JPH03225705A - Thermosetting type self-weldable enameled copper wire. - Google Patents

Abstract

PURPOSE:To heighten the heat resistance of a small motor coil at the time of overload by drying after applying two kinds of respectively specified adhesive paints to a conductor directly or via another insulating film individually and alternately for each layer to form at least two layer of adhesive films. CONSTITUTION:An adhesive paint A is made by adding a reactive low molecular weight oligomer to a thermoplastic resin having molecular weight of not less than 30,000 and film formability, and dissolving the resultant mixture in an organic solvent. An adhesive paint B on the other hand is made by adding a cross-linking agent made of the reactive low molecular weight oligomer to the thermoplastic resin having molecular weight of not less than 30,000 and film formability, and dissolving the resultant mixture in the organic solvent. The adhesive paint A-1 is applied and baked on a conductor 1 via an insulating film 2 to form an adhesive film A3a, and the adhesive paint B-1 is then applied and baked on the film A3a to form an adhesive film B3b. The adhesive paint A-2 is applied and baked further around the film B3b to form an adhesive film A3c, and then an adhesive paint B-2 is applied and baked on the film A3c to form an adhesive film B3d.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to self-bonding enamelled copper wire. More specifically, the present invention relates to a thermosetting self-bonding enamelled copper wire suitable for winding coils used in small motors.

[Conventional technology]

Self-bonding enamelled copper wire, which has an adhesive paint coated on the conductor via an insulating film and baked, is heated or treated with a solvent after being wound into a coil, so that the adhesive film fuses or melts and swells, causing the wires to become loose. Since they can be bonded and solidified together, self-supporting coils can be made relatively easily, and are often used to omit and simplify the varnish impregnation process in the manufacture of stator and rotor coils for small motors. There is.

Adhesion processing methods for coils wound with self-adhesive enamelled copper wire are broadly divided into two types: hot air adhesion and solvent adhesion. Generally, in the case of hot air bonding type, which melts and bonds the adhesive film by heating, there is a limit to the temperature of the hot air that can be blown onto the wire due to the structure of the winding machine, and low melting point thermoplastic resin with a heat softening temperature of about 120 to 150 degrees Celsius is used. 9 For example, since the main components are block copolymer polyamide resin (nylon 12 copolymer elastomer, etc.), phenoxy resin, etc., the heat resistance properties are low.

On the other hand, the solvent bonding type, in which the adhesive film of self-bonding enamelled copper wire is bonded after dissolving and swelling with an organic solvent such as methanol or ethanol, can use a high melting point thermoplastic resin 1, such as alcohol-soluble polyamide resin, and hot air The heat resistance properties are improved compared to the adhesive type. However, these uniform coils, in which the wires of the coil are fixed with an adhesive film made of thermoplastic resin, have drawbacks in terms of reliability in terms of heat-resistant adhesive strength, and naturally have limitations when used in moving parts such as motors. Ta. Therefore, its use has been limited to static parts such as deflection yoke coils and low-torque drive motors.

[Problem to be solved by the invention]

Loads generated during operation of motor stators, rotor coils, etc., such as magnetostriction and centrifugal force, are applied to the coil wire material, making the coils susceptible to unraveling. Therefore, the coils are impregnated with varnish to firmly secure the wires for practical use. I had to offer it.

When a uniform coil wound with self-bonding enamelled copper wire whose adhesive film is made of thermoplastic resin is used in a small motor,
At room temperature, the adhesive force between the wires is strong, so it can withstand the loads that occur during normal motor operation, such as magnetostriction and centrifugal force, but when the motor is overloaded, the temperature of the coil can cause an adhesive film to form. When the temperature rises to near the softening temperature of the thermoplastic resin, there is a problem in that the adhesive strength between the wires decreases, making it impossible to withstand the above-mentioned load.

The present invention was made to solve these problems of the prior art, and its purpose is to create a thermosetting self-adhesive material that can withstand coil heat generation during overload when used in the coil of a small motor. An object of the present invention is to provide a fusible enamelled copper wire.

[Means to solve the problem]

In order to achieve the above object, the present invention has a molecular weight of 30.00.
A reactive low-molecular-weight oligomer is added to a thermoplastic resin with a molecular weight of 0 or more and has film-forming properties, and the adhesive paint (A) is prepared by dissolving this in an organic solvent. Adhesive paint (B
) A thermosetting type characterized in that two types of adhesive paints are alternately applied to the conductor layer by layer, either directly or through another insulating film, and dried to form at least two layers of adhesive film. Self-bonding enamelled copper wire.

Examples of the thermoplastic resin of the present invention having a molecular weight of 30.000 or more and film-forming properties (hereinafter abbreviated as thermoplastic resin) include block copolymerized 12-nylon resin, alcohol-soluble copolymerized polyamide resin, and the like. Block copolymerized 12-nylon resin is an elastomer with a hard segment of 12-nylon and a soft segment of polyether component in the molecule, and has a melting temperature of 120 to 160.
It is a block copolymerized polyamide resin having an inferior molecular structure with an average molecular weight in the range of 30,000 to 100,000. A specific example is Diamid N1901. T451 (Daicel product name), Bratabond A12
76, and NI411 (trade name, manufactured by Bhonsu Roussin).

