molding ~
Transfer molded using styrene thread elastomer material. In the obtained molded product, 51 is a lip-like conductive circuit, and 52 is an outer layer structure that has insulation properties and is 4dIl comfortable to the touch.

Bottom Shape Example 3 FIG. 10 shows a molded body with an electromagnetic shield and a two-layer structure molded using an uninvented molding machine.

This was molded using the same method as molding f112, using a spacer as an insert piece instead of the lip insert piece of the mold. Reference numeral 61 is a 4-layer acidic layer, and reference numeral 62 is an elastomer-based thorn layer with excellent visceral properties and feel.

〔Effect of the invention〕

By integrating transfer molding and injection molding, we have created a new ecological technology that allows the low-pressure molding process and high-pressure molding process to be performed in two stages.

In other words, since the two-layer Il body can be assembled all at once, a structure combining different functions can be obtained, which reduces the number of parts, improves space efficiency, and produces young fruits with the same level of raw mineral properties.

In addition, it is possible to omit the trouble of handling, milling, etc. even for parts that have no choice but to be formed into S-shaped shapes. Furthermore, the installation space has been reduced and pA Makoto is a one-person operation.

Moreover, the integral molding of the one-way modière for transmitting electric/optical signals and electric power energy, and the three-dimensional conductor circuit embedded electronic equipment housing 7'z is an effect that was first achieved by realizing the molding system of the present invention.

[Brief explanation of drawings]

Figure 1 is a conceptual diagram of the integrated transfer/injection molding machine, Figure 2 is the transfer pressure, injection pressure profile, Figure 5 is a view from Isoya for integrated transfer/injection molding, and Figure 4 is the transfer/injection molding machine. Process chart,
Figure m5 is a cross-sectional view of the mold for the upper electrode for transfer molding, Figure 6 is a cross-sectional view of the mold for the 11th molding process, Figure 7- is a view of the lower mold entering piece in the molding direction, and Figure 8 is the electric S modification. Figure 9 shows a molded circuit case with a shielding function, Figure 9 shows an electronic circuit housing with a lip-shaped conductive circuit, and Figure 10 shows a two-layer molded straight body with a TM wave shielding function. , FIG. 11 shows a thin metal plate lead frame. Transfer molding unit~2. Injection molding unicto spear 2 figures Time closing 4 figures Time 45 figures Scale 7 figures Frost 6 figures Almost 3 figures Punishment 10 figures

Claims (1)

[Scope of Claims] 1. An integrated transfer/injection molding machine characterized by having the function of transfer molding molten resin in a low pressure region and the function of injection molding plasticized molten resin in a high pressure region. 2. The plunger according to claim 1, which has a function of controlling the plunger pressure, speed, and resin temperature for transferring the molten resin, and a function of controlling the pressure, speed, and resin temperature for injecting the plasticized molten resin. Transfer/injection molding machine. 3. It has a transfer molding function that can control the transfer pressure within the range of 1 to 30 MPa and an injection molding function that can control the injection pressure within the range of 25 to 300 MPa, and the pressure difference is 0.8 to 50 MPa.
2. The integrated transfer/injection molding machine according to claim 1, characterized in that the molding machine is provided in a double range, and that a desired molded product can be obtained within the same mold. 4. The integrated transfer/injection molding machine according to claim 1, wherein the molding process is characterized in that the volume of the mold cavity can be varied during transfer molding in the first stage and transfer to injection molding in the second stage. 5. The resin for transfer molding is mainly a thermosetting resin suitable for low pressure molding, and the resin for injection molding is mainly a thermoplastic resin suitable for high pressure molding, and the mold temperature is 70 to 190°C in transfer molding. The range is 70 to 70 for injection molding.
2. The integrated transfer/injection molding according to claim 1, wherein the molding process is characterized in that the temperature is in the range of 220°C and the temperature difference is set in the range of 0 to 50°C. 6. The first layer of the molded product has one of the functions of a structure, electromagnetic shielding function, and conductive circuit function, and the second layer can easily provide an insulating function or a function rich in design and tactility. After the transfer and injection integral molding according to claim 1, the method can be carried out.