JPH03218103A - Conductor terminal and its bonding method - Google Patents
Conductor terminal and its bonding methodInfo
- Publication number
- JPH03218103A JPH03218103A JP1395490A JP1395490A JPH03218103A JP H03218103 A JPH03218103 A JP H03218103A JP 1395490 A JP1395490 A JP 1395490A JP 1395490 A JP1395490 A JP 1395490A JP H03218103 A JPH03218103 A JP H03218103A
- Authority
- JP
- Japan
- Prior art keywords
- width
- terminal
- pedestal
- conductive terminal
- pedestals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 8
- 239000004020 conductor Substances 0.000 title abstract 3
- 229910000679 solder Inorganic materials 0.000 claims abstract description 16
- 239000005357 flat glass Substances 0.000 claims abstract description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 30
- 230000002093 peripheral effect Effects 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052709 silver Inorganic materials 0.000 abstract description 8
- 239000004332 silver Substances 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 230000004907 flux Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000005476 soldering Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229940015273 buspar Drugs 0.000 description 1
- QWCRAEMEVRGPNT-UHFFFAOYSA-N buspirone Chemical compound C1C(=O)N(CCCCN2CCN(CC2)C=2N=CC=CN=2)C(=O)CC21CCCC2 QWCRAEMEVRGPNT-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Details Of Aerials (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は板ガラスの表面に形成された導電膜に接着され
る導電端子の構成に関するもので、例えば車両用窓ガラ
スなどにおいて、導電ペーストを印刷、焼付けて形成し
た加熱線条への通電用導電端子あるいは同様の方法で形
成したアンテナ線条からの給電用導電端子の構成ならび
にその接着方法に関する．
［従来の技術］
従来の導電端子ｌは第４図に示すように、所定の接着強
度を得るために一対の台座２、２がブリッジ部３より幅
が例えばＷ＝Ｗ’ ＋２．５日と広く、台座の断面積Ｗ
ｔも３−〜７−と大型のものが使用されていた．なお、
その他の符号は実施例１の符号と同等物を示す．
このような導電端子にあっては、半田付け時に半田が台
座下部に回りにくいため、予め台座裏面に半田盛りをし
ておく必要があった．
そのため手間がかかり、コスト高になるばかりか、半田
付け時にフランクスが抜けにくいため、接着面に気胞が
多数発生し、接着強度がばらつき、強度も低下するなど
の欠点があった。Detailed Description of the Invention [Industrial Application Field] The present invention relates to the structure of a conductive terminal that is adhered to a conductive film formed on the surface of a plate glass. , Concerning the structure of a conductive terminal for supplying current to a heating wire formed by baking or a conductive terminal for feeding power from an antenna wire formed by a similar method, and a method for adhering the same. [Prior Art] As shown in FIG. 4, in the conventional conductive terminal l, in order to obtain a predetermined adhesive strength, the pair of pedestals 2, 2 have a width wider than the bridge portion 3, for example, W=W' + 2.5 days. Wide, cross-sectional area W of the pedestal
Large sizes of 3- to 7-T were also used. In addition,
Other symbols indicate equivalents to those in Example 1. With such conductive terminals, it is difficult for the solder to reach the bottom of the pedestal during soldering, so it is necessary to apply solder to the back of the pedestal in advance. Not only is this time-consuming and costly, but the franks are difficult to remove during soldering, resulting in a large number of air bubbles on the adhesive surface, resulting in uneven adhesive strength and reduced strength.
また、予め半田盛りをしない場合には、充分な接着強度
が得られないばかりか、導電膜に含まれる銀が拡散する
いわゆる銀くわれ現象が発生しやすい等の欠点があった
．
さらに、近年導電端子を露出させず、パネル内に隠蔽し
て設ける傾向にあり、その場合には導電端子を小型化し
、しかもリード線を予め接続してその後導電端子を半田
付けする必要があった。Furthermore, if solder is not applied in advance, not only is sufficient adhesive strength not obtained, but there are also disadvantages such as the so-called silver porosity phenomenon in which silver contained in the conductive film is likely to diffuse. Furthermore, in recent years there has been a trend to hide conductive terminals within the panel instead of exposing them, and in that case it was necessary to downsize the conductive terminals, connect lead wires in advance, and then solder the conductive terminals. .