Further, the alcohol-soluble copolyamide resin is a copolyamide resin of nylon 6-6, 6-11, and has a melting temperature of 180° C. or higher as a specific example.

For example, Ultramid IC (product name of the powerful BASF) and Amilan CM4000. Examples include CN4001 (Toshisha product name).

Examples of the reactive low-molecular oligomer include novolac type polyfunctional epoxy resin (hereinafter abbreviated as polyfunctional epoxy resin) ECN1299 (trade name of Dow Chemical Company); Examples of crosslinking agents for oligomers include diamines such as methanediphenyldiamine. The reason why the molecular weight of the thermoplastic resin is limited to 30,000 or more is that if the molecular weight is less than 30,000, film forming properties are poor and a good adhesive film cannot be obtained.

[Function] In the production of the thermosetting self-adhesive enamelled copper wire of the present invention, two types of adhesive paints (A) and ([1) are applied to the conductor layer by layer either directly or via an insulating film. In the process of alternately applying and drying, first apply adhesive paint (A),
When drying to form an adhesive film (A), then applying adhesive paint (B) to the outer periphery and drying to form an adhesive film (0) (the order of forming the adhesive film is from (B) (but that's fine),
Adhesion degree 11 At the interface between (A) and the adhesive film (B), the reactive low molecular oligomer (polyfunctional epoxy resin i) dispersed on the surface of the adhesive film (A) and the surface of the adhesive film (B) A part of the dispersed crosslinking agent (methane diphenyldiamine) may react and form a thermosetting thin film, but
Inside the adhesive films (A) and (B), the reactive low molecular weight oligomer and the crosslinking agent remain in an unreacted state.

A thermosetting self-adhesive enamelled copper wire provided with such adhesive films (A) and (B) is wound into a coil, and the coil is heated to the temperature at which the adhesive films (A) and (B) soften. When the above heat treatment is applied, physical mixing occurs between the adhesive films (A) and (B) due to the tension of the winding wire held in the coil, and the reaction between the reactive low molecular weight oligomer and the crosslinking agent occurs. start,
As the process progresses further, the crosslinking of the reactive low-molecular oligomers dispersed and dissolved in the thermoplastic resin matrix progresses, and the adhesive film forms an interpenetrating network structure, forming a thermosetting film. . In addition, since the reaction starts and progresses with the combination of adhesive film (A) and adhesive film ([1), at least two layers of adhesive film (A) + (B) or (B) + (A) are used.
is required, and preferably the adhesion degree of four layers is 111(A)+
(B) ÷ (A) + (B), and the adhesive film is an odd number, for example, the adhesion degree of three layers II (A) ÷ (B) + (A) or (B) + (A) ÷ (B ) is also possible, but in this case it is necessary to adjust the thickness of the adhesive films (A) and (B) so that the reaction between the reactive low molecular weight oligomer and the crosslinking agent can be sufficiently carried out. Furthermore, the number of layers of the adhesive film may be increased, but care must be taken because the interface between the adhesive film (A) and the adhesive film (8) increases, making it easier for the above-mentioned reaction to occur.

〔Example〕

The content of the present invention will be explained below with reference to Examples and Comparative Examples.

Preparation of Adhesive Paint Table 1 shows the resin composition of the adhesive paints of Examples 1 and 2.

Table 1. Resin composition table for adhesive paint Block copolymerized 12-nylon resin Diamide N1901 (trade name of Daicel Corporation) was used as the thermoplastic resin.
To this, polyfunctional epoxy resin ECN1299 (trade name of Dow Chemical Company) was added as a reactive low-molecular oligomer in the composition shown in Table 1, and dissolved in a mixed solvent of cresol and xylene to give an adhesive coating (A)- 1, (A)-2
was prepared.

Furthermore, an alcohol-soluble copolymerized polyamide resin Ultramid IC (Kokoku [IASF company product name]) was used as a thermoplastic resin, and methanediphenyldiamine was added thereto as a crosslinking agent for ECN1299 in the composition shown in Table 1, and cresol and xylene were added. Dissolved in a mixed solvent of
5% adhesive paints (B)-1 and (B)-2 were prepared.

In addition, as a comparative example, Epicoat 10 was added as an anti-sticking agent to 100 g of Amilan CM4000 (trade name of Toshisha).
Add 30g of 07 (trade name of Yuka Shell Evokin Co., Ltd.) and dissolve it in a mixed solvent of cresol and xylene.

An adhesive paint with a concentration of 15% was prepared.

Production of thermosetting self-fusible enamelled copper wire Production of thermosetting self-fusible enameled copper wire as an example and self-fusible enamelled copper wire as a comparative example will be explained with reference to FIGS. 1 and 2. do.

