JPH03218103A - Conductor terminal and its bonding method - Google Patents

Conductor terminal and its bonding method

Info

Publication number
JPH03218103A
JPH03218103A JP1395490A JP1395490A JPH03218103A JP H03218103 A JPH03218103 A JP H03218103A JP 1395490 A JP1395490 A JP 1395490A JP 1395490 A JP1395490 A JP 1395490A JP H03218103 A JPH03218103 A JP H03218103A
Authority
JP
Japan
Prior art keywords
width
terminal
pedestal
conductive terminal
pedestals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1395490A
Other languages
Japanese (ja)
Inventor
Tadami Kawasaki
川崎 忠美
Hiroshi Nakanishi
弘 中西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Central Glass Co Ltd
Original Assignee
Central Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Central Glass Co Ltd filed Critical Central Glass Co Ltd
Priority to JP1395490A priority Critical patent/JPH03218103A/en
Publication of JPH03218103A publication Critical patent/JPH03218103A/en
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Aerials (AREA)

Abstract

PURPOSE:To make the conductor terminal small and to bond the terminal in a short time by decreasing a width of at least part of a seat to loss than the width of a bridge or selecting a cross sectional area of at least a part of it to be 0.5mm<2>-1.8mm<2>. CONSTITUTION:The width of at least a part of a seat 2 of a conductor terminal having a couple of seats 2 bonding to a conductive film formed on a face of a plate glass 5 and with a terminal part 4 connected to one side of a bridge 3 connecting to the seats 2 is selected smaller than the width of the bridge 3 or the cross sectional area of at least a part of the seat 2 to be 0.5mm<2>-1.8mm<2>. Then as the bonding method, molten solder is coated from the surrounding part of the seat 2 of the conductive terminal 4 to the upper surface. Thus, the heating time is short, the effect onto the conductive film such as silver corrosion phenomena is minimized, the removal of flux is facilitated and the decrease in the bonding strength is prevented.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は板ガラスの表面に形成された導電膜に接着され
る導電端子の構成に関するもので、例えば車両用窓ガラ
スなどにおいて、導電ペーストを印刷、焼付けて形成し
た加熱線条への通電用導電端子あるいは同様の方法で形
成したアンテナ線条からの給電用導電端子の構成ならび
にその接着方法に関する. [従来の技術] 従来の導電端子lは第4図に示すように、所定の接着強
度を得るために一対の台座2、2がブリッジ部3より幅
が例えばW=W’ +2.5日と広く、台座の断面積W
tも3−〜7−と大型のものが使用されていた.なお、
その他の符号は実施例1の符号と同等物を示す. このような導電端子にあっては、半田付け時に半田が台
座下部に回りにくいため、予め台座裏面に半田盛りをし
ておく必要があった. そのため手間がかかり、コスト高になるばかりか、半田
付け時にフランクスが抜けにくいため、接着面に気胞が
多数発生し、接着強度がばらつき、強度も低下するなど
の欠点があった。
Detailed Description of the Invention [Industrial Application Field] The present invention relates to the structure of a conductive terminal that is adhered to a conductive film formed on the surface of a plate glass. , Concerning the structure of a conductive terminal for supplying current to a heating wire formed by baking or a conductive terminal for feeding power from an antenna wire formed by a similar method, and a method for adhering the same. [Prior Art] As shown in FIG. 4, in the conventional conductive terminal l, in order to obtain a predetermined adhesive strength, the pair of pedestals 2, 2 have a width wider than the bridge portion 3, for example, W=W' + 2.5 days. Wide, cross-sectional area W of the pedestal
Large sizes of 3- to 7-T were also used. In addition,
Other symbols indicate equivalents to those in Example 1. With such conductive terminals, it is difficult for the solder to reach the bottom of the pedestal during soldering, so it is necessary to apply solder to the back of the pedestal in advance. Not only is this time-consuming and costly, but the franks are difficult to remove during soldering, resulting in a large number of air bubbles on the adhesive surface, resulting in uneven adhesive strength and reduced strength.

また、予め半田盛りをしない場合には、充分な接着強度
が得られないばかりか、導電膜に含まれる銀が拡散する
いわゆる銀くわれ現象が発生しやすい等の欠点があった
. さらに、近年導電端子を露出させず、パネル内に隠蔽し
て設ける傾向にあり、その場合には導電端子を小型化し
、しかもリード線を予め接続してその後導電端子を半田
付けする必要があった。
Furthermore, if solder is not applied in advance, not only is sufficient adhesive strength not obtained, but there are also disadvantages such as the so-called silver porosity phenomenon in which silver contained in the conductive film is likely to diffuse. Furthermore, in recent years there has been a trend to hide conductive terminals within the panel instead of exposing them, and in that case it was necessary to downsize the conductive terminals, connect lead wires in advance, and then solder the conductive terminals. .

