JPH03242543A - Moisture sensor - Google Patents

Moisture sensor

Info

Publication number
JPH03242543A
JPH03242543A JP3875490A JP3875490A JPH03242543A JP H03242543 A JPH03242543 A JP H03242543A JP 3875490 A JP3875490 A JP 3875490A JP 3875490 A JP3875490 A JP 3875490A JP H03242543 A JPH03242543 A JP H03242543A
Authority
JP
Japan
Prior art keywords
oxide particles
copper oxide
dispersed
silica
stirred
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3875490A
Other languages
Japanese (ja)
Inventor
Masahisa Ikejiri
昌久 池尻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP3875490A priority Critical patent/JPH03242543A/en
Publication of JPH03242543A publication Critical patent/JPH03242543A/en
Pending legal-status Critical Current

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  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)

Abstract

PURPOSE:To make a highly accurate sensor easy to use with a low resistance value at a low cost by using a silica film in which copper oxide particles are dispersed as moisture sensing film. CONSTITUTION:25ml of ethanol and 4ml of 0.02N hydrochloric acid are added to 50ml of tetraethoxysilane [Si(OC2H5)4] is stirred up for one hour to hydrolyze the tetraethoxysilance. Then, 10ml of glycerine and 13.5g of fine powder silica are added and stirred up for 30 min. Moreover, 23g of copper oxide particles are added and stirred up for 30 min. to make a silica sol in which the copper oxide particles are dispersed. A dip coating of the silica sol thus obtained is applied on an alumina substrate 1 having a comb-shaped electrode 2 formed thereon, dried at 100 deg.C for 10 min. and sintered at 450 deg.C for 30min. Thus, a silica film 3 in which the copper oxide particles are dispersed is formed to produce a moisture sensing film.

Description

【発明の詳細な説明】 [産業上の利用分野コ 本発明は、温度に対応して素子の電気的特性が変化する
ことにより湿度を検出する湿度センサに関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a humidity sensor that detects humidity by changing the electrical characteristics of an element in response to temperature.

[従来の技術] 近年、湿度計測、湿度制御を必要とする分野が増加し、
湿度センサの重要性が認められるようになった。
[Conventional technology] In recent years, the number of fields requiring humidity measurement and humidity control has increased.
The importance of humidity sensors is now recognized.

湿度に対応して素子の電気的特性が変化することにより
湿度を検出する湿度センサには、電解質系、金属系、高
分子系、セラミックス系等があり、それぞれいろいろな
系が研究されているが、現在実用化されているものは、
高分子系およびセラミックス系の湿度センサである。い
ずれも、素子に対する水の吸脱着により、素子の抵抗値
または静電容量が変化する性質を利用したものである。
Humidity sensors that detect humidity by changing the electrical characteristics of the element in response to humidity include electrolyte-based, metal-based, polymer-based, ceramic-based, etc., and various systems are being researched. , those currently in practical use are:
These are polymer-based and ceramic-based humidity sensors. All of these utilize the property that the resistance value or capacitance of the element changes due to adsorption and desorption of water to the element.

[N明が解決しようとする課題] しかし、従来の湿度センサは、抵抗値が高いため、精度
の良い温度計を製造するためには、高度な回路技術およ
び実装技術を必要とした。
[Problems that Nmei attempts to solve] However, since conventional humidity sensors have a high resistance value, advanced circuit technology and packaging technology are required to manufacture a thermometer with high accuracy.

そこで本発明はこのような問題点を解決するもので、そ
の目的とするところは、抵抗値の低い湿度センサを提供
するところにある。
The present invention is intended to solve these problems, and its purpose is to provide a humidity sensor with a low resistance value.

[課題を解決するための手段] 本発明の湿度センサは、酸化銅粒子を分散させたシリカ
膜を感温膜として用いることを特徴とする特 シリカ膜に酸化銅粒子を分散させることにより、  2
図より、本発明の湿度センサは、抵抗値が低く、抵抗値
の低い温度センサを得ることができる。    使いや
すいことがわかる。
[Means for Solving the Problems] The humidity sensor of the present invention is characterized in that a silica film in which copper oxide particles are dispersed is used as a temperature-sensitive film.By dispersing copper oxide particles in a special silica film, 2.
From the figure, the humidity sensor of the present invention has a low resistance value, and a temperature sensor with a low resistance value can be obtained. You will find it easy to use.