Example 1 As conductor 1, polyesterimide insulating paint 5F500 (which can be soldered onto an annealed copper wire with a conductor diameter of 0.270 m) was used.
Totoku Toyo Co., Ltd. product name) Apply 35% concentration and bake using horizontal baking oven with oven length of 3 m, oven temperature of 480°C, IA speed of 54 m/min)
A solderable polyesterimide insulated wire provided with an insulating film 2 having two types of film thickness was produced and used as a wire.

Next, another horizontal baking furnace (furnace length: 3 m, furnace temperature: 300°C).

Using a wire speed of 54 m/min), adhesive paint (
A)-1 is applied and baked to provide an adhesive film (A) 3a,
Next, the adhesive paint (B)-1 is applied to this outer periphery and baked to provide an adhesion degree g(B) 3b, and then the adhesive paint (A)-1 is applied to this outer periphery and baked to form an adhesive film (A). 3c, and further apply the adhesive paint (B)-2 on the outer periphery and bake it to form an adhesive film (B) 3d, and provide an adhesive film 3 consisting of these four layers of adhesive films 3a, 3b, 3c, and 3d. A thermosetting self-bonding enamelled copper wire was manufactured. In addition, the degree of adhesion of the four layers [3a, 3b, 3e, 3d
The film was manufactured with the target thickness ratio of 1:l11, and the final finished outer diameter was manufactured with the target of one type of coating thickness.

Example 2 The adhesive paint used in Example 2 was Adhesive Paint (A)-2 instead of Adhesive Paint (A)-1 used in Example 1. Adhesive Paint (B)-1 was used instead of Adhesive Paint (B)-1. A thermosetting self-bonding enamelled copper wire 4 was produced in the same manner as in Example 1 except using B)-2.

Comparative Example The east line and baking oven were the same as those in the example, and the adhesive paint of the comparative example was applied to the outer periphery of the wire and baked to produce a self-bonding enamelled copper wire 5 with an adhesive film 3 provided thereon.

In addition, the finished outer diameter was manufactured with one kind of film thickness as the target.

These self-bonding enamelled copper wires are JIS C300
A test was conducted based on 3 "Test Method for Enamelled Copper Wire and Enamelled Aluminum Wire" and the results are shown in Table 2. Also, helical coil 2.7φ 120-200'CX
Heat bonding force test and 1, which measured the adhesive force after 20 minutes of heat treatment.
A heat-resistant adhesive strength test was conducted using a helical coil 2.7φ after heat treatment at 80°C for 20 minutes to measure the adhesive strength in a heating atmosphere of 60 to 180°C, and the results are shown in the graphs of Figures 3 and 4. . (Examples 1 and 2 have almost the same values, so only Example 1 is shown.)
This value is the sum of the thicknesses of a, 3b, 3c, and 3d.

(2) Dielectric breakdown voltage value in water (sample length 1m) (3) Helical coil 2.7φ, 180℃ x 20 minutes heat treatment 14
The temperature at which the adhesive strength is halved under the conditions of 1 +31 [Effects of the invention] The thermosetting self-bonding enameled copper wire of the present invention is produced by adding a reactive low-molecular oligomer to a thermoplastic resin, and adding this to an organic solvent. The above-mentioned reactive low-molecular oligomer cross-linking agent is added to the dissolved adhesive paint (A) and thermoplastic resin, and the two types of paint (B), which are dissolved in an organic solvent, are applied one layer at a time through an insulating film. It has a structure in which it is applied and dried alternately, and each adhesive layer does not contain a reactive low molecular weight oligomer and a crosslinking agent at the same time, but has a separate structure, so it can be dried over a wide range of temperatures, and it can be stored easily. The lifespan is also improved.

Furthermore, as shown in FIGS. 3 and 4, it has excellent heat adhesive strength and heat-resistant adhesive strength in a heated atmosphere, making it ideal for winding coils in small motors.

[Brief explanation of drawings]

Fig. 1 is a cross-sectional view showing an embodiment of the thermosetting self-fusing enamelled copper wire of the present invention, Fig. 2 is a cross-sectional view of a conventional self-fusing enamelled copper wire, and Fig. 3 is a heating The tangent force curve, FIG. 4, is a heat-resistant adhesive force curve under a heated atmosphere. ■ Conductor, 2 insulation film, 3 contact 1 film. 3a, 3c Adhesive skin M (A), 3b, 3d
Adhesive film (B), 4 thermosetting self-bonding enamelled copper wire. 5 Self-bonding enamelled copper wire.

Claims (1)

[Claims] (1) Adhesive paint (A) prepared by adding a reactive low-molecular oligomer to a thermoplastic resin with a molecular weight of 30,000 or more and having film-forming properties and dissolving this in an organic solvent;
Two types of adhesive paints (B) are prepared by adding the reactive low-molecular oligomer crosslinking agent to a thermoplastic resin having a film-forming property of 0.00 or more and dissolving this in an organic solvent. 1. A thermosetting self-bonding enameled copper wire, characterized in that at least two layers of adhesive coating are provided by alternately coating and drying each layer individually with another insulating coating interposed therebetween.