しかしながら、従来の導電端子を熱風等で矢印方向に吹
き付けて、半田付けする方法では、リード線被覆を焼損
する恐れがあり、歩留りが悪いという問題点があった。
However, the conventional method of soldering conductive terminals by blowing them with hot air or the like in the direction of the arrow has the problem that the lead wire coating may be burned out, resulting in poor yield.

[発明の目的] 本発明はこのような点に鑑みてなされたものであり、前
記の欠点を解消するとともに接着強度も高い導電端子お
よびその接着方法を提供することを目的とする. [問題点を解決するための手段] 本発明は、板ガラス面上に形成された導電膜に接着され
る一対の台座を有し、該台座を連結するブリソジ部の一
方の側方部に端子部が連結された導電端子において、少
なくとも一部の台座の幅をブリッジ部の幅より小さ《す
るか、少なくとも一部の台座の断面積を0.5mm2〜
1.8mm2とじたことを特徴とし、接着方法はこの導
電端子の台座の周辺部から上部表面部にかけて、溶融半
田を被着させるようにしたことを特徴とする.[作用1 本発明は、少なくとも一部の台座の幅をブリッジ部の幅
より小さくするか、少なくとも一部の台座の断面積を0
.5mm2〜1、8mm2として、従来のものより小型
化をはかり、溶融半田により接着することにより、加熱
時間が短くてすみ銀くわれ現象等導電膜に与える影響を
橿力少なく、同時にフラックス抜けが容易になり、接着
強度の低下も防止することができる.また、台座に半田
を盛り上げるように被着させることにより、導電端子の
接着強度も向上させることができる。
[Object of the Invention] The present invention has been made in view of the above-mentioned points, and it is an object of the present invention to provide a conductive terminal that eliminates the above-mentioned drawbacks and also has high adhesive strength, and a method for adhering the same. [Means for Solving the Problems] The present invention has a pair of pedestals that are bonded to a conductive film formed on a plate glass surface, and a terminal portion is provided on one side of a brissage portion that connects the pedestals. In the conductive terminals connected to each other, the width of at least some of the pedestals is made smaller than the width of the bridge part, or the cross-sectional area of at least some of the pedestals is made to be 0.5 mm2 to 0.5 mm2.
It is characterized by a 1.8 mm2 binding method, and is characterized in that molten solder is applied from the periphery of the pedestal to the upper surface of the conductive terminal. [Operation 1] The present invention makes the width of at least some of the pedestals smaller than the width of the bridge part, or reduces the cross-sectional area of at least some of the pedestals to 0.
.. 5mm2 to 1,8mm2, which is smaller than conventional products, and is bonded with molten solder, which reduces heating time and reduces the effect of silver curling on the conductive film, and at the same time, facilitates flux removal. This also prevents a decrease in adhesive strength. Further, by applying solder to the base in a heaping manner, the adhesive strength of the conductive terminal can also be improved.

さらに詳細には、台座の少なくとも一部の断面積を0.
5mm2〜1.8mm2とすると、より好ましい。
More specifically, the cross-sectional area of at least a portion of the pedestal is set to 0.
It is more preferable to set it to 5 mm2 to 1.8 mm2.

すなわち、車両用の導電端子はJIS規格H3100に
引張強度が単位面積あたり20kgf/一以上と規定さ
れ、導電端子全体としても20kg以上の引張強度が要
求されているので、台座の断面積は最低1−/2(台座
が一対あるので)すなわち0.5一あればよく、1.8
mm2を越えると、溶融半田による接着時間が長くなり
、銀くわれ現象等が発生する恐れがあるので、0.5m
m2〜1.8一の範囲が、よりその所期の目的を達成す
ることができる.[実施例] 以下、図面を参照しながら本発明を詳細に説明する。
In other words, JIS standard H3100 stipulates that conductive terminals for vehicles have a tensile strength of 20 kgf/unit or more per unit area, and the conductive terminal as a whole is required to have a tensile strength of 20 kg or more, so the cross-sectional area of the pedestal must be at least 1. -/2 (because there is a pair of pedestals), that is, 0.51 is enough, and 1.8
If it exceeds 0.5 m2, the adhesion time with molten solder will be longer and there is a risk of silver cracking.
A range of m2 to 1.8 can better achieve the intended purpose. [Example] Hereinafter, the present invention will be described in detail with reference to the drawings.

