JPH03215695A - Sliding member - Google Patents
Sliding memberInfo
- Publication number
- JPH03215695A JPH03215695A JP1012090A JP1012090A JPH03215695A JP H03215695 A JPH03215695 A JP H03215695A JP 1012090 A JP1012090 A JP 1012090A JP 1012090 A JP1012090 A JP 1012090A JP H03215695 A JPH03215695 A JP H03215695A
- Authority
- JP
- Japan
- Prior art keywords
- surface layer
- alloy
- plane
- sliding
- sliding member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002344 surface layer Substances 0.000 claims abstract description 49
- 239000013078 crystal Substances 0.000 claims abstract description 30
- 229910000978 Pb alloy Inorganic materials 0.000 claims abstract description 28
- 230000013011 mating Effects 0.000 claims abstract description 6
- 229910052709 silver Inorganic materials 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 229910052738 indium Inorganic materials 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 abstract description 13
- 239000010949 copper Substances 0.000 abstract description 10
- 239000000203 mixture Substances 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 229910000831 Steel Inorganic materials 0.000 abstract description 2
- 229910052745 lead Inorganic materials 0.000 abstract description 2
- 239000010959 steel Substances 0.000 abstract description 2
- 229910052718 tin Inorganic materials 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000000635 electron micrograph Methods 0.000 description 3
- 238000001000 micrograph Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- 229910020658 PbSn Inorganic materials 0.000 description 1
- 101150071746 Pbsn gene Proteins 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910018956 Sn—In Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 102220033831 rs145989498 Human genes 0.000 description 1
Landscapes
- Sliding-Contact Bearings (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
Ａ．発明の目的
（１）産業上の利用分野
本発明は摺動部材、特に、相手部材との摺動面側に、Ｐ
ｂ合金からなる表面層を備えた摺動部材に関する。[Detailed Description of the Invention] A. Purpose of the Invention (1) Industrial Application Field The present invention provides a sliding member, particularly a P
The present invention relates to a sliding member having a surface layer made of b-alloy.
（２）従来の技術
従来、この種摺動部材として、前記表面層をＰｂ−Ｓｎ
系合金より構成した平面軸受が知られている（特開昭５
６−９６０８８号公報参照）。(2) Conventional technology Conventionally, in this type of sliding member, the surface layer was made of Pb-Sn.
Planar bearings made of alloys are known (Japanese Patent Application Laid-open No. 5
6-96088).
（３）発明が解決しようとする課題
この種平面軸受は、エンジンにおけるクランクシャフト
のジャーナル部、コンロッドの大端部等に適用されてい
るが、エンジンが高速、且つ高出力化の傾向にある現在
の状況下では、従来の平面軸受は、その表面層の耐焼付
き性が乏しいという問題がある．これは、表面層を構成
するＰｂ−ｓｎ系合金の結晶形態に起因するもので、そ
の結晶形態は結晶面がランダムに配向したものである。(3) Problems to be Solved by the Invention This type of flat bearing is applied to the journal part of the crankshaft, the large end of the connecting rod, etc. in engines, but now that engines are becoming faster and more powerful. Under these conditions, conventional flat bearings have a problem in that their surface layer has poor seizure resistance. This is due to the crystal form of the Pb-sn alloy constituting the surface layer, in which the crystal planes are randomly oriented.
本発明は飾記に鑑み、Ｐｂに対するＳｎの配合量を特定
すると共にＰｂ合金の結晶形態を特定することにより、
表面層の耐焼付き性を向上させた前記摺動部材を提供す
ることを目的とする。In view of the above, the present invention specifies the blending amount of Sn with respect to Pb and specifies the crystal form of the Pb alloy.
It is an object of the present invention to provide the above-mentioned sliding member whose surface layer has improved seizure resistance.