しかしながら、従来の導電端子を熱風等で矢印方向に吹
き付けて、半田付けする方法では、リード線被覆を焼損
する恐れがあり、歩留りが悪いという問題点があった。However, the conventional method of soldering conductive terminals by blowing them with hot air or the like in the direction of the arrow has the problem that the lead wire coating may be burned out, resulting in poor yield.
［発明の目的］
本発明はこのような点に鑑みてなされたものであり、前
記の欠点を解消するとともに接着強度も高い導電端子お
よびその接着方法を提供することを目的とする．
［問題点を解決するための手段］
本発明は、板ガラス面上に形成された導電膜に接着され
る一対の台座を有し、該台座を連結するブリソジ部の一
方の側方部に端子部が連結された導電端子において、少
なくとも一部の台座の幅をブリッジ部の幅より小さ《す
るか、少なくとも一部の台座の断面積を０．５ｍｍ２〜
１．８ｍｍ２とじたことを特徴とし、接着方法はこの導
電端子の台座の周辺部から上部表面部にかけて、溶融半
田を被着させるようにしたことを特徴とする．［作用１
本発明は、少なくとも一部の台座の幅をブリッジ部の幅
より小さくするか、少なくとも一部の台座の断面積を０
．５ｍｍ２〜１、８ｍｍ２として、従来のものより小型
化をはかり、溶融半田により接着することにより、加熱
時間が短くてすみ銀くわれ現象等導電膜に与える影響を
橿力少なく、同時にフラックス抜けが容易になり、接着
強度の低下も防止することができる．また、台座に半田
を盛り上げるように被着させることにより、導電端子の
接着強度も向上させることができる。[Object of the Invention] The present invention has been made in view of the above-mentioned points, and it is an object of the present invention to provide a conductive terminal that eliminates the above-mentioned drawbacks and also has high adhesive strength, and a method for adhering the same. [Means for Solving the Problems] The present invention has a pair of pedestals that are bonded to a conductive film formed on a plate glass surface, and a terminal portion is provided on one side of a brissage portion that connects the pedestals. In the conductive terminals connected to each other, the width of at least some of the pedestals is made smaller than the width of the bridge part, or the cross-sectional area of at least some of the pedestals is made to be 0.5 mm2 to 0.5 mm2.
It is characterized by a 1.8 mm2 binding method, and is characterized in that molten solder is applied from the periphery of the pedestal to the upper surface of the conductive terminal. [Operation 1] The present invention makes the width of at least some of the pedestals smaller than the width of the bridge part, or reduces the cross-sectional area of at least some of the pedestals to 0.
．． 5mm2 to 1,8mm2, which is smaller than conventional products, and is bonded with molten solder, which reduces heating time and reduces the effect of silver curling on the conductive film, and at the same time, facilitates flux removal. This also prevents a decrease in adhesive strength. Further, by applying solder to the base in a heaping manner, the adhesive strength of the conductive terminal can also be improved.
さらに詳細には、台座の少なくとも一部の断面積を０．
５ｍｍ２〜１．８ｍｍ２とすると、より好ましい。More specifically, the cross-sectional area of at least a portion of the pedestal is set to 0.
It is more preferable to set it to 5 mm2 to 1.8 mm2.
すなわち、車両用の導電端子はＪＩＳ規格Ｈ３１００に
引張強度が単位面積あたり２０ｋｇｆ／一以上と規定さ
れ、導電端子全体としても２０ｋｇ以上の引張強度が要
求されているので、台座の断面積は最低１−／２（台座
が一対あるので）すなわち０．５一あればよく、１．８
ｍｍ２を越えると、溶融半田による接着時間が長くなり
、銀くわれ現象等が発生する恐れがあるので、０．５ｍ
ｍ２〜１．８一の範囲が、よりその所期の目的を達成す
ることができる．［実施例］
以下、図面を参照しながら本発明を詳細に説明する。In other words, JIS standard H3100 stipulates that conductive terminals for vehicles have a tensile strength of 20 kgf/unit or more per unit area, and the conductive terminal as a whole is required to have a tensile strength of 20 kg or more, so the cross-sectional area of the pedestal must be at least 1. -/2 (because there is a pair of pedestals), that is, 0.51 is enough, and 1.8
If it exceeds 0.5 m2, the adhesion time with molten solder will be longer and there is a risk of silver cracking.