第1図は本発明に係わる導電端子を表わす斜視図、第2
図〜第3図は、それぞれその他の変形例を表わす正面図
と台座部分のみを示す要部平面図、第4図は従来の導電
端子の接着例を表わす斜視図である. LLLL 本発明の導電端子1は一対の台座2、2と、これらを連
結するブリッジ部3と、ブリッジ部3の一方の側方部に
連結される端子部4とから構成され、例えばt =0.
6 m厚さの黄銅板を打ち抜いてプレス加工したもので
一枚の板から作製し、各部の寸法はブリッジ部3の幅W
′、台座2の幅W1台座2の長さしをそれぞれ2.5f
i、1,7闘、2fiとし、台座2の断面積Wtはほぼ
l一としたものである. このようにして得られた導電端子1は図示しないリード
線が接続され、導電膜への接着は次のような工程で行う
. ■板ガラス5に銀を含む導電ペーストにより加熱線条6
とブスパー7を導電膜として印刷、焼成して防曇ガラス
を作製する. ■この防曇ガラスに導電端子1を載置して、台座2近傍
でフラックス入り半田を半田鏝により溶融させ、一対の
台座2、2の周辺部から台座上部にかけて溶融された半
田8を被着させる.このようにして接着された導電端子
は接着強度のばらつきがなく、20−f以上の強度があ
り、接着時間も短時間であり、銀くわれ現象を生ずるこ
とがなかった. 実』[阿』− 第2図に示すように、一対の台座2、2の先端を曲げ、
台座裏面に空隙部Gを形成するようにして、その他の構
成は実施例1と同じにしたものである. このような構成の導電端子により接着する七、溶融半田
が台座裏面の空隙部Gに回りこむので接着強度がさらに
向上し、より好ましい.そ[虻劃一 第3図(a)〜(e)の台座のみを表わす平面図に示す
ような導電端子も採用可能である.(a)に示す例はブ
リッジ部の幅W゜を3■として台座の形状をT字形状と
して各部の寸法をW1−1.5鶴、W2 = 1 .5
鶴、L1=3.0■、L2=3.0■としたもので、台
座の断面積w,t ,w2tはそれぞれ0.9−、0.
9−となる.(b)に示す例はプリッジ部の幅W′を3
■として台座を切り欠いて分割し、それぞれの幅Wlを
1鶴、長さしを2■としたもので、台座の断面積w1t
は0.6−となる. (C)に示す例はブリッジ部の幅W゛を3Mきして台座
を四角形状に切り欠いて、各部の寸法をw1= 1 .
0m、Wz = 1 .0mm、L=3.0mとしたも
ので、台座の断面積w,tSw2tはそれぞれ0.6一
、0.6−となる. また、(d) 、(e)に示すような例も採用可能であ
る. 以上、好適な実施例により説明したが、本発明はこれら
限定されるものではなく、種々の応用が可能である. 端子部については、各実施例のように垂直な部分のみか
ら構成されるもの以外にも、途中で水平方向に折曲げた
もの、途中に屈曲部を有するものなどであってもよい. 台座の構造については、実施例で示したように、各種の
ものが可能であるが、ブリッジ部と台座の接合部分の断
面積が第3図(e)に示すように大きいものより、その
他の例に示すように比較的小さいほうが、半田付け時に
ブリッジ部の影響が少なく、熱容量が小さくなるので、
十分な加熱ができ接着時間も短くなり好ましい.また、
台座裏面は全体平面としてもよいが、実施例2に示すよ
うに空隙部を設けると溶融半田が裏面まで回り込むので
より好ましい. [発明の効果] 本発明によれば、台座の少なくとも一部の幅をブリッジ
部より小さくするか、少なくとも一部の断面積を0.5
mm2〜1.8mm2とすることにより、導電端子を小
型化するとともに、この導電端子の台座周辺部から上部
表面にかけて、溶融半田を被着させることにより、フラ
ックス抜けがよく、銀くわれ現象を生ずることなく、短
時間に接着することができるものである.
Figure 1 is a perspective view showing a conductive terminal according to the present invention, Figure 2 is a perspective view showing a conductive terminal according to the present invention;
3 to 3 are a front view showing other modified examples and a plan view of the main part showing only the pedestal portion, respectively, and FIG. 4 is a perspective view showing an example of bonding a conventional conductive terminal. LLLL The conductive terminal 1 of the present invention is composed of a pair of pedestals 2, 2, a bridge part 3 connecting these, and a terminal part 4 connected to one side part of the bridge part 3. For example, t = 0 ..
It is made from a single plate by punching and pressing a 6 m thick brass plate, and the dimensions of each part are the width W of the bridge part 3.
', Width W of pedestal 2, Length of pedestal 2 is 2.5f each.
i, 1, 7, and 2fi, and the cross-sectional area Wt of the pedestal 2 is approximately l-1. A lead wire (not shown) is connected to the conductive terminal 1 thus obtained, and adhesion to the conductive film is carried out in the following steps. ■Heating wires 6 are made of conductive paste containing silver on plate glass 5.
and Buspar 7 are printed as conductive films and fired to produce anti-fog glass. ■ Place the conductive terminal 1 on this anti-fog glass, melt the flux-cored solder with a soldering iron near the pedestal 2, and apply the molten solder 8 from the periphery of the pair of pedestals 2 to the top of the pedestal. Let. The conductive terminals bonded in this way had no variation in adhesive strength, had a strength of 20-f or more, took a short bonding time, and did not suffer from the silver curling phenomenon. - As shown in Figure 2, bend the tips of the pair of pedestals 2, 2,
