JPH03212995A - Frame ground structure of conductive resin cover - Google Patents
Frame ground structure of conductive resin coverInfo
- Publication number
- JPH03212995A JPH03212995A JP927090A JP927090A JPH03212995A JP H03212995 A JPH03212995 A JP H03212995A JP 927090 A JP927090 A JP 927090A JP 927090 A JP927090 A JP 927090A JP H03212995 A JPH03212995 A JP H03212995A
- Authority
- JP
- Japan
- Prior art keywords
- cover
- spike
- resin
- conductive
- upper cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 52
- 229920005989 resin Polymers 0.000 title claims abstract description 52
- 238000010079 rubber tapping Methods 0.000 abstract description 17
- 239000011231 conductive filler Substances 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 3
- 239000002184 metal Substances 0.000 description 16
- 238000000465 moulding Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000009732 tufting Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、電磁波をシールドするために導電性樹脂を
使用した電子装置の筐体カバーを電気的に接地する部分
の構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a structure for electrically grounding a housing cover of an electronic device using conductive resin to shield electromagnetic waves.
（従来の技ｊネｉ）
電子装置の筐体カバーは、樹脂製のものが主流となって
いる。電子装置の筐体カバーには電磁波の遮蔽能が要求
されることが多いが、樹脂それ自体には電磁波を遮蔽す
る作用がないので、樹脂製のカバーにシールド作用を付
与する手段として、従来は導電塗装や無電解メツキが行
われてきた。(Conventional Technique) Housing covers for electronic devices are mainly made of resin. Case covers of electronic devices are often required to have the ability to shield electromagnetic waves, but since resin itself does not have the effect of shielding electromagnetic waves, conventional methods have been used to provide shielding effects to resin covers. Conductive coating and electroless plating have been used.
しかしながら塗装やメツキによって樹脂カバーの表面に
導電層を形成する方法は、樹脂カバー成形後に塗装やメ
ツキを行わねばならないので、製造工数が多くなって製
造コストが高くなるという欠点があり、また、使用中に
導電層が本体から剥離する危険があるという欠点がある
。However, the method of forming a conductive layer on the surface of the resin cover by painting or plating has the disadvantage that painting or plating must be performed after the resin cover is molded, which increases the number of manufacturing steps and increases the manufacturing cost. The disadvantage is that there is a risk that the conductive layer may peel off from the main body.
そこで製造コストの低減と生産性の向上を図るために、
金属フィラーやカーボンブランクなどの導電フィラーを
混入した導電性樹脂を筐体カバーの材料として用いるこ
とが試みられζいる。導電性樹脂で筐体カバーを製造し
たときの一つの問題は、樹脂に混入された導電フィラー
が成形品の表面に表れず、成形品の表面には樹脂の薄い
スキン層が形成されるため、単に金属板等の接続片を筐
体カバーの表面に接触させただけでは、内部の導電フィ
ラーと接続片との電気的な導通が保証されない問題があ
る。たとえば、導電塗装や無電解メツキを施した筐体カ
バーであれば、カバー相互の嵌合部は単に両者を当接さ
せてやれば導通されるが、導電性樹脂を用いた筐体カバ
ーでは、単にカバー相互を嵌合さゼただけでは両者が電
気的に導通されることはない。Therefore, in order to reduce manufacturing costs and improve productivity,
Attempts have been made to use conductive resin mixed with conductive filler such as metal filler or carbon blank as a material for the housing cover. One problem when manufacturing a housing cover with conductive resin is that the conductive filler mixed into the resin does not appear on the surface of the molded product, and a thin skin layer of resin is formed on the surface of the molded product. There is a problem in that simply bringing a connecting piece such as a metal plate into contact with the surface of the housing cover does not guarantee electrical continuity between the internal conductive filler and the connecting piece. For example, if the housing cover is coated with conductive coating or electroless plating, the fitting parts of the covers will be electrically connected by simply touching them together, but with a housing cover made of conductive resin, Simply fitting the covers together will not establish electrical continuity between them.
この問題を解決する一つの手段として、特開昭６３−２
１７６９８号公報には、導電性樹脂カバーにネジ穴を設
けた金属チップを表面が露出するようにインモールドし
、前記ネジ穴を貫通して導電性樹脂内に螺入されるタッ
ピングネジによりフレームグランド用の接続片を前記金
属チップに締着することにより、導電性樹脂カバーと当
該接続片とを電気的に導通させる構造が提唱されている
。As one means to solve this problem, JP-A-63-2
Publication No. 17698 discloses that a metal chip with a screw hole provided in a conductive resin cover is in-molded so that the surface is exposed, and a frame ground is connected by a tapping screw that passes through the screw hole and is screwed into the conductive resin. A structure has been proposed in which the conductive resin cover and the connecting piece are electrically connected by fastening the connecting piece to the metal chip.