A range of m2 to 1.8 can better achieve the intended purpose. [Example] Hereinafter, the present invention will be described in detail with reference to the drawings.
第１図は本発明に係わる導電端子を表わす斜視図、第２
図〜第３図は、それぞれその他の変形例を表わす正面図
と台座部分のみを示す要部平面図、第４図は従来の導電
端子の接着例を表わす斜視図である．
ＬＬＬＬ
本発明の導電端子１は一対の台座２、２と、これらを連
結するブリッジ部３と、ブリッジ部３の一方の側方部に
連結される端子部４とから構成され、例えばｔ ＝０．
６ ｍ厚さの黄銅板を打ち抜いてプレス加工したもので
一枚の板から作製し、各部の寸法はブリッジ部３の幅Ｗ
′、台座２の幅Ｗ１台座２の長さしをそれぞれ２．５ｆ
ｉ、１，７闘、２ｆｉとし、台座２の断面積Ｗｔはほぼ
ｌ一としたものである．
このようにして得られた導電端子１は図示しないリード
線が接続され、導電膜への接着は次のような工程で行う
．
■板ガラス５に銀を含む導電ペーストにより加熱線条６
とブスパー７を導電膜として印刷、焼成して防曇ガラス
を作製する．
■この防曇ガラスに導電端子１を載置して、台座２近傍
でフラックス入り半田を半田鏝により溶融させ、一対の
台座２、２の周辺部から台座上部にかけて溶融された半
田８を被着させる．このようにして接着された導電端子
は接着強度のばらつきがなく、２０−ｆ以上の強度があ
り、接着時間も短時間であり、銀くわれ現象を生ずるこ
とがなかった．
実』［阿』−
第２図に示すように、一対の台座２、２の先端を曲げ、
台座裏面に空隙部Ｇを形成するようにして、その他の構
成は実施例１と同じにしたものである．
このような構成の導電端子により接着する七、溶融半田
が台座裏面の空隙部Ｇに回りこむので接着強度がさらに
向上し、より好ましい．そ［虻劃一
第３図（ａ）〜（ｅ）の台座のみを表わす平面図に示す
ような導電端子も採用可能である．（ａ）に示す例はブ
リッジ部の幅Ｗ゜を３■として台座の形状をＴ字形状と
して各部の寸法をＷ１−１．５鶴、Ｗ２ ＝ １ ．５
鶴、Ｌ１＝３．０■、Ｌ２＝３．０■としたもので、台
座の断面積ｗ，ｔ ，ｗ２ｔはそれぞれ０．９−、０．
９−となる．（ｂ）に示す例はプリッジ部の幅Ｗ′を３
■として台座を切り欠いて分割し、それぞれの幅Ｗｌを
１鶴、長さしを２■としたもので、台座の断面積ｗ１ｔ
は０．６−となる．
（Ｃ）に示す例はブリッジ部の幅Ｗ゛を３Ｍきして台座
を四角形状に切り欠いて、各部の寸法をｗ１＝ １ ．
０ｍ、Ｗｚ ＝ １ ．０ｍｍ、Ｌ＝３．０ｍとしたも
ので、台座の断面積ｗ，ｔＳｗ２ｔはそれぞれ０．６一
、０．６−となる．
また、（ｄ） 、（ｅ）に示すような例も採用可能であ
る．
以上、好適な実施例により説明したが、本発明はこれら
限定されるものではなく、種々の応用が可能である．
端子部については、各実施例のように垂直な部分のみか
ら構成されるもの以外にも、途中で水平方向に折曲げた
もの、途中に屈曲部を有するものなどであってもよい．
台座の構造については、実施例で示したように、各種の
ものが可能であるが、ブリッジ部と台座の接合部分の断
面積が第３図（ｅ）に示すように大きいものより、その
他の例に示すように比較的小さいほうが、半田付け時に
ブリッジ部の影響が少なく、熱容量が小さくなるので、
十分な加熱ができ接着時間も短くなり好ましい．また、
台座裏面は全体平面としてもよいが、実施例２に示すよ
うに空隙部を設けると溶融半田が裏面まで回り込むので
より好ましい．
［発明の効果］
本発明によれば、台座の少なくとも一部の幅をブリッジ
部より小さくするか、少なくとも一部の断面積を０．５
ｍｍ２〜１．８ｍｍ２とすることにより、導電端子を小
型化するとともに、この導電端子の台座周辺部から上部
表面にかけて、溶融半田を被着させることにより、フラ
ックス抜けがよく、銀くわれ現象を生ずることなく、短
時間に接着することができるものである．Figure 1 is a perspective view showing a conductive terminal according to the present invention, Figure 2 is a perspective view showing a conductive terminal according to the present invention;
3 to 3 are a front view showing other modified examples and a plan view of the main part showing only the pedestal portion, respectively, and FIG. 4 is a perspective view showing an example of bonding a conventional conductive terminal. LLLL The conductive terminal 1 of the present invention is composed of a pair of pedestals 2, 2, a bridge part 3 connecting these, and a terminal part 4 connected to one side part of the bridge part 3. For example, t = 0 ．．
It is made from a single plate by punching and pressing a 6 m thick brass plate, and the dimensions of each part are the width W of the bridge part 3.
', Width W of pedestal 2, Length of pedestal 2 is 2.5f each.
