JPH03241789A - Ceramic multilayer substrate and manufacture thereof - Google Patents

Abstract

PURPOSE:To obtain an improved operation and effect by laminating a green tape where a conductive paste is formed on a hardened ceramic substrate after calcination. CONSTITUTION:A ceramic substrate 1 after calcination where a via hole 6 in that a conductive paste or a conductive substance is filled is formed is prepared, thus forming an insulation paste 7 in a specified pattern on a single surface or both surfaces of the ceramic substrate 1. Then, a ceramic green tape 2 is prepared, the via hole 6 is formed, a conductive paste 5 is formed on a single surface of the green tape 2 by printing, etc., for enabling the surface of the ceramic substrate 1 to face the surface where a conductive paste is formed and a green tape 2 to be laminated on a single surface or both surfaces of the ceramic substrate 1 before pressing and heating. For further multilayering, a green tape 3 where the via hole 6 is formed is superposed on the green tape 2 on the ceramic substrate 1 and pressing and heating are performed, thus eliminating failure between the hardened ceramic substrate 1 and the entire laminated green tape 2 and enabling productivity to be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a ceramic multilayer substrate and a method for manufacturing the same.

[Prior Art] Conventionally, as a manufacturing method for a ceramic multilayer board with excellent strength, a green tape is laminated on one side of a ceramic board that has been solidified after firing and has a conductive pattern formed on its surface.
After that, a conductive pattern is printed on the surface of the green tape,
Furthermore, a manufacturing method in which green tape is laminated has been reported (U.S. Pat. No. 4,645,552, U.S. Pat. No. 4.79).
9,984). However, with this method, the number of manufacturing steps increases because the green tape is pressed and fired each time it is layered. Since the conductor pattern on the solidified ceramic substrate protrudes from the surface of the ceramic substrate, unevenness occurs on the surface of the green tape to be laminated later,
It becomes difficult to refine the conductor pattern formed on the green tape. Furthermore, when laminating the first layer of green tape, if a defect occurs in the green tape, it cannot be replaced, and the entire green tape laminated with the solidified ceramic substrate becomes defective, reducing productivity. It was bad.

[Problems to be Solved by the Invention] The purpose of the present invention is to eliminate the above-mentioned drawbacks of the prior art, and to provide a new method for manufacturing a ceramic multilayer substrate that has not been known in the past. The purpose is to

[Means for Solving the Problems] The present invention has been made to solve the above-mentioned problems. (1) A method for manufacturing a ceramic multilayer substrate, characterized by comprising the following steps.

(a) First, a fired ceramic substrate is prepared in which via holes filled with a conductive paste or a conductive material are formed as necessary.

(b) Next, prepare a ceramic green tape and form a via hole.

(c) Forming a conductive paste in a predetermined pattern on at least one side of the green tape.

(d) Laminating the green tape with conductive paste formed on the surface of the ceramic substrate on one or both sides of the ceramic substrate.

(f) When laminating, apply pressure as necessary.

(f) In the (c) process, if the conductive paste is not formed on one side of the green tape, the conductive paste is formed on one side of the green tape, and in the (c) process, the conductive paste is applied to the via hole of the green tape. If the via holes are not filled with the conductive paste, the via holes are filled with the conductive paste and fired.

As another method for manufacturing a ceramic multilayer substrate, 2) a method for manufacturing a ceramic multilayer substrate characterized by having the following steps.

(a) First, a fired ceramic substrate is prepared in which via holes filled with a conductive paste or a conductive material are formed as necessary.

(b) Next, prepare a ceramic green tape and form a via hole.

(c) Forming a conductive paste in a predetermined pattern on at least one side of the green tape.

(d) The surface of the ceramic substrate is opposed to the surface of the green tape on which the conductive paste is formed, and the green tape is laminated on one or both surfaces of the ceramic substrate.

(f) When laminating, apply pressure as necessary.

(f) In the (c) process, if the conductive paste is not formed on one side of the green tape, the conductive paste is formed on one side of the green tape, and in the (c) process, the conductive paste is applied to the via hole of the green tape. Conductor 1 If the paste has not been filled, the via holes are filled with the conductor paste and fired.

(g) Furthermore, in the case of multilayering, the green tape with via holes formed thereon is stacked on top of the green tape on the ceramic substrate, and pressure is applied as necessary.