Ｂ．発明の構成
（１） 課題を解決するための手段
本発明は、相手部材との摺動面側に、Ｐｂ合金からなる
表面層を備えた摺動部材において、前記Ｐｂ合金は３重
量％以上、２０重量％以下のＳｎを含有し、また前記Ｐ
ｂ合金の結晶形態は、略単一方向に配向した結晶面を持
つ形態であることを特徴とする。B. Structure of the Invention (1) Means for Solving the Problems The present invention provides a sliding member having a surface layer made of a Pb alloy on the sliding surface side with a mating member, the Pb alloy containing 3% by weight or more; Contains 20% by weight or less of Sn, and the P
The crystal form of the b alloy is characterized by having crystal planes oriented in approximately a single direction.
（２）作 用
Ｐｂ合金において、Ｓｎの含有量を前記のように特定し
、またその結晶形態を前記のように特定すると、表面層
の耐焼付き性を向上させ、また表面層に耐疲労性を具備
させることができる。(2) Effect When the content of Sn in the Pb alloy is specified as described above, and its crystal form is specified as described above, the seizure resistance of the surface layer is improved, and the surface layer has fatigue resistance. can be equipped with.
たりし、Ｓｎの含有量が３重量％未満であると、表面層
の耐疲労性が低下し、一方、２０重置％を上回ると、表
面層の耐焼付き性が低下する。However, if the Sn content is less than 3% by weight, the fatigue resistance of the surface layer decreases, while if it exceeds 20% by weight, the seizure resistance of the surface layer decreases.
（３）実施例
第１．第２図において、摺動部材としての平面軸受ｌは
、エンジンにおけるクランクシャフトのジャーナル部、
コンロッドの大端部等に適用されるもので、第１および
第２半体１ｔ，ｌｚよりなる。両半体１＋，Ｉｇは同一
構造を有し、裏金２と、その裏金２の相手部材との摺動
面側に形成されたライニング層３と、そのライニング層
３０表面に形成された表面層４とを備えている。裏金２
およびライニング層３間には銅メッキ層が、またライニ
ング層３および表面層４間にはニッケルメッキバリャ層
がそれぞれ必要に応じて設けられる．裏金２は圧延鋼板
より構成され、その厚さは平面輪受ｌの設定厚さにより
決められる。ライニング層３は銅、銅系合金、アルミニ
ウム、アルミニウム系合金等より構成され、その厚今は
５０〜５００μｍ、通常は３０９μｍ程度である。表面
層４はＰｂ合金より構成され、その厚さは５〜５０μｍ
、通常は２０μｍ程度である．
表面層４を構成するＰｂ合金は、８０〜９０重量％のＰ
ｂと３〜２０重量％のＳｎとを含有し、必要に応じてＣ
ｕ，Ｉｎ，Ａｇから選択される少なくとも一種をｌＯ重
量％以下含有する。(3) Example 1. In FIG. 2, a plane bearing l as a sliding member is attached to a journal portion of a crankshaft in an engine.
It is applied to the large end of a connecting rod, etc., and consists of a first and second half 1t, 1z. Both halves 1+ and Ig have the same structure, and include a backing metal 2, a lining layer 3 formed on the sliding surface side of the mating member of the backing metal 2, and a surface layer 4 formed on the surface of the lining layer 30. It is equipped with Secret money 2
A copper plating layer is provided between the lining layers 3, and a nickel plating barrier layer is provided between the lining layer 3 and the surface layer 4, as required. The back plate 2 is made of a rolled steel plate, and its thickness is determined by the set thickness of the flat wheel support l. The lining layer 3 is made of copper, copper alloy, aluminum, aluminum alloy, etc., and has a thickness of 50 to 500 μm, usually about 309 μm. The surface layer 4 is made of Pb alloy and has a thickness of 5 to 50 μm.
, usually about 20 μm. The Pb alloy constituting the surface layer 4 contains 80 to 90% by weight of P.
b and 3 to 20% by weight of Sn, and optionally C.
Contains at least 10% by weight of at least one selected from u, In, and Ag.