[実施例] テトラエトキシシラン(S 1(OCaHs)4) 5
0mlにエタノール25m1.0.02N塩酸4mlを
加え、1時間攪拌することによりテトラエトキシシラン
を加水分解した後、グリセリン10m1、微粉末シリカ
13.5gを加え、30分間攪拌し、さらに酸化銅粒子
23gを加え、30分間攪拌することにより、酸化銅粒
子を分散させたシリカゾルを作製した。Pt−Pd櫛形
電極をスクリーン印刷により形成したアルミナ基板上に
、このゾルをデイツプコーティングし、100 ’Cで
10分間乾燥し、450°Cで30分間焼結し、酸化銅
粒子を分散させたシリカ膜を形成した。
[Example] Tetraethoxysilane (S 1 (OCaHs) 4) 5
After adding 25 ml of ethanol and 4 ml of 0.02N hydrochloric acid to 0 ml and stirring for 1 hour to hydrolyze tetraethoxysilane, 10 ml of glycerin and 13.5 g of finely powdered silica were added and stirred for 30 minutes, followed by 23 g of copper oxide particles. was added and stirred for 30 minutes to produce a silica sol in which copper oxide particles were dispersed. This sol was dip-coated on an alumina substrate on which Pt-Pd comb-shaped electrodes were formed by screen printing, dried at 100'C for 10 minutes, and sintered at 450°C for 30 minutes to disperse copper oxide particles. A silica film was formed.

このようにして製作した湿度センサの斜視図を第1図に
示す、第1図において、1は基板、2は電極、3は酸化
銅粒子を分散させたシリカ膜である0本捏度センサの感
温特性を第2図に示す。第[発明の効果] 以上述べたように本発明の湿度センサは、酸化銅粒子を
分散させたシリカ膜を感湿膜として用いるので、抵抗値
が低いため、高度な回路技術および実装技術は必要なく
、使いやすい。したがって、底コスト、高精度な温度セ
ンサとして、湿度計測、湿度制御を必要とする分野に広
く応用することができる。
A perspective view of the humidity sensor manufactured in this way is shown in Figure 1. In Figure 1, 1 is a substrate, 2 is an electrode, and 3 is a silica film in which copper oxide particles are dispersed. The temperature-sensitive characteristics are shown in Figure 2. [Effects of the Invention] As described above, the humidity sensor of the present invention uses a silica film in which copper oxide particles are dispersed as a humidity sensitive film, so the resistance value is low, so advanced circuit technology and mounting technology are not required. Easy to use. Therefore, it can be widely applied as a low-cost, highly accurate temperature sensor to fields requiring humidity measurement and humidity control.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の湿度センサの斜視図。 1・・・基板 2・・・電極 3・・・酸化銅粒子を分散させたシリカ膜第2図は、本
発明の湿度センサの感湿特性図。 以上
FIG. 1 is a perspective view of the humidity sensor of the present invention. 1...Substrate 2...Electrode 3...Silica film in which copper oxide particles are dispersed FIG. 2 is a diagram showing the humidity sensitivity characteristics of the humidity sensor of the present invention. that's all

Claims (1)

【特許請求の範囲】[Claims] 酸化銅粒子を分散させたシリカ膜を感湿膜として用いる
ことを特徴とする湿度センサ。
A humidity sensor characterized in that a silica film in which copper oxide particles are dispersed is used as a moisture-sensitive film.
JP3875490A 1990-02-20 1990-02-20 Moisture sensor Pending JPH03242543A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3875490A JPH03242543A (en) 1990-02-20 1990-02-20 Moisture sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3875490A JPH03242543A (en) 1990-02-20 1990-02-20 Moisture sensor

Publications (1)

Publication Number Publication Date
JPH03242543A true JPH03242543A (en) 1991-10-29

Family

ID=12534080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3875490A Pending JPH03242543A (en) 1990-02-20 1990-02-20 Moisture sensor

Country Status (1)

Country Link
JP (1) JPH03242543A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100385037C (en) * 2005-11-22 2008-04-30 浙江大学 Method for preparing nano copper oxide on surface of SiO2

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100385037C (en) * 2005-11-22 2008-04-30 浙江大学 Method for preparing nano copper oxide on surface of SiO2

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