(H) A conductor paste for forming a conductor pattern and for filling via holes is formed on the green tape layered in the step (G).

(S) Repeat (G) and (H) according to the required number of layers.

(v) Pressure and fire the final ceramic substrate and green tape.

Furthermore, as another method for manufacturing a ceramic multilayer substrate, 3) Before laminating green tape on the ceramic substrate in the above two types of manufacturing methods for ceramic multilayer substrates,
A method for manufacturing a ceramic multilayer substrate, comprising laminating an insulating paste 2 that improves adhesiveness with a green tape on the ceramic substrate.

4) A method for manufacturing a ceramic multilayer substrate, comprising the following steps.

(a) First, a fired ceramic substrate is prepared in which via holes filled with a conductive paste or a conductive material are formed as necessary.

(b) An insulating paste is formed in a predetermined pattern on one or both sides of the ceramic substrate to improve the adhesion between the ceramic substrate and the green tape.

(c) forming a conductive paste in a predetermined pattern on the insulating paste on the ceramic substrate;

(d) Next, prepare ceramic green tape,
A via hole is formed in the green tape.

(f) Form a conductive paste on one side of the green tape if necessary, and fill via holes of the green tape with the conductive paste if necessary.

(f) The green tape is laminated so that the surface of the green tape on which conductive paste is not formed on one or both surfaces of the ceramic substrate faces the ceramic substrate.

(g) In the (f) step, if the formation of the conductive paste on the green tape and the filling of the conductive paste into the via hole are not performed, the formation and filling are performed.

(h) When laminating, pressurize and fire.

etc.

The present invention will be described in detail below with reference to the drawings.

FIG. 1 is a sectional view showing the basic structure of a multilayer ceramic substrate according to the present invention.

In Fig. 1, l is a solidified ceramic substrate, and the material is various ceramics, specifically alumina (A1.O,), beryllia, aluminum nitride (AI
N), magnesia (MgO), glass ceramics, etc. are commonly used, and among these, the strength is 88 to 99.
5% by weight alumina is preferable, and in terms of thermal conductivity it is better than AI.
N or beryllia is preferred.

2.3 is a green tape layer laminated on the ceramic substrate 1.

The green tape layers 2 and 3 can be made of various ceramics, specifically alumina, beryllia, AIN, MgO, glass ceramics, etc., and the firing temperature is preferably lower than that of the ceramic substrate 1. If the firing temperature of the green tape layers 2 and 3 is higher than that of the ceramic substrate 1, the ceramic substrate 1 will be deformed during firing, which is not preferable.

Therefore, the material of the ceramic substrate 1 is alumina, and the material of the green tape layers 2 and 3 is low-temperature firing borosilicate glass, alumina-glass, etc., which has a lower firing temperature than alumina.
A combination of titanium tin barium borate ceramics and alumina-non-vitreous additive ceramics is desirable.

5 Further, it is appropriate that the strength of the material of the ceramic substrate 1 is stronger than the material of the green tape layers 2 and 3;
．． If the material is almost the same as 3, use ceramic substrate 1.
It is necessary that the thickness of the green tape layer is thicker than that of the green tape layers 2 and 3.

4.5 is a conductive paste layer, and the conductive paste used is copper (Cu), silver (Ag), Ag-palladium (
Pd), gold (Au), platinum (pg), tungsten (W
), etc., as appropriate.

Next, a procedure for actually manufacturing a ceramic multilayer substrate according to the present invention will be explained.

(a) First, a fired ceramic substrate is prepared in which via holes 6 filled with a conductive paste or a conductive material are formed as necessary.

(b) An insulating paste 7 is formed in a predetermined pattern on one or both sides of the ceramic substrate 1 by a method such as printing.

6 (c) Next, prepare ceramic green tape 2,
Form a via hole.

(d) A conductive paste is formed on one side of the green tape 2 by a method such as printing.

(f) The green tape 2 is laminated on one or both sides of the ceramic substrate 1, with the surface of the ceramic substrate 1 facing the surface on which the conductive paste is formed.

(f) Apply pressure and heat as necessary when laminating.

(g) Forming a conductive paste on one side of the green tape 2 and filling the via holes of the green tape 2 with the conductive paste. Note that this step may be performed in step (d).