Ｃｕは表面層４の硬さを向上させる機能を有するが、そ
の含有量が１０重量％を上回ると、硬さが高くなり過ぎ
て相手部材の摩耗量が増加する．Ｃｕを添加する場合に
哄、表面層４の硬さＨ ｍ ｖが１７〜２０になるよう
に、その含有量を調整するのが望ましい．
ＩｎおよびＡｇは、表面層４を軟化して初期なじみ特性
を改善する機能を有するが、その含有量が１０重量％を
上回ると、表面層４の強度が低下する。Ｉｎ，Ａｇを添
加する場合には、表面層４の硬さＨｍｖが１２〜ｌ５に
なるように、その含有量を調整するのが望ましい．
表面層４は、電気メッキ法により形成されるもので、メ
ッキ液としては、４０〜１ ８ ０ ｇ／Ｉ！のＰｂ”
、１．５ 〜３５ｇ／ｊ！のＳｎ”、必要に応じて１
５ ｇ／ｌ以下のＣｕ”を含むホウフッ化系メッキ液が
用いられる。またメッキ液の温度は１０〜３５゜Ｃ１陰
極電流密度は２〜１５Ａ／ｄｍ”にそれぞれ設定される
。Cu has the function of improving the hardness of the surface layer 4, but if its content exceeds 10% by weight, the hardness becomes too high and the amount of wear of the mating member increases. When adding Cu, it is desirable to adjust its content so that the hardness H mv of the surface layer 4 is 17 to 20. In and Ag have the function of softening the surface layer 4 and improving the initial break-in characteristics, but when their content exceeds 10% by weight, the strength of the surface layer 4 decreases. When adding In and Ag, it is desirable to adjust their content so that the hardness Hmv of the surface layer 4 is 12 to 15. The surface layer 4 is formed by electroplating, and the plating solution is 40 to 180 g/I! of Pb”
, 1.5 ~ 35g/j! Sn”, 1 if necessary
A borofluoride plating solution containing less than 5 g/l of Cu is used.The temperature of the plating solution is set at 10-35° C1, and the cathode current density is set at 2-15 A/dm.
第３図は表面層４の摺動面４ａにおける金属組織を示す
電子顕微鏡写真（１０．０００倍）である。この表面層
４は８重量％のＳｎと、２重量％のＣｕとを含有するＰ
ｂ合金よりなる。その表面層４は銅合金製ライニング層
３上に形成され、表面層４を形成する際の電気メッキ処
理における陰極電流密度は８Ａ／ｄｍ”に設定された。FIG. 3 is an electron micrograph (10.000x magnification) showing the metal structure on the sliding surface 4a of the surface layer 4. This surface layer 4 contains P containing 8% by weight of Sn and 2% by weight of Cu.
Made of b alloy. The surface layer 4 was formed on the copper alloy lining layer 3, and the cathode current density in the electroplating process when forming the surface layer 4 was set to 8 A/dm''.
摺動面４ａにおけるＰｂ合金の結晶は、頂点を摺動面４
ａに向けた四角錐体をなし、その４つの斜面はミラー指
数で（１１．１）面に平行な面に属する。The Pb alloy crystal on the sliding surface 4a has its apex aligned with the sliding surface 4.
It forms a quadrangular pyramid facing toward a, and its four slopes belong to planes parallel to the (11.1) plane with Miller indices.
第４図は前記Ｐｂ合金のＸ線回折図であり、ミラー指数
で（２００）面および（４００）面の回折ピークのみが
認められる。FIG. 4 is an X-ray diffraction diagram of the Pb alloy, in which only the diffraction peaks of the (200) plane and (400) plane are observed in Miller index.
こ一で、結晶面の配同性を表わす指数として配向指数Ｏ
ｅを、
Σ Ｉ ｈｋｆ
（但し、ｈｋＩ！．はミラー指数、
Ｉｈｋｆは（ｈｋｊ！）面の積分強度、Σｈｋｆｆｉは
Ｉ ｈｋｆｆｉの総和）と定義すると、或（ｈｋｆ）面
において、その配向指数Ｏｅが１００％に近ければ近い
程、その（ｈｋｊ２）面と直交する方向へ配向した結晶
面が多いことになる。In this case, the orientation index O is used as an index expressing the orientation of the crystal plane.