（発明が解決しようとする課題）
上記公報に開示された構造は、タッピングネジのネジを
導電性樹脂に食い込ませることによって導電性樹脂とタ
ッピングネジとを導通し、タッピングネジを金属チップ
のネジ穴に螺合することによってタンピングネジと金属
チップを導通し、金属チップの露出した表面にフレーム
グランド用接続片を締着することによって金属チップと
当該接続片とを導通させている。この構造の金属チップ
は導電性樹脂内にモールディングされているが、導電性
樹脂と金属チップの境界面には成形品の表面と同様な樹
脂のスキン層が形成されるから、金属チップと導電性樹
脂との直接接触による導通はあまりルｊ待できない。そ
して上記構造では、樹脂カバー成形時に金属チップをモ
ールディングしてやる必要があり、そのために樹脂カバ
ーの成形が面倒になるという欠点がある。特に高いシー
ルド効果を得るためには、樹脂カバーを複数箇所′ζ１
妾地する必要があり、そのためには金属チップも複数個
モールドしてお（必要があるから、成形型内への金属デ
ツプの装着作業が樹脂カバーの成形ナイクルを低下させ
るという問題が出てくる。(Problems to be Solved by the Invention) The structure disclosed in the above publication has electrical continuity between the conductive resin and the tapping screw by biting the screw of the tapping screw into the conductive resin, and connects the tapping screw to the screw hole of the metal chip. The tamping screw and the metal tip are electrically connected by screwing together, and the metal chip and the connection piece are electrically connected by tightening the frame ground connecting piece to the exposed surface of the metal chip. The metal chip with this structure is molded in a conductive resin, but a skin layer of resin similar to the surface of the molded product is formed at the interface between the conductive resin and the metal chip, so the metal chip and the conductive Conductivity due to direct contact with the resin cannot be expected very much. The above structure has the disadvantage that it is necessary to mold the metal chip when molding the resin cover, which makes molding the resin cover troublesome. In order to obtain a particularly high shielding effect, it is necessary to install the resin cover in multiple places'ζ1.
In order to do this, it is necessary to mold multiple metal chips (because it is necessary to do so, the problem arises that the work of installing metal chips into the mold reduces the molding strength of the resin cover). .
この発明は上記問題を解決して、より工数がかからず、
かつ導電性樹脂カバー内の導電フィラーとの電気的接続
がより確実にできるフレームグランド構造を提供しよう
とするものである。This invention solves the above problems and requires less man-hours.
Moreover, it is an object of the present invention to provide a frame ground structure that allows for more reliable electrical connection with the conductive filler in the conductive resin cover.
（課題を解決するための手段）
上記課題を解決するため、この発明では、導電性樹脂カ
バー１ （１ａ，１ｂを示す。以下同じ。）に固定され
るフレームグランド用接続片２ （２ａ、２ｂを示す。(Means for Solving the Problems) In order to solve the above problems, the present invention provides a frame ground connection piece 2 (2a, 2b shows.
以下同じ。）の固定端に透孔５．６とこれに隣接するス
パイク７とを備えた座８．８ａを設け、前記透孔５．６
に挿通したタフピングネジ３を導電性樹脂カバー１に螺
太し、その締結力によって前記スパイク７を導電性樹脂
カバー１に刺入することにより、当該接続片２を導電性
樹脂カバー１に固定する＋１４造を採用している。same as below. ) is provided with a seat 8.8a having a through hole 5.6 and a spike 7 adjacent thereto at the fixed end of the through hole 5.6.
The connecting piece 2 is fixed to the conductive resin cover 1 by screwing the tuffing screw 3 inserted through the conductive resin cover 1 into the conductive resin cover 1 and inserting the spike 7 into the conductive resin cover 1 using the fastening force. The structure is adopted.