That is, this step may be performed simultaneously with the step (d) or after the lamination step (e). In addition, if further multilayering is not required, firing is performed immediately after step (g).

(h) In the case of further multi-layering, the green tape with via holes formed thereon is stacked on the green tape 2 on the ceramic substrate 1, and pressurized and heated as necessary.

(S) A conductor paste for forming a conductor pattern and filling via holes is formed on the green tape stacked in the step (H).

(J) Repeat (C) and (!I) according to the required number of layers.

(Le) Finally, pressurize, heat, and fire the ceramic substrate and green tape as necessary.

Incidentally, in the above steps (a) to (h), it is desirable to include step (0) in order to improve the adhesion between the ceramic substrate 1 and the green tape, but it can be omitted.

Next, a procedure for manufacturing another ceramic substrate according to the present invention will be explained.

(a) First, a fired ceramic substrate is prepared in which via holes filled with a conductive paste or a conductive material are formed as necessary.

(b) An insulating paste 7 is formed in a predetermined pattern on one or both sides of the ceramic substrate 1 by a method such as printing.

(c) A conductive paste 7 is formed on the insulating paste 7 on the ceramic substrate by a method such as printing.

(d) Next, a ceramic green tape 2 is prepared, and a pier hole is formed in this green tape 2.

(f) The green tape 2 is laminated on one or both sides of the ceramic substrate 1.

(f) Apply pressure and heat as necessary when laminating.

(g) Forming a conductive paste on one side of the green tape 2 and filling the via holes of the green tape 2 with the conductive paste. Note that this step may be performed in step (d).

That is, this step may be performed simultaneously with step (d), or may be performed after lamination and after step (v). If not further multilayered, 9. Fire immediately after this (g) step.

(h) In the case of further multi-layering, the green tape with via holes formed thereon is stacked on the green tape 2 on the ceramic substrate 1, and pressurized and heated as necessary.

(S) [H] Green tape 3 layered in the process
A conductive paste is formed thereon for a conductive pattern and for filling the peer holes.

(J) Repeat (J) and (R) according to the required number of layers.

(Le) Finally, pressurize, heat, and fire the ceramic substrate and green tape as necessary.

Next, a procedure for manufacturing another ceramic multilayer substrate according to the present invention will be explained.

(a) First, a fired ceramic substrate 1 of alumina or the like having via holes is prepared in advance.

(b) Next, prepare at least one piece of ceramic green tape as needed, form a via hole 6 in each piece, and use a method such as printing a conductor paste to fill the conductor pattern 4 and via hole 6. Formed on the green tape.

(c) The surface of the ceramic substrate 1 and the surface on which the conductive paste is formed are faced to each other, and the green tape is placed on the ceramic substrate. In order to further increase the number of layers, several more sheets of green tape coated with such a conductive paste are stacked, if necessary.

(d) The green tape stacked on the ceramic substrate (2) is laminated by applying pressure and heating as necessary, and is fired at around the firing temperature of the material of the green tape.

In addition, in the method for manufacturing several types of ceramic multilayer substrates according to the present invention described above, the pressure conditions are 1 to 500 kg/
cm2 is appropriate, and 20 to 500 kg/cm" is a desirable range. Also, the heating range is from room temperature (not heated) to 1
A range of 20°C is suitable.

Here, preferred materials for the green tape will be described below. In addition, below, % means weight %.

Green tape has inorganic components. Glass powder 40-90% Refractory filler 9.99-60% Oxidizing agent　　0.01~20% Consisting of

If the content of glass powder in the inorganic component is less than 40%, the adhesion to the ceramic substrate 1 will be poor, and a sufficiently dense sintered layer will not be formed, resulting in poor electrical properties, which is not preferable. On the other hand, if it exceeds 90%, the reactivity with conductors such as copper increases, which impairs the solder leakage of conductors such as copper, which is not preferable.

The refractory filler is added to improve beer strength for the conductor paste of the board, and if it is less than 9.99%, the beer strength will be poor, and if it is more than 60%, the sinterability will be poor.

Refractory fillers include alumina (Al2O3), zircon (ZrSiO4), and cordierite (Mg2A14).
S150+a), forsterite (Mg2Si04
A mixture of L silica (Si02) or alumina alone can be used.