If e is defined as Σ I hkf (where hkI!. is the Miller index, Ihkf is the integrated intensity of the (hkj!) plane, and Σhkffi is the sum of I hkffi), then in a certain (hkf) plane, the orientation index Oe is The closer it is to 100%, the more crystal planes are oriented in the direction perpendicular to the (hkj2) plane.
前記Ｐｂ合金（７）（２００）面および（４００）面に
おける積分強度１ ｈｋｊ２および配向指数Ｏｅは表Ｉ
の通りである。The integrated strength 1 hkj2 and orientation index Oe in the (200) plane and (400) plane of the Pb alloy (7) are shown in Table I.
It is as follows.
表 Ｉ
表Ｉより、前記Ｐｂ合金の（ｈ００）面における配向指
数Ｏｅは１００％であり、したがってＰｂ合金は結晶軸
ａ，ｂ，ｃにおいて各軸方向に配向した結晶面、即ち（
ｈ００）面を持つことになる。Table I From Table I, the orientation index Oe in the (h00) plane of the Pb alloy is 100%, and therefore the Pb alloy has crystal planes oriented in each axis direction in the crystal axes a, b, and c, that is, (
h00) surface.
第５図は従来例表面層の摺動面における金属組織を示す
電子顕微鏡写真（１０，０００倍）である。この表面層
は８重量％のＳｎと、２重量％のＣｕとを含有するＰｂ
合金よりなり、表面層は電気メッキ処理により銅合金製
ライニング層上に形成されたもので、エンジン用クラン
クシャフトのジャーナル部に適用される。FIG. 5 is an electron micrograph (10,000 times magnification) showing the metal structure of the sliding surface of the conventional surface layer. This surface layer consists of Pb containing 8% by weight of Sn and 2% by weight of Cu.
It is made of an alloy, and the surface layer is formed on a copper alloy lining layer by electroplating, and is applied to the journal part of an engine crankshaft.
第６図は従来例Ｐｂ合金のＸ線回折図である。FIG. 6 is an X-ray diffraction diagram of a conventional Pb alloy.
本図からは特定の結晶面への配向は認められない。This figure does not show any orientation toward a specific crystal plane.
種々の（ｈｋｊ２）面における積分強度Ｔｈｋｆおよび
配向指数Ｏｅは表■の通りである。The integrated intensity Thkf and orientation index Oe in various (hkj2) planes are shown in Table 2.
表
■
第５図および表■から明らかなように、従来例Ｐｂ合金
の結晶形態は結晶面がランダムに配向した形態である。Table ■ As is clear from FIG. 5 and Table ■, the crystal morphology of the conventional Pb alloy is such that the crystal planes are randomly oriented.
表■は、各種平面軸受において、その表面層の組成、結
晶配同性、したがって配向指数Ｏｅ等を比較したもので
ある。Table (2) compares the composition of the surface layer, crystal orientation, and thus the orientation index Oe, etc. of various planar bearings.
本発明■は前記本発明におけるＰｂ合金（第３図）に該
当する．
本発明■は、本発明■に比べて陰極電流密度を１０Ａ／
ｄｍ”に変えたもので、それに伴い表面層の組成が異な
る．硬さは本発明Ｉに比べて向上している．
本発明■は、銅合金製ライニング層上にＰｂＳｎ合金メ
ッキを行い、次いでＩｎメッキを行い、その後熱拡散に
よりＰｂ−Ｓｎ−Ｉｎ合金を形成したものである．熱拡
散温度は１ ５ ０ ’Ｃで、処理時間は１時間である
．
比較例■は前記従来例におけるＰｂ合金（第５図）に該
当する。The present invention (■) corresponds to the Pb alloy (Fig. 3) in the present invention. The present invention (2) has a cathode current density of 10A/1 compared to the present invention (2).
dm", and the composition of the surface layer differs accordingly.The hardness is improved compared to Invention I. In Invention (2), PbSn alloy plating is performed on the copper alloy lining layer, and then In is plated, and then a Pb-Sn-In alloy is formed by thermal diffusion.The thermal diffusion temperature is 150'C, and the processing time is 1 hour.Comparative example This corresponds to alloys (Figure 5).