（作用）
上記構造によれば、タッピングネジ３の螺条９が、λｌ
電性樹脂カバー１の内部に食い込むことによって、樹脂
カバー内の導電フィラーとタッピングネジ３とが導通さ
れるとともに、座８．８ａに形成したスパイク７がタッ
ピングネジ３の締結力によって樹脂カバー１内に食い込
むことにより、樹脂カバー内部の導電フィラーとフレー
ムグランド用接続片２とが直接導通される。従って、従
来構造のものより樹脂カバー内部の導電フィラーと接続
片２との導通通路が多くなり、それだけ両者の間の接触
が保証される。また樹脂カバーを成形する際に金属チッ
プなどをモールドする必要がないから、カバーの成形サ
イクルも速くなり、成形作業もより容易になる。(Function) According to the above structure, the thread 9 of the tapping screw 3 is λl
By biting into the inside of the conductive resin cover 1, the conductive filler inside the resin cover and the tapping screw 3 are electrically connected, and the spike 7 formed on the seat 8.8a is pushed inside the resin cover 1 by the fastening force of the tapping screw 3. By biting into the resin cover, the conductive filler inside the resin cover and the frame ground connection piece 2 are directly electrically connected. Therefore, there are more conductive paths between the conductive filler inside the resin cover and the connecting piece 2 than in the conventional structure, and the contact between the two is guaranteed accordingly. Furthermore, since there is no need to mold metal chips or the like when molding the resin cover, the molding cycle for the cover becomes faster and the molding work becomes easier.
（実施例）
第１図ないし第６図は、この発明の実施例を示した図で
ある。第５図はこの発明の構造が採用された筐体カバー
の一例を示す図で、導電性樹脂製の上カバー１ａと下カ
バー１ｂの嵌合部にこの考案の構造が採用され、上カバ
ー１ａと下カバー１ｂｌＪ＜電気的に導通されている。(Embodiment) FIGS. 1 to 6 are diagrams showing an embodiment of the present invention. FIG. 5 is a diagram showing an example of a housing cover in which the structure of the present invention is adopted, in which the structure of this invention is adopted in the fitting part of the upper cover 1a and the lower cover 1b made of conductive resin, and the upper cover 1a is made of conductive resin. and the lower cover 1blJ are electrically connected.
ここで２ａは上カバー１ａの開口部周縁にタッピングネ
ジ３で固定された接続スプリング、２ｂは下カバー１ｂ
の開口部周縁にタッピングネジ３で固定された接続板で
ある。接続スプリング２ａと接続板２ｂとは、第６図に
示すように、接続スプリング２ａの弾性力によって接続
スプリング２ａと接続板２ｂとが接触することにより電
気的に導通される。図の接続スプリング２ａは、舌片４
・・・・を櫛歯状に設けているが、これは上カバー１ａ
と下カバー１ｂとの嵌合部の隙間から電磁波が漏洩する
のを防止する効果も兼ね備えるような形状としたもので
ある。Here, 2a is a connection spring fixed to the periphery of the opening of the upper cover 1a with a tapping screw 3, and 2b is the lower cover 1b.
This is a connection plate fixed to the periphery of the opening with tapping screws 3. As shown in FIG. 6, the connection spring 2a and the connection plate 2b are brought into contact with each other by the elastic force of the connection spring 2a, so that the connection spring 2a and the connection plate 2b are electrically connected to each other. The connection spring 2a in the figure is connected to the tongue piece 4.
... is provided in a comb-like shape, but this is the upper cover 1a.
The shape is such that it also has the effect of preventing electromagnetic waves from leaking from the gap between the fitting portion of the lower cover 1b and the lower cover 1b.
第１図は、接続スプリング２ａを上カバー１ａに締結し
ている部分の拡大断面図である。接続スプリング２ａの
固定端には、取付孔５が設けられ、第２図に示すような
中心孔６とスパイク７を備えた座金８が上記取付孔５と
中心孔６とを一致さ−Ｕた状態で重ね合わされ、取付孔
５および中心孔６を貫通するタッピングネジ３によって
接続スプリング２ａの基端が上カバー１ａに締着されて
いる。FIG. 1 is an enlarged sectional view of a portion where the connection spring 2a is fastened to the upper cover 1a. A mounting hole 5 is provided at the fixed end of the connection spring 2a, and a washer 8 having a center hole 6 and a spike 7 as shown in FIG. The proximal end of the connecting spring 2a is fastened to the upper cover 1a by a tapping screw 3 passing through the mounting hole 5 and the center hole 6.