The oxidizing agent added in the present invention has an oxygen concentration of about 10 pp.
It has the effect of oxidizing and removing the organic binder in the composition when baking in a non-oxidizing atmosphere of m or less to form a circuit board.
debinding effect).

The amount of the oxidizing agent added is preferably 0.01 to 20% by weight based on the inorganic component, which is the total amount of the glass powder and the refractory filler. If the amount of the oxidizing agent added is less than 0.01%, the effect of the addition will be small, while if it exceeds 20%, the withstand voltage characteristics of the board will decrease, and the effect of oxidation will be reduced when the wiring part of laminated conductors such as copper is fired. is undesirable because it is too strong and causes oxidation.

Oxidizing agents include CeO++, TiO□, Ba0z, Sn
O□, CaO2°v205 can be used, and CeO□ is particularly excellent.

The glass powder is: St023g~48% Al2O, 1~8% Mg00~lO% 3 CaO1~8% SrOO~l'5% BaO18~28% pbo~20% Zn
0 10-20% BJa
0.5-15% Ti0z+ZrO□
(1~7%LiaO+NazO+
It is preferable to have a composition of 200 to 5%. The reason is as follows.

When Sing is less than 38%, the dielectric constant of the sintered substrate becomes too large, and when Sing exceeds 48%, the sintering temperature becomes too high, both of which are unfavorable.

If the content of AlaOs is less than 1%, the moisture resistance of the sintered substrate will be poor, and if it exceeds 8%, devitrification may occur during glass frit production, and both are not preferred.

Cab and BaO are components for adjusting the solubility and adjusting the coefficient of thermal expansion during the production of glass frit, and the content of CaO is 5.
If the amount is less than 1% and BaO is less than 18%, the solubility of the glass frit will deteriorate, which is not preferable.

On the other hand, if the CaO content exceeds 8% and the BaO content exceeds 28%, the thermal expansion coefficient and dielectric constant of the substrate become too large, which is not preferable.

MgO and SrO are components that essentially have the same purpose and effect as CaO and BaO, and MgO is 10%.

If SrO exceeds 15%, devitrification may occur during glass melting, which is not preferable.

By adding PbO, the glass softening temperature is lowered, and the sintering temperature of the substrate is lowered. However, if it exceeds 20%, the dielectric constant of the substrate increases, and the removal of the organic binder is insufficient and carbon remains, which is not desirable. Preferably 0-1
8%, and a particularly desirable range is 1 to 18%.

B2O3 is a flux component, and if it is less than 0.5%, the effect as a flux will be low, which is not preferable.

If the B2O3 component is more than 15%, the dielectric constant decreases by 1 and the electrical properties improve, but the removal of the organic binder is insufficient and carbon tends to remain, which is undesirable.

ZnO is desirable because its addition lowers the glass softening temperature and lowers the sintering temperature of the substrate. However, 20
If it is more than 10%, the dielectric constant of the substrate increases, and if it is less than 10%, the glass softening temperature becomes high, which is not preferable.

Although Ti0a+ZrO□ is not an essential component, it is desirable because crystallization can be adjusted by adding it. but,
If it exceeds 7%, the softening temperature of the glass increases and the dielectric constant of the substrate increases, which is not preferable.

Although LizO+Na2O+KiO is not an essential component, it is desirable since it can improve glass meltability. However, from the viewpoint of electrical migration, it is preferably less than 5%.

The above refractory filler is expressed in weight%. Alumina 10-60% Zircon 0-40% Cordierite 0-30% 7 Orsterite 0-30% Silica 0-30% It is desirable to have a composition consisting of:

The reason is as follows.

When the amount of alumina is less than 10%, the crystallization rate of the glass decreases, and when it is more than 60%, the sinterability deteriorates and the dielectric constant increases.

Zircon is added to reduce thermal expansion, but 4
If it is more than 0%, sinterability will deteriorate.

Cordierite is added to reduce thermal expansion and dielectric constant, but if it is added in an amount of 30% or more, sinterability deteriorates.

Forsterite is added to reduce the dielectric constant, but if it is added in an amount of 30% or more, sinterability will deteriorate. It is preferably 0 to 20%.

Silica is added to make the dielectric constant very low, but if it is added in an amount of 30% or more, sinterability will deteriorate.