The other configurations were the same as in Example 1 except that a gap G was formed on the back surface of the pedestal. 7. The molten solder that is bonded by the conductive terminal having such a structure goes around the gap G on the back surface of the pedestal, which further improves the bonding strength, which is more preferable. It is also possible to employ conductive terminals as shown in the plan views of Figures 3(a) to 3(e) showing only the pedestal. In the example shown in (a), the width W of the bridge part is 3 cm, the shape of the pedestal is T-shaped, and the dimensions of each part are W1-1.5, W2 = 1. 5
Crane, L1 = 3.0■, L2 = 3.0■, and the cross-sectional areas w, t and w2t of the pedestal are 0.9- and 0.9-, respectively.
It becomes 9-. In the example shown in (b), the width W' of the bridge part is 3
The pedestal is cut out and divided as ■, and each has a width Wl of 1 crane and a length of 2■, and the cross-sectional area of the pedestal w1t.
becomes 0.6-. In the example shown in (C), the width W of the bridge part is 3M, the pedestal is cut into a rectangular shape, and the dimensions of each part are w1=1.
0m, Wz = 1. 0mm and L=3.0m, the cross-sectional areas w and tSw2t of the pedestal are 0.6- and 0.6-, respectively. Furthermore, examples such as those shown in (d) and (e) can also be adopted. Although the present invention has been described above using preferred embodiments, the present invention is not limited to these embodiments, and various applications are possible. As for the terminal part, instead of being composed only of vertical parts as in each embodiment, it may be bent horizontally in the middle, or have a bent part in the middle. As for the structure of the pedestal, various types are possible as shown in the examples, but other than the one in which the cross-sectional area of the joint part of the bridge part and the pedestal is large as shown in Fig. 3(e). As shown in the example, the smaller the bridge, the less the influence of the bridge part during soldering and the smaller the heat capacity.
It is preferable because sufficient heating can be achieved and the bonding time is short. Also,
The back surface of the pedestal may be entirely flat, but it is more preferable to provide a gap as shown in Example 2, since the molten solder can go around to the back surface. [Effects of the Invention] According to the present invention, the width of at least a portion of the pedestal is made smaller than that of the bridge portion, or the cross-sectional area of at least a portion of the pedestal is made 0.5
By setting the conductive terminal to a size of mm2 to 1.8 mm2, the conductive terminal can be miniaturized, and by applying molten solder from the periphery of the base to the upper surface of the conductive terminal, flux can be removed easily and the silver curling phenomenon can occur. It can be bonded in a short time without any problems.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に係わる導電端子を表わす斜視図、第2
図〜第3図は、それぞれその他の変形例を表わす正面図
と台座部分のみを示す要部平面図、第4図は従来の導電
端子の接着例を表わす斜視図である. l・・・導電端子   2、2・・・一対の台座3・・
・ブリッジ部  4・・・端子部5・・・板ガラス  
 8・・・半田
Figure 1 is a perspective view showing a conductive terminal according to the present invention, Figure 2 is a perspective view showing a conductive terminal according to the present invention;
3 to 3 are a front view showing other modified examples and a plan view of the main part showing only the pedestal portion, respectively, and FIG. 4 is a perspective view showing an example of bonding a conventional conductive terminal. l... Conductive terminal 2, 2... A pair of pedestals 3...
・Bridge part 4...Terminal part 5...Plate glass
8...Solder

