JPH0322407U - - Google Patents
Info
- Publication number
- JPH0322407U JPH0322407U JP8330189U JP8330189U JPH0322407U JP H0322407 U JPH0322407 U JP H0322407U JP 8330189 U JP8330189 U JP 8330189U JP 8330189 U JP8330189 U JP 8330189U JP H0322407 U JPH0322407 U JP H0322407U
- Authority
- JP
- Japan
- Prior art keywords
- package
- circuit board
- matching circuit
- semiconductor element
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims 1
- 238000005192 partition Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Microwave Amplifiers (AREA)
- Waveguides (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8330189U JPH0322407U (fr) | 1989-07-14 | 1989-07-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8330189U JPH0322407U (fr) | 1989-07-14 | 1989-07-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0322407U true JPH0322407U (fr) | 1991-03-07 |
Family
ID=31630851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8330189U Pending JPH0322407U (fr) | 1989-07-14 | 1989-07-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0322407U (fr) |
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1989
- 1989-07-14 JP JP8330189U patent/JPH0322407U/ja active Pending