The green tape according to the present invention is manufactured, for example, as follows.

The organic binder, plasticizer, and solvent according to the present invention are added and kneaded to prepare a slurry. As the organic binder, butyral resin, acrylic resin, as the plasticizer, dibutyl phthalate, dioctyl phthalate, butyl-benzyl phthalate, and as the solvent, commonly used ones such as toluene, trichlene, alcohol, etc. can be used. .

This slurry is then formed into a sheet and dried to produce an unsintered so-called green tape. The thickness of this green tape is usually 70 to 300 μm.

Next, the insulating paste according to the present invention will be described.

The inorganic component of the insulating paste according to the present invention is preferably the same as the composition of the above-mentioned green tape, which has good adhesion to the ceramic substrate 1, but is not limited thereto, and other compositions can also be used.

Further, the insulating paste is manufactured, for example, as follows.

An organic binder solvent is added to the same inorganic composition as the green tape according to the present invention and kneaded to obtain the insulating paste. As the organic binder, ethyl cellulose, vinyl acetate resin, acrylic resin, etc. are used, and as the solvent, α-televisional, butyl calpitol, etc. are used. This insulating paste is formed on the ceramic substrate to a thickness of 5 to 50 μm by screen printing or the like.

[Example] Example 1 Glass frit 58%, alumina 40% as filler
A glass-ceramic composition containing 2% CeO□ as an oxidizing agent was prepared.

The composition of the glass frit is 43% SiO□, A1□
0g 5%, CaO5%, Ba027%, ZnO15
%, 820, 5%. To this glass ceramic composition, methyl methacrylate resin as an organic binder, dibutyl phthalate as a plasticizer, and toluene as a solvent were added and kneaded to obtain a viscosity of 10,000 to 30,000.
A cps slurry was created. This slurry was then formed into a sheet with a thickness of about 0.2 mm and dried at 70° C. for about 2 hours. Copper paste was applied to this green tape with line width and line spacing of 100 μm, 125 μm, and 150 μm, respectively.
Three types of patterns (m) were screen printed at the same time.

Next, a 96% alumina substrate with a thickness of 0.635 mm was prepared, and the via holes formed in this alumina substrate were filled with the copper paste, and the same inorganic components as the green tape and ethyl cellulose as an organic binder were added. Using α-televisionol as a solvent, knead it to create an insulating paste, and apply 20% to both sides of the alumina substrate.
Printed with a thickness of μm.

Next, the green tape was laminated on both sides of the ceramic substrate 1 with the surfaces on which the copper paste was formed facing each other to obtain a laminate. Furthermore, two sheets of the same green tape were prepared and laminated on both sides of the laminate.

Thereafter, copper paste was printed on this green tape.

Next, this was thermocompressed at 70℃-60kg/cm2, with a maximum temperature of 900℃, a peak time of 10 minutes, and an oxygen concentration of 5ppm.
, 1000 ceramic multilayer substrates were manufactured by firing in a nitrogen atmosphere at a flow rate of 20 n/min. All 1,000 ceramic multilayer substrates were inspected for bends, short circuits, disconnections, etc., and no defects were found. A determination method was adopted in which a pattern with an impedance of 1014 or less is considered defective.

Example 2 Ceramic multilayer substrates were manufactured in the same manner as in Example 1, except that the green tape material shown in Table 1 was used, and the number of sheets manufactured was 1000 for each sample number. The results were the same as in Example 1, and all were good products.

Example 3 A ceramic multilayer substrate was manufactured using the same manufacturing method and number of sheets as in Example 1.2, except that no insulating paste was printed on the alumina substrate. The results were almost the same as in Example 1.2, and all 1 samples were good.

Example 4 A conductive paste was printed on an insulating paste on an alumina substrate, and no conductive paste was formed on the -th layer of green tape, but the rest was exactly the same as in Example 1.2. Result is,
It was exactly the same as Example 1.2.

Example 5 Glass frit 58%, alumina 40% as filler
A glass ceramic composition containing 2% CeO□ as an oxidizing agent was prepared.

The composition of the glass frit is 5iOz 43%, A1
．． 0fi 5%, CaO5%, BaO27%, Zn0
15%, BJs 5%. To this glass ceramic composition, methyl methacrylate resin as an organic binder, dibutyl phthalate as a plasticizer, and toluene as a solvent were added and kneaded to obtain a viscosity of 10,000 to 3,000.
A slurry of 0 cps was prepared. This slurry was then formed into a sheet with a thickness of about 0.2 mm and dried at 70° C. for about 2 hours.