Claims (2)

【特許請求の範囲】[Claims] (1)板ガラス面上に形成された導電膜に接着される一
対の台座を有し、該台座を連結するブリッジ部の一方の
側方部に端子部が連結された導電端子において、少なく
とも一部の台座の幅をブリッジ部の幅より小さくするか
、少なくとも一部の台座の断面積を0.5mm^2〜1
.8mm^2としたことを特徴とする導電端子。
(1) A conductive terminal that has a pair of pedestals that are bonded to a conductive film formed on a plate glass surface, and in which a terminal part is connected to one side part of a bridge part that connects the pedestals, at least partially. Make the width of the pedestal smaller than the width of the bridge part, or reduce the cross-sectional area of at least part of the pedestal to 0.5mm^2~1
.. A conductive terminal characterized by having a diameter of 8 mm^2.
(2)板ガラス面上に形成された導電膜に接着される一
対の台座を有し、該台座を連結するブリッジ部の一方の
側方部に端子部が連結された導電端子の接着方法におい
て、少なくとも一部の台座の幅をブリッジ部の幅より小
さくするか、少なくとも一部の台座の断面積を0.5m
m^2〜1.8mm^2とした導電端子に、溶融半田を
少なくとも該台座の周辺部から上部表面にかけて被着さ
せるようにしたことを特徴とする導電端子の接着方法。
(2) In a method for adhering a conductive terminal, the conductive terminal has a pair of pedestals to be adhered to a conductive film formed on a plate glass surface, and a terminal part is connected to one side part of a bridge part that connects the pedestals, The width of at least some of the pedestals is smaller than the width of the bridge part, or the cross-sectional area of at least some of the pedestals is 0.5 m.
A method for adhering a conductive terminal, characterized in that molten solder is applied to the conductive terminal having a thickness of m^2 to 1.8 mm^2 from at least the peripheral portion to the upper surface of the pedestal.
JP1395490A 1990-01-24 1990-01-24 Conductor terminal and its bonding method Pending JPH03218103A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1395490A JPH03218103A (en) 1990-01-24 1990-01-24 Conductor terminal and its bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1395490A JPH03218103A (en) 1990-01-24 1990-01-24 Conductor terminal and its bonding method

Publications (1)

Publication Number Publication Date
JPH03218103A true JPH03218103A (en) 1991-09-25

Family

ID=11847605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1395490A Pending JPH03218103A (en) 1990-01-24 1990-01-24 Conductor terminal and its bonding method

Country Status (1)

Country Link
JP (1) JPH03218103A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012104708A (en) * 2010-11-11 2012-05-31 Shindengen Electric Mfg Co Ltd Connection plate, joint structure, and semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012104708A (en) * 2010-11-11 2012-05-31 Shindengen Electric Mfg Co Ltd Connection plate, joint structure, and semiconductor device

Similar Documents

Publication Publication Date Title
JPH09130125A (en) Multiplex contact for antenna window
JP4312409B2 (en) Common mode filter
JPH10134869A (en) Terminal material and terminal
JPS6046518B2 (en) electrical terminals
EP0870346B1 (en) Electrical connection method
JPH03218103A (en) Conductor terminal and its bonding method
JP3091142B2 (en) Square chip inductor
TWI269391B (en) Initial ball forming method of wire bonding lead and wire bonding apparatus
JPS6137182Y2 (en)
JPH06187866A (en) Electric-contact structure
EP0787557A3 (en) Method of bonding aluminum members
JPS6021884Y2 (en) conductive glass terminal plate
JPH09226522A (en) Conductive terminal
JPH0722854Y2 (en) Conductive terminal
JPH07329724A (en) Terminal used for defrosted glass for automobile
JPS5911412Y2 (en) conductive glass terminal plate
JPH02116186A (en) Semiconductor laser
JP2599416Y2 (en) Conductive terminal mounting structure for anti-fog glass
JPH05335864A (en) Manufacture of surface acoustic wave element
JP2024025936A (en) Connection terminal assembly and window glass
JPH0426050Y2 (en)
JPH01268108A (en) Electric parts
JPS5828362Y2 (en) hybrid integrated circuit
JPH04125955A (en) Semiconductor device and manufacture thereof
JPH0763130B2 (en) Electronic component manufacturing method