i, 1, 7, and 2fi, and the cross-sectional area Wt of the pedestal 2 is approximately l-1. A lead wire (not shown) is connected to the conductive terminal 1 thus obtained, and adhesion to the conductive film is carried out in the following steps. ■Heating wires 6 are made of conductive paste containing silver on plate glass 5.
and Buspar 7 are printed as conductive films and fired to produce anti-fog glass. ■ Place the conductive terminal 1 on this anti-fog glass, melt the flux-cored solder with a soldering iron near the pedestal 2, and apply the molten solder 8 from the periphery of the pair of pedestals 2 to the top of the pedestal. Let. The conductive terminals bonded in this way had no variation in adhesive strength, had a strength of 20-f or more, took a short bonding time, and did not suffer from the silver curling phenomenon. - As shown in Figure 2, bend the tips of the pair of pedestals 2, 2,
The other configurations were the same as in Example 1 except that a gap G was formed on the back surface of the pedestal. 7. The molten solder that is bonded by the conductive terminal having such a structure goes around the gap G on the back surface of the pedestal, which further improves the bonding strength, which is more preferable. It is also possible to employ conductive terminals as shown in the plan views of Figures 3(a) to 3(e) showing only the pedestal. In the example shown in (a), the width W of the bridge part is 3 cm, the shape of the pedestal is T-shaped, and the dimensions of each part are W1-1.5, W2 = 1. 5
Crane, L1 = 3.0■, L2 = 3.0■, and the cross-sectional areas w, t and w2t of the pedestal are 0.9- and 0.9-, respectively.
It becomes 9-. In the example shown in (b), the width W' of the bridge part is 3
The pedestal is cut out and divided as ■, and each has a width Wl of 1 crane and a length of 2■, and the cross-sectional area of the pedestal w1t.
becomes 0.6-. In the example shown in (C), the width W of the bridge part is 3M, the pedestal is cut into a rectangular shape, and the dimensions of each part are w1=1.
0m, Wz = 1. 0mm and L=3.0m, the cross-sectional areas w and tSw2t of the pedestal are 0.6- and 0.6-, respectively. Furthermore, examples such as those shown in (d) and (e) can also be adopted. Although the present invention has been described above using preferred embodiments, the present invention is not limited to these embodiments, and various applications are possible. As for the terminal part, instead of being composed only of vertical parts as in each embodiment, it may be bent horizontally in the middle, or have a bent part in the middle. As for the structure of the pedestal, various types are possible as shown in the examples, but other than the one in which the cross-sectional area of the joint part of the bridge part and the pedestal is large as shown in Fig. 3(e). As shown in the example, the smaller the bridge, the less the influence of the bridge part during soldering and the smaller the heat capacity.
