JPH0324271U - - Google Patents
Info
- Publication number
- JPH0324271U JPH0324271U JP8471389U JP8471389U JPH0324271U JP H0324271 U JPH0324271 U JP H0324271U JP 8471389 U JP8471389 U JP 8471389U JP 8471389 U JP8471389 U JP 8471389U JP H0324271 U JPH0324271 U JP H0324271U
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- jumper chip
- metal plates
- exposed
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 3
- 239000012212 insulator Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8471389U JPH0324271U (es) | 1989-07-18 | 1989-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8471389U JPH0324271U (es) | 1989-07-18 | 1989-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0324271U true JPH0324271U (es) | 1991-03-13 |
Family
ID=31633366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8471389U Pending JPH0324271U (es) | 1989-07-18 | 1989-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0324271U (es) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100818464B1 (ko) * | 2006-09-28 | 2008-04-01 | 삼성전기주식회사 | 표면 실장형 어레이 점퍼 |
| US10237991B2 (en) | 2016-11-29 | 2019-03-19 | Molex, Llc | Electronic component |
| KR102071973B1 (ko) * | 2019-07-04 | 2020-01-31 | 케이제이시스템주식회사 | 버스 바 조립체 |
| US10636549B2 (en) | 2016-06-10 | 2020-04-28 | Molex, Llc | Electronic component |
| US11037895B2 (en) | 2018-04-24 | 2021-06-15 | Molex, Llc | Electronic component |
-
1989
- 1989-07-18 JP JP8471389U patent/JPH0324271U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100818464B1 (ko) * | 2006-09-28 | 2008-04-01 | 삼성전기주식회사 | 표면 실장형 어레이 점퍼 |
| US10636549B2 (en) | 2016-06-10 | 2020-04-28 | Molex, Llc | Electronic component |
| US10237991B2 (en) | 2016-11-29 | 2019-03-19 | Molex, Llc | Electronic component |
| US11037895B2 (en) | 2018-04-24 | 2021-06-15 | Molex, Llc | Electronic component |
| KR102071973B1 (ko) * | 2019-07-04 | 2020-01-31 | 케이제이시스템주식회사 | 버스 바 조립체 |