比較例■は本発明■と同一の組成を有する。Comparative Example (2) has the same composition as Invention (2).
比較例■は表面層を備えてお，らず、アルミニウム合金
製ライニング層が摺動面を形成している。Comparative Example (3) does not have a surface layer, but has an aluminum alloy lining layer forming the sliding surface.
そのアルミニウム合金は、１．７重量％のＰｂと、１２
重置％のＳｎと、０． ７重量％のＣｕと、０． ３重
量％のｓｂと、２．５重量％のＳｉとを含有する．第７
図は本発明１−ｆｆｌおよび比較例１ −１の焼付きテ
スト結果を示す．
焼付きテストは、回転軸に各平面軸受を摺擦させ、その
平面軸受に対する負荷荷重を漸次増加させることにより
行われ、第７図は各平面軸受の表面層（比較例■ではラ
イニング層）が焼付きを発生したときの面圧を求めたも
のである．テスト条件は次の通りである。回転軸の材質
ＪＩＳ Ｓ４８Ｃ材に窒化処理を施したもの、回転軸
の回転数 ６００Ｏｒｐｍ 、給油温度 １２０℃、給
油圧力 ３ ｋｇ／ｄ、負荷荷重 １ ｋｇ／ｓｅｃ
．第７図から明らかなように、本発明Ｉ〜ｍは比較例１
， ＩＩに比べて優れた耐焼付き性を有する．これは
、表面層におけるＰｂ合金の結晶形態に起因する。即ち
、本発明Ｉ〜■においては、Ｐｂ合金の結晶形態が、表
■から明らかなように（ｈ００）面における配向指数が
１００％であって、単一方向に配向した結晶面を持つ形
態であるが、比較例１， ＩＩにおいてはＰｂ合金の
結晶形態がランダム配向した結晶面を持つ形態であるか
らである。The aluminum alloy contains 1.7% by weight of Pb and 12% by weight of Pb.
Overlapping % of Sn and 0. 7% by weight of Cu and 0. Contains 3% by weight of sb and 2.5% by weight of Si. 7th
The figure shows the seizure test results for Invention 1-ffl and Comparative Example 1-1. The seizure test was carried out by sliding each plane bearing against the rotating shaft and gradually increasing the load applied to the plane bearing. Figure 7 shows that the surface layer of each plane bearing (the lining layer in comparative example The surface pressure when seizure occurs is calculated. The test conditions are as follows. Material of rotating shaft: JIS S48C material subjected to nitriding treatment, rotation speed of rotating shaft: 600 rpm, oil supply temperature: 120°C, oil supply pressure: 3 kg/d, applied load: 1 kg/sec
．． As is clear from FIG. 7, the present invention I to m are Comparative Example 1
, has superior seizure resistance compared to II. This is due to the crystal morphology of the Pb alloy in the surface layer. That is, in the present inventions I to (2), the crystal form of the Pb alloy is such that the orientation index in the (h00) plane is 100% and the crystal plane is oriented in a single direction, as is clear from Table (3). However, in Comparative Examples 1 and II, the crystal form of the Pb alloy has randomly oriented crystal planes.
第８図は本発明における表面層の他の例を示し、そのＰ
ｂ合金の組成は本発明Ｉと同一であるが、陰極電流密度
をＩＯＡ／ｄｍ”に設定して、本発明Ｉの場合よりも高
くしたものである。FIG. 8 shows another example of the surface layer in the present invention, and its P
The composition of the alloy b is the same as that of the present invention I, but the cathode current density was set to IOA/dm'' to be higher than that of the present invention I.
この電子顕微鏡写真の倍率は第３図と同じ１０，０００
倍であるが、陰極電流密度を高くしたことに伴い第３図
に比べて四角錐体が大きく成長していることが判る。The magnification of this electron micrograph is 10,000, the same as in Figure 3.