It is preferable because sufficient heating can be achieved and the bonding time is short. Also,
The back surface of the pedestal may be entirely flat, but it is more preferable to provide a gap as shown in Example 2, since the molten solder can go around to the back surface. [Effects of the Invention] According to the present invention, the width of at least a portion of the pedestal is made smaller than that of the bridge portion, or the cross-sectional area of at least a portion of the pedestal is made 0.5
By setting the conductive terminal to a size of mm2 to 1.8 mm2, the conductive terminal can be miniaturized, and by applying molten solder from the periphery of the base to the upper surface of the conductive terminal, flux can be removed easily and the silver curling phenomenon can occur. It can be bonded in a short time without any problems.
第１図は本発明に係わる導電端子を表わす斜視図、第２
図〜第３図は、それぞれその他の変形例を表わす正面図
と台座部分のみを示す要部平面図、第４図は従来の導電
端子の接着例を表わす斜視図である．
ｌ・・・導電端子 ２、２・・・一対の台座３・・
・ブリッジ部 ４・・・端子部５・・・板ガラス
８・・・半田Figure 1 is a perspective view showing a conductive terminal according to the present invention, Figure 2 is a perspective view showing a conductive terminal according to the present invention;
3 to 3 are a front view showing other modified examples and a plan view of the main part showing only the pedestal portion, respectively, and FIG. 4 is a perspective view showing an example of bonding a conventional conductive terminal. l... Conductive terminal 2, 2... A pair of pedestals 3...
・Bridge part 4...Terminal part 5...Plate glass
8...Solder
Claims (2)
対の台座を有し、該台座を連結するブリッジ部の一方の
側方部に端子部が連結された導電端子において、少なく
とも一部の台座の幅をブリッジ部の幅より小さくするか
、少なくとも一部の台座の断面積を０．５ｍｍ＾２〜１
．８ｍｍ＾２としたことを特徴とする導電端子。(1) A conductive terminal that has a pair of pedestals that are bonded to a conductive film formed on a plate glass surface, and in which a terminal part is connected to one side part of a bridge part that connects the pedestals, at least partially. Make the width of the pedestal smaller than the width of the bridge part, or reduce the cross-sectional area of at least part of the pedestal to 0.5mm^2~1
．． A conductive terminal characterized by having a diameter of 8 mm^2.
対の台座を有し、該台座を連結するブリッジ部の一方の
側方部に端子部が連結された導電端子の接着方法におい
て、少なくとも一部の台座の幅をブリッジ部の幅より小
さくするか、少なくとも一部の台座の断面積を０．５ｍ
ｍ＾２〜１．８ｍｍ＾２とした導電端子に、溶融半田を
少なくとも該台座の周辺部から上部表面にかけて被着さ
せるようにしたことを特徴とする導電端子の接着方法。(2) In a method for adhering a conductive terminal, the conductive terminal has a pair of pedestals to be adhered to a conductive film formed on a plate glass surface, and a terminal part is connected to one side part of a bridge part that connects the pedestals, The width of at least some of the pedestals is smaller than the width of the bridge part, or the cross-sectional area of at least some of the pedestals is 0.5 m.
A method for adhering a conductive terminal, characterized in that molten solder is applied to the conductive terminal having a thickness of m^2 to 1.8 mm^2 from at least the peripheral portion to the upper surface of the pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1395490A JPH03218103A (en) | 1990-01-24 | 1990-01-24 | Conductor terminal and its bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1395490A JPH03218103A (en) | 1990-01-24 | 1990-01-24 | Conductor terminal and its bonding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03218103A true JPH03218103A (en) | 1991-09-25 |
Family
ID=11847605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1395490A Pending JPH03218103A (en) | 1990-01-24 | 1990-01-24 | Conductor terminal and its bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03218103A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012104708A (en) * | 2010-11-11 | 2012-05-31 | Shindengen Electric Mfg Co Ltd | Connection plate, joint structure, and semiconductor device |
-
1990
- 1990-01-24 JP JP1395490A patent/JPH03218103A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012104708A (en) * | 2010-11-11 | 2012-05-31 | Shindengen Electric Mfg Co Ltd | Connection plate, joint structure, and semiconductor device |
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