クツピングネジ３の螺条９は、上カバー１ａの内部に食
い込んでおり、上カバーｌａ内の導電フィラーと接触し
ている。一方、座金８は、タッピングネジ３の締着力に
より、上カバー１ａの座面に締着され、座金に形成した
スパイク７が上カバーのスキン層１０を破って上カバー
ｌａ内に刺し込まれている。従って、樹脂カバー内部の
導電フィラーはこのスパイク７にも接触しており、スパ
イク７から座金８を得て接続スプリング２ａに接続され
ている。The thread 9 of the coupling screw 3 bites into the inside of the upper cover 1a, and is in contact with the conductive filler inside the upper cover la. On the other hand, the washer 8 is fastened to the seat surface of the top cover 1a by the fastening force of the tapping screw 3, and the spikes 7 formed on the washer break the skin layer 10 of the top cover and are inserted into the top cover la. There is. Therefore, the conductive filler inside the resin cover is also in contact with this spike 7, and the washer 8 is obtained from the spike 7 and connected to the connection spring 2a.
第３図は、座金８の他の実施例を示したもので、座金８
の中心孔６を打ち抜き成形する際に、その周囲にスパイ
ク７を折り曲げによって形成できることを示したもので
ある。この座金８と接続スプリング２ａの固定端とは、
スポット溶接等により溶着してもよく、またタフピング
ネジ３の締着力により単に相互に締結される構造であっ
てもよい。FIG. 3 shows another embodiment of the washer 8.
This shows that the spikes 7 can be formed around the center hole 6 by bending when punching and forming the center hole 6. This washer 8 and the fixed end of the connection spring 2a are
They may be welded by spot welding or the like, or they may be simply fastened together by the tightening force of the tufting screws 3.
なお、第１図は接続スプリング２ａの締着部分の構造を
示したものであるが、第５．６図に示した接続板２ｂの
締着部分も同様な構造である。Although FIG. 1 shows the structure of the fastening portion of the connection spring 2a, the fastening portion of the connection plate 2b shown in FIG. 5.6 has a similar structure.
以上の実施例は接続スプリング２ａや接続板２ｂの固定
端にスパイク７を設けた座金８を取り付けたものである
が、第４図に示すように、ごれらの接続スプリングや接
続板の固定端自体を座８ａにしてその取付孔５の周囲に
直接スバ・イク７を形成してもよいことは勿論である。In the above embodiment, a washer 8 with a spike 7 is attached to the fixed end of the connection spring 2a or the connection plate 2b, but as shown in FIG. Of course, it is also possible to use the end itself as a seat 8a and form the seat 7 directly around the mounting hole 5.
この場合、スパイク７が取付孔５に挿通されるタッピン
グネジ３の締着力によって確実に樹脂カバー内に刺入さ
れるよう、取付孔５とスパイク７とは隣接させて設ける
。なお、以上説明した実施例は、導電性樹脂製の上カバ
ーと下カバーの嵌合部の構造に本発明の構造を採用した
場合の例であるが、第１図に示す構造からも明らかなよ
うに、導電性樹脂カバー１にアースケーブルを接続する
部分の構造、あるいは導電性樹脂カバー１内に収納され
る電子装置と当該カバーとを接続する部分の構造として
用いることができることは言うまでもない。In this case, the attachment hole 5 and the spike 7 are provided adjacent to each other so that the spike 7 is reliably inserted into the resin cover by the tightening force of the tapping screw 3 inserted into the attachment hole 5. The embodiment described above is an example in which the structure of the present invention is adopted for the structure of the fitting part of the upper cover and lower cover made of conductive resin, but it is clear from the structure shown in FIG. As such, it goes without saying that it can be used as a structure for connecting a ground cable to the conductive resin cover 1 or a structure for connecting an electronic device housed within the conductive resin cover 1 and the cover.
（発明の効果）
以上説明したこの発明の構造によれば、導電フィラーを
混入した樹脂で成形された筐体カバーと外部との電気的
な導通を確実に取ることができ、かつその接続部分に金
属チップなどをモールドする必要がないので、成形品の
成形作業が容易になると共に、その生産性を高めること
が可能であり、またフレームグランド°用接続片の装着
もタッピングネジで該接続片を成形品に締結するだけで
達成されるので、筐体カバーの製造に余分な工程が必要
になることもない。さらに接続片と樹脂カバー内部の導
電フィラーとの接触がタッピングネジの螺条と接続片の
固定端に形成したスパイクとの両者によって行われるの
で、より確実なフレームグランドを行うことができる。(Effects of the Invention) According to the structure of the present invention described above, it is possible to securely establish electrical continuity between the housing cover molded from resin mixed with a conductive filler and the outside, and to connect the connecting portion. Since there is no need to mold metal chips, etc., the molding process becomes easier and productivity can be increased.Furthermore, the connection piece for the frame ground can be attached using a tapping screw. This can be achieved by simply fastening it to the molded product, so no extra steps are required to manufacture the housing cover. Furthermore, since contact between the connecting piece and the conductive filler inside the resin cover is made by both the thread of the tapping screw and the spike formed at the fixed end of the connecting piece, more reliable frame grounding can be achieved.