2 Two sheets of this green tape were stacked in two layers on a 0.635 mm thick 96% alumina substrate having via holes as shown in FIG. 1, and thermocompression bonded at 70° C. and 60 kg/am 2 . This was then heated at a maximum temperature of 900°C and a peak time of 10 minutes.
Firing was performed in a nitrogen atmosphere with an oxygen concentration of 5 ppm and a flow rate of 20 n/min to produce 1000 ceramic multilayer substrates.

For all 1000 ceramic multilayer substrates,
As a result of inspecting for bends, wire breaks, etc., no defects were found.

Comparative Example 1 Table 2 shows a comparative example. In this comparative example, 1000 pieces of green tape were manufactured for each sample number using the manufacturing method of Example 1 and the materials in Table 2, but as shown in the characteristics column of Table 2, All products were defective.

Comparative Example 2 Copper paste was applied to a ceramic substrate with line width and line spacing of 100 gm, 125 μm, and 150 gm, respectively.
The same number of ceramic substrates were manufactured using the same manufacturing method as in Examples 1 to 3, except that the green tape was printed as three types of micrometer patterns, and no copper paste was printed on the green tape that was first laminated on the ceramic substrate.

All samples corresponding to each sample number had the same results, and those with a 100 μm pattern had 50% defective products. 12
5μm pattern is defective 10%, 150μm
All the products with the pattern were good products, and the same judgment method as in Example 1 was adopted.

5 * indicates a table of defective parts (comparative example) [Operations and effects of the invention] Since the present invention laminates a green tape on which a conductive paste is formed on a ceramic substrate that has been solidified after firing, it has the following excellent functions and effects. It can be effective.

1) Since the conductive paste is formed into a green tape or insulating paste, compared to forming the conductive paste on a ceramic substrate after firing, the solvent contained in the conductive paste does not diffuse on the surface of the green tape or insulating paste. First, it is easy to form fine patterns. Furthermore, when forming a resistive paste or the like on green tape or insulating paste, there are fewer defects.

2) When forming conductive paste on green tapes, each green tape is inspected at this stage and only green tapes that pass the inspection are used, improving yield and productivity.

3) When an insulating paste is formed on a ceramic substrate, the adhesion between the ceramic substrate and the green tape is improved.

In addition, the green tape or insulating paste according to the present invention exhibits excellent electrical properties and also exhibits excellent adhesive strength with ceramic substrates due to the effect of the glass component contained in the green tape or insulating paste. , it is possible to provide an excellent ceramic multilayer substrate without peeling between the eyebrows.

[Brief explanation of drawings]

FIG. 1 shows a cross-sectional view of a ceramic multilayer substrate according to the present invention. 1: Ceramic substrate 2 Nigeleen tape 3 Nigeleen tape (

Claims (8)