Although it is twice as large, it can be seen that the square pyramids have grown larger compared to FIG. 3 due to the increased cathode current density.
このＰｂ合金の結晶配向性は、（ｈｏｏ）面における配
向指数Ｏｅが９７．５％、（１１１）面における配向指
数Ｏｅが１．３％であり、その結晶形態は略単一方向に
配向した結晶面を持つ形態である。The crystal orientation of this Pb alloy is that the orientation index Oe in the (hoo) plane is 97.5% and the orientation index Oe in the (111) plane is 1.3%, and the crystal morphology is oriented in approximately a single direction. It has a crystal plane.
表面層４の耐焼付き性を向上させるためには、（ｈ Ｏ
Ｏ）面における配向指数Ｏｅは５０〜１００％、好ま
しくは６０％以上に設定される。特に、苛酷な状況下に
おいて、耐焼付き性を要求されるときには、（ｈｏｅ）
面における配向指数Ｏｅは９７％以上に設定される。In order to improve the seizure resistance of the surface layer 4, (h O
The orientation index Oe in the O) plane is set to 50 to 100%, preferably 60% or more. Especially when seizure resistance is required under harsh conditions, (hoe)
The orientation index Oe in the plane is set to 97% or more.
なお、表面層にＡｇを含有させる場合には、Ｐｂ，Ｓｎ
イオンを含み、Ａｇイオンを添加したメッキ液を用いる
電気メッキ処理、といった手法が採用される。また本発
明における結晶面の配向方向は（ｈ００）面に限定され
るものではなく、例えば（１ １ １）面、（２２０）
面等に平行な結晶面でもよい。さらに本発明は平面軸受
に限らず、他の摺動部材にも適用される。In addition, when the surface layer contains Ag, Pb, Sn
A method such as electroplating using a plating solution containing ions and to which Ag ions are added is adopted. Furthermore, the orientation direction of the crystal plane in the present invention is not limited to the (h00) plane, for example, the (1 1 1) plane, the (220) plane,
It may be a crystal plane parallel to the plane or the like. Furthermore, the present invention is applicable not only to plane bearings but also to other sliding members.
Ｃ，発明の効果
本発明によれば、表面層を構成するＰｂ合金の組成およ
びその結晶形態を前記のように特定することによって、
表面層の耐焼付き性を向上させた摺動部材を提供するこ
とができる。C. Effects of the Invention According to the present invention, by specifying the composition and crystal form of the Pb alloy constituting the surface layer as described above,
A sliding member whose surface layer has improved seizure resistance can be provided.
第１．第２図は平面軸受を示し、第１図は分解平面図、
第２図は第１図■−■線断面図、第３図は本発明に係る
表面層の金属組織を示す顕微鏡写真、第４図は本発明に
係る表面層を構成するＰｂ合金のＸ線回折図、第５図は
従来例に係る表面層の金属組織を示す顕微鏡写真、第６
図は従来例に係る表面層を構成するＰｂ合金のＸ線回折
図、第７図は焼付きテスト結果を示すグラフ、第８図は
本発明に係る他の表面層の金属組織を示す顕微鏡写真で
ある。
ｌ・・・平面軸受（摺動部材）、４・・・表面層、４ａ
・・・摺動面
第１
図
第２図
第７図
ｌ
■
■
■
■
■
補正の内容
第８図
手続補正書，．）
こニ〕〃
平成
３年３
月−６日1st. Figure 2 shows a plane bearing, Figure 1 is an exploded plan view,
Figure 2 is a cross-sectional view taken along the line ■-■ in Figure 1, Figure 3 is a micrograph showing the metal structure of the surface layer according to the present invention, and Figure 4 is an X-ray of the Pb alloy constituting the surface layer according to the present invention. Diffraction diagram, Figure 5 is a micrograph showing the metal structure of the surface layer according to the conventional example, Figure 6 is
The figure is an X-ray diffraction diagram of the Pb alloy constituting the surface layer according to the conventional example, FIG. 7 is a graph showing the seizure test results, and FIG. 8 is a micrograph showing the metal structure of another surface layer according to the present invention. It is. l...Plane bearing (sliding member), 4...Surface layer, 4a
...Sliding surface No. 1 Fig. 2 Fig. 7 l ■ ■ ■ ■ ■ Contents of amendment Fig. 8 Procedural amendment. ) Koni〃 March-6, 1991
Claims (2)
層を備えた摺動部材において、前記Ｐｂ合金は３重量％
以上、２０重量％以下のＳｎを含有し、また前記Ｐｂ合
金の結晶形態は、略単一方向に配向した結晶面を持つ形
態であることを特徴とする摺動部材。(1) In a sliding member having a surface layer made of a Pb alloy on the sliding surface side with a mating member, the Pb alloy is 3% by weight.