第１図および第２図はこの発明の一実施例を示す図で、
第１図は要部の断面図、第２図は座に形成したスパイク
を示す斜視図である。第３図は座の他の形態を示す斜視
図、第４図はスパイクを接続片の基部に直接形成したも
のの斜視図である。
第５図はこの発明の構造を備えた電子装置の筐体カバー
の一例を示す断面図、第６図はその要部の斜視図である
。
図中、
Ｈ１ａ，１ｂ） ：樹脂カバ２（２ａ、２ｂ） ：接続
片３：クツピングネジ ５：取付孔FIG. 1 and FIG. 2 are diagrams showing one embodiment of this invention,
FIG. 1 is a sectional view of the main part, and FIG. 2 is a perspective view showing spikes formed on the seat. FIG. 3 is a perspective view showing another form of the seat, and FIG. 4 is a perspective view of one in which spikes are formed directly on the base of the connecting piece. FIG. 5 is a sectional view showing an example of a housing cover of an electronic device having the structure of the present invention, and FIG. 6 is a perspective view of the main parts thereof. In the figure, H1a, 1b): Resin cover 2 (2a, 2b): Connection piece 3: Clipping screw 5: Mounting hole
Claims (1)
透孔（５，６）とこれに隣接するスパイク（７）とを備
えた座（８，８ａ）を設け、前記透孔（５，６）に挿通
したタッピングネジ（３）を導電性樹脂カバー（１ａ，
１ｂ）に螺入し、その締結力によって前記スパイク（７
）を導電性樹脂カバー（１ａ，１ｂ）に刺入したことを
特徴とする、導電性樹脂カバーのフレームグランド構造
。A seat (8, 8a) having a through hole (5, 6) and a spike (7) adjacent thereto is provided at the fixed end of the frame ground connecting piece (2a, 2b). ) into the conductive resin cover (1a,
1b), and the tightening force causes the spike (7
) is inserted into the conductive resin cover (1a, 1b).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP927090A JPH03212995A (en) | 1990-01-17 | 1990-01-17 | Frame ground structure of conductive resin cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP927090A JPH03212995A (en) | 1990-01-17 | 1990-01-17 | Frame ground structure of conductive resin cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03212995A true JPH03212995A (en) | 1991-09-18 |
Family
ID=11715763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP927090A Pending JPH03212995A (en) | 1990-01-17 | 1990-01-17 | Frame ground structure of conductive resin cover |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03212995A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002057483A (en) * | 2000-05-16 | 2002-02-22 | Heidelberger Druckmas Ag | Shielded electrically-equipping cabinet casing |
| JP2006103662A (en) * | 2004-09-09 | 2006-04-20 | Calsonic Kansei Corp | Attaching structure of electronic apparatus for vehicle |
| WO2021157687A1 (en) * | 2020-02-05 | 2021-08-12 | 三菱電機株式会社 | Equipment housing, image reading device, and electrostatic capacitance detecting device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63217698A (en) * | 1987-03-06 | 1988-09-09 | 株式会社日立製作所 | Shielding structure of electronic equipment |
-
1990
- 1990-01-17 JP JP927090A patent/JPH03212995A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63217698A (en) * | 1987-03-06 | 1988-09-09 | 株式会社日立製作所 | Shielding structure of electronic equipment |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002057483A (en) * | 2000-05-16 | 2002-02-22 | Heidelberger Druckmas Ag | Shielded electrically-equipping cabinet casing |
| JP2006103662A (en) * | 2004-09-09 | 2006-04-20 | Calsonic Kansei Corp | Attaching structure of electronic apparatus for vehicle |
| JP4713213B2 (en) * | 2004-09-09 | 2011-06-29 | カルソニックカンセイ株式会社 | Mounting structure for vehicle electronics |
| WO2021157687A1 (en) * | 2020-02-05 | 2021-08-12 | 三菱電機株式会社 | Equipment housing, image reading device, and electrostatic capacitance detecting device |
| CN115066989A (en) * | 2020-02-05 | 2022-09-16 | 三菱电机株式会社 | Device case, image reading apparatus, and electrostatic capacitance detection apparatus |
| CN115066989B (en) * | 2020-02-05 | 2023-12-08 | 三菱电机株式会社 | Device case, image reading apparatus, and electrostatic capacitance detection apparatus |
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