[Claims] (1) A method for manufacturing a ceramic multilayer substrate, comprising the following steps. (a) First, a fired ceramic substrate is prepared in which via holes filled with a conductive paste or a conductive material are formed as necessary. (b) Next, prepare a ceramic green tape and form a via hole. (c) Forming a conductive paste in a predetermined pattern on at least one side of the green tape. (d) Laminating the green tape with conductive paste formed on the surface of the ceramic substrate on one or both sides of the ceramic substrate. (e) When laminating, apply pressure if necessary. (f) In the (c) process, if the conductive paste is not formed on one side of the green tape, the conductive paste is formed on one side of the green tape, and in the (c) process, the conductive paste is applied to the via hole of the green tape. If the via holes are not filled with the conductive paste, the via holes are filled with the conductive paste and fired. (2) A method for manufacturing a ceramic multilayer substrate, comprising the following steps. (a) First, a fired ceramic substrate is prepared in which via holes filled with a conductive paste or a conductive material are formed as necessary. (b) Next, prepare a ceramic green tape and form a via hole. (c) Forming a conductive paste in a predetermined pattern on at least one side of the green tape. (d) The surface of the ceramic substrate and the surface of the green tape on which the conductive paste is formed are made to face each other, and the green tape is laminated on one or both surfaces of the ceramic substrate. (e) When laminating, apply pressure if necessary. (f) In the (c) process, if the conductive paste is not formed on one side of the green tape, the conductive paste is formed on one side of the green tape, and in the (c) process, the conductive paste is formed on the via hole of the green tape. If the conductive paste has not been filled, the via holes are filled with the conductive paste and fired. (g) Furthermore, in the case of multilayering, the green tape with via holes formed thereon is stacked on top of the green tape on the ceramic substrate, and pressure is applied as necessary. (H) A conductor paste for forming a conductor pattern and for filling via holes is formed on the green tape layered in the step (H). (l) Repeat (卜) and (h) according to the required number of layers. (v) Pressure and fire the final ceramic substrate and green tape. (3) A method for manufacturing a ceramic multilayer substrate, which comprises laminating, before laminating the green tape on the ceramic substrate according to claim 1 or 2, an insulating paste that improves the adhesion between the green tape and the ceramic substrate. (4) A method for manufacturing a ceramic multilayer substrate, comprising the following steps. (a) First, a fired ceramic substrate is prepared in which via holes filled with a conductive paste or a conductive material are formed as necessary. (b) An insulating paste is formed in a predetermined pattern on one or both sides of the ceramic substrate to improve the adhesion between the ceramic substrate and the green tape. (c) forming a conductive paste in a predetermined pattern on the insulating paste on the ceramic substrate; (d) Next, prepare ceramic green tape,
A via hole is formed in the green tape. (e) Form a conductive paste on one side of the green tape as necessary, and fill via holes of the green tape with the conductive paste as necessary. (f) The green tape is laminated so that the surface of the green tape on which conductive paste is not formed on one or both surfaces of the ceramic substrate faces the ceramic substrate. (G) In the (E) process, if the conductor paste is not formed on the green tape and the via hole is not filled with the conductor paste, the formation and filling are performed. (h) When laminating, pressurize and fire. (5) A method for manufacturing a ceramic multilayer substrate, comprising the following steps. (a) First, a fired ceramic substrate is prepared in which via holes filled with a conductive paste or a conductive material are formed as necessary. (b) An insulating paste is formed in a predetermined pattern on one or both sides of the ceramic substrate to improve the adhesion between the ceramic substrate and the green tape. (c) Forming a conductive paste in a predetermined pattern on the insulating paste on the ceramic substrate. (d) Next, prepare ceramic green tape,
A via hole is formed in this green tape. (e) Form a conductive paste on one side of the green tape as necessary, and fill via holes of the green tape with the conductive paste as necessary. (f) The green tape is laminated so that the surface of the green tape on which conductive paste is not formed on one or both surfaces of the ceramic substrate faces the ceramic substrate. (G) In the (E) process, if the conductor paste is not formed on the green tape and the via hole is not filled with the conductor paste, the formation and filling are performed. (H) Apply pressure as necessary when laminating. (li) Furthermore, in the case of multilayering, the green tape with via holes formed thereon is stacked on top of the green tape on the ceramic substrate, and pressure is applied as necessary. (n) In the (li) step, a conductive paste is formed on the overlapping green tape and for filling the via holes. (l) Repeat (l) and (n) according to the required number of layers. (E) Finally, pressurize and fire the ceramic substrate and green tape. (6) The method for manufacturing a ceramic multilayer substrate according to any one of items 1 to 5, wherein the ceramic substrate is made of alumina, beryllia, or aluminum nitride. (7) At least one inorganic component of the green tape or insulating paste is a glass powder of 40 to 9% by weight.
0, refractory filler 9.99~60, oxidizing agent 0.01~
20, the glass powder consists essentially of SiO_2 38-48 Al_2O_3 1-8 MgO 0-10 CaO 1-8 SrO 0-15 BaO 18-28 PbO 0-20 ZnO 10-20 B_2O_3 0 .5 to 15 TiO_2+ZrO_2 0 to 7 LiO_2+Na_2O+K_2O 0 to 5,
7. The method for manufacturing a ceramic multilayer substrate according to any one of items 1 to 6, wherein the firing is performed in a substantially non-oxidizing atmosphere. (8) A ceramic multilayer substrate manufactured by the method for manufacturing a ceramic multilayer substrate described in items 1 to 7.