The above sliding member contains 20% by weight or less of Sn, and the crystal form of the Pb alloy is such that the crystal planes are oriented in substantially a single direction.
る少なくとも一種を１０重量％以下含有している、第（
１）項記載の摺動部材。(2) The Pb alloy contains 10% by weight or less of at least one selected from Cu, In, and Ag.
The sliding member described in item 1).
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010120A JP2519557B2 (en) | 1990-01-19 | 1990-01-19 | Sliding member |
| DE4101386A DE4101386C2 (en) | 1990-01-19 | 1991-01-18 | Slider |
| CA002034568A CA2034568C (en) | 1990-01-19 | 1991-01-18 | Slide member |
| GB9101144A GB2240343B (en) | 1990-01-19 | 1991-01-18 | Slide member |
| US07/989,733 US5310606A (en) | 1990-01-19 | 1992-12-10 | Slide member |
| US08/240,018 US5468567A (en) | 1990-01-19 | 1994-05-09 | Slide member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010120A JP2519557B2 (en) | 1990-01-19 | 1990-01-19 | Sliding member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03215695A true JPH03215695A (en) | 1991-09-20 |
| JP2519557B2 JP2519557B2 (en) | 1996-07-31 |
Family
ID=11741440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010120A Expired - Lifetime JP2519557B2 (en) | 1990-01-19 | 1990-01-19 | Sliding member |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2519557B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0525687A (en) * | 1991-07-18 | 1993-02-02 | Honda Motor Co Ltd | Sliding member |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5696088A (en) * | 1979-12-28 | 1981-08-03 | Taiho Kogyo Co Ltd | Bearing for internal combustion engine and its manufacture |
| JPS579635A (en) * | 1980-06-02 | 1982-01-19 | Deiparoreitaa Corp Ltd | Depalletizer |
| JPS6113016A (en) * | 1984-06-28 | 1986-01-21 | Toyota Motor Corp | Connecting rod |
| JPS6199648A (en) * | 1984-10-20 | 1986-05-17 | Taiho Kogyo Co Ltd | Plated alloy for overlaying |
| JPS6220915A (en) * | 1985-07-18 | 1987-01-29 | N D C Kk | Plain bearing |
-
1990
- 1990-01-19 JP JP2010120A patent/JP2519557B2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5696088A (en) * | 1979-12-28 | 1981-08-03 | Taiho Kogyo Co Ltd | Bearing for internal combustion engine and its manufacture |
| JPS579635A (en) * | 1980-06-02 | 1982-01-19 | Deiparoreitaa Corp Ltd | Depalletizer |
| JPS6113016A (en) * | 1984-06-28 | 1986-01-21 | Toyota Motor Corp | Connecting rod |
| JPS6199648A (en) * | 1984-10-20 | 1986-05-17 | Taiho Kogyo Co Ltd | Plated alloy for overlaying |
| JPS6220915A (en) * | 1985-07-18 | 1987-01-29 | N D C Kk | Plain bearing |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0525687A (en) * | 1991-07-18 | 1993-02-02 | Honda Motor Co Ltd | Sliding member |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2519557B2 (en) | 1996